KUU-KWNM4002
| Part # | KUU-KWNM4002 |
| Download | KUU-KWNM4002 |
KWNM4002
150mW SOT-523 SURFACE MOUNT
Plastic Package
N-Channel MOSFET
3
Absolute Maximum Ratings
T
A
= 25°C unless otherwise noted
Symbol
Parameter
Value
Units
2
V
DS
V
GS
I
D
Drain-Source Voltage
30
±
20V
100
V
V
1. Gate
2. Source
3. Drain
Continuous Gate-Source Voltage
Continuous Drain Current
1
mA
mW
°C /W
°C
SOT-523
P
D
Power Dissipation
150
Thermal Resistance from Junction to Ambient
Storage Temperature Range
Operating Junction Temperature
833
R
θ
JA
T
STG
T
J
-55 to +150
+150
°C
These ratings are limiting values above which the serviceability of the device may be impaired.
Specification Features:
Electrical Symbol:
Device Marking Code:
Low On-resistance
Fast Switching Speed
Low Voltage Drive Makes This Device
Ideal for Portable Equipment
KN
Easily Designed Drive Circuits
Easy to Parallel
RoHS Compliant & Green EMC
Matte Tin(Sn) Lead Finish
Weight: approx. 0.002g
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KWNM4002
Electrical Characteristics
(T
A
= 25°C unless otherwise noted)
Off Characteristics
Limits
Typ
Symbol
Parameter
Test Condition
Unit
Max
Min
BV
DSS
I
GSS
Drain-Source Breakdown Voltage
Gate-Body Leakage
V
GS
=0V, I
D
=10uA
30
Volts
uA
µA
V
DS
=0V, V
GS
=±
20V
±
1
I
DSS
Zero Gate Voltage Drain Current
1
V
DS
=30V, V
GS
=
0V
On Characteristics
Symbol
Limits
Typ
Parameter
Test Condition
Unit
Min
Max
V
th(GS)
R
DS(on)
Gate-Threshold Voltage
V
DS
= 3V, I
D
=100uA
0.8
1.5
Volts
Drain-Source On-Resistance
V
GS
=4V, I
D
=10mA
8
Ω
V
GS
=2.5V, I
D
=1mA
V
DS
=3V, I
D
=10mA
13
Ω
g
fs
Forward Trans Conductance
20
ms
V
SD
Drain-Source Diode Forward Voltage
1.2
V
I
S
=115mA, V
GS
=
0V
Dynamic Characteristics
Symbol
Limits
Typ
Parameter
Test Condition
Unit
Min
Max
Ciss
Coss
Crss
Input Capacitance
13
9
pF
pF
pF
V
DS
= 5V
V
GS
= 0V
f = 1.0MHz
Output Capacitance
Reverse Transfer Capacitance
4
Switching Characteristics
Limits
Typ
Symbol
Parameter
Test Condition
Unit
Min
Max
t
D(on)
t
D(off)
V
DD
=5V, R
L
=500
Ω
,
I
D
=10mA, V
Gs
=5V,
R
G
= 10
Ω
Turn-on Time
Turn-off Time
15
80
nS
nS
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KWNM4002
SOT-523 Package Outline
MILLIMETERS
MIN
INCHES
DIM
MAX
0.90
0.10
0.80
0.25
0.35
0.20
1.70
0.90
1.75
MIN
MAX
0.035
0.004
0.031
0.010
0.014
0.008
0.067
0.035
0.069
A
A1
A2
b1
b2
c
0.70
0.00
0.70
0.15
0.25
0.10
1.50
0.70
1.45
0.028
0.000
0.028
0.006
0.010
0.004
0.059
0.028
0.057
D
E
E1
e
0.50 TYP.
0.020 TYP.
Typical Soldering Pattern:
e1
L
0.90
1.10
0.035
0.043
0.40 REF.
0.016 REF.
L1
θ
0.10
0
O
0.30
8
O
0.004
0
O
0.012
8
O
NOTES:
1. Above package outline conforms to JEITA EAIJ ED-7500A SC-75A.
2. Dimensions are exclusive of Burrs, Mold Flash & Tie Bar extrusions.
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