Kyocera-AVX-DP03A2450TTR
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TM
Multilayer Organic (MLO
)
0603 WLAN/BT Diplexer
TM
MLO TECHNOLOGY
APPLICATIONS
The 0603 diplexer is a best in class low profile
Multiband applications including
WiFi, WiMax, GPS, and cellular
bands
multilayer organic passive device that is based
on AVX
’
s
p
atented multilayer organic high density
interconnect technolog
y
.
T
he MLO™ diplexer
uses high dielectric constant and low loss
materials to realize high Q passive printed
elements such as inductors, and capacitors in a
multilayer stack up. The MLO™ diplexers can
support multiple wireless standards such as
WCDMA, CDMA, WLAN, GSM, and B
T
.
T
hese
diplexers are less than 0.5mm in height and are
ideally suited for band switching for dual band
systems. All diplexers are expansion matched to
printed circuit boards thereby resulting in
improved reliability vs. ceramic and Si
components.
LAND GRID ARRAY
ADVANTAGES
• Inherent
Low Profile
• Excellent
Solderability
• Low
Parasitics
• High
Heat Dissipation
HOW TO ORDER
COMPONENT DIMENSIONS AND FUNCTIONS
Bottom View
Side View
DP 03
A
2450
T
TR
(0
0.23 0.ꢀ0
(
0
.009 0.00ꢁ4
0.30 0.ꢀ0
.0ꢀ2 0.00ꢁ4
0.88 0.20
T
y
pe
Size
Design
Frequency
(MHz)
Finish
7 = Au
T = NiSn
Packaging
T
a
pe & Reel
(0.035 0.0084
0.ꢁ6 0.ꢀ0
(0.0ꢀ8 0.00ꢁ4
0.06 0.ꢀ0
(0.002 0.00ꢁ4
0.6ꢀ 0.05
(0.02ꢁ 0.0024
0.ꢀ5 0.02
0.ꢁ5 0.ꢀ0
QUALITY INSPECTION
Finished parts are 100% tested for electrical parameters
and visual characteristics.
0.5ꢀ 0.05
(0.006 0.00ꢀ4
(0.0ꢀ8 0.00ꢁ4
(0.020 0.0024
0.ꢁ5 0.ꢀ0
(0.0ꢀ8 0.00ꢁ4
ꢀ.65 0.20
(0.065 0.0084
Unit: mm (inches)
T
e
rminal No.
T
e
rminal Name
High Frequency Port
GND
Low Frequency Port
GND
OPERATING TEMPERATURE
-40ºC to +85ºC
1
2
3
4
5
6
TERMINATION
Common
GND
Finishes available in Ni Au, Ni Sn and OSP coatings
which are compatible with automatic soldering
technologies which include reflow, wave soldering, vapor
phase and manual.
PART NUMBER: DP03A2450TTR
Electrical Characteristics @ 25ºC
ORIENTATION IN TAPE
No. Parameter
Freq. (MHz)
2400-2496
4900-5950
500-2700
10300-11900
4800-4992
4900-5950
7200-7500
500-2700
5150-5950
2400-2500
4900-5950
2400-2500
4900-5950
Port
Low
High
High
High
Low
Low
Low
Low-High
Low-High
Ant
Ant
Low
Specification
0.40 max
0.85 max
25 min
8 min
25 min
25 min
25 min
25 min
22 min
Typ. value
Unit
dB
dB
dB
dB
dB
dB
dB
dB
dB
–
1
2
0.35
0.80
30
10
28
27
30
30
25
1.5
1.3
1.5
1.3
Insertion
Loss
T
o
p View
3
4
6
7
8
9
10
11
12
13
14
Attenuation
Attenuation
Isolation
1
2
3
6
5
4
1
2
3
6
5
4
1
2
3
6
5
4
VSWR
VSWR
VSWR
VSWR
2.0 max
2.0 max
2.0 max
2.0 max
–
–
–
High
POWER CAPACITY
4.5W Maximum
Mechanical Characteristics @ 25ºC
Size [mm(inches)]
Height [mm(inches)]
Volume (mm^3)
1.65 x 0.88 (0.065 x 0.035)
0.42 (0.017)
0.77
1
TM
Multilayer Organic (MLO
)
0603 WLAN/BT Diplexer
S PARAMETER MEASUREMENTS
LOW BAND PORT ATTENUATION
HIGH BAND ATTENUATION
Low Band Attenuation
High Band Attenuation
Frequency (GHz)
4.800
Attenuation (dB)
36.441
Frequency (GHz)
2.400
Attenuation (dB)
36.829
5.000
44.044
2.500
39.116
7.200
32.638
10.30
10.573
7.500
38.299
12.00
35.929
9.600
24.064
10.00
26.152
LOW BAND INSERTION LOSS
HIGH BAND INSERTION LOSS
Low Band Insertion Loss
High Band Insertion Loss
Frequency (GHz)
Insertion Loss (dB)
Frequency (GHz)
Insertion Loss (dB)
2.400
0.338
5.150
0.760
2.500
0.374
5.950
0.651
2
TM
Multilayer Organic (MLO
)
0603 WLAN/BT Diplexer
S PARAMETER MEASUREMENTS
COMMON PORT RETURN LOSS
ISOLATION
Common Return Loss
Isolation
Frequency (GHz)
Return Loss (dB)
VSWR
1.160
1.193
1.206
1.244
Frequency (GHz)
Attenuation (dB)
2.400
2.500
5.150
5.950
22.592
21.127
20.578
19.279
2.400
2.500
5.150
5.950
38.031
41.305
32.861
27.052
LOW BAND RETURN LOSS
HIGH BAND RETURN LOSS
Low Band Return Loss
High Band Return Loss
Frequency (GHz)
Return Loss (dB)
VSWR
1.111
1.138
Frequency (GHz)
Return Loss (dB)
VSWR
1.278
1.241
2.400
25.568
5.150
18.278
2.500
23.775
5.950
19.376
3
TM
Multilayer Organic (MLO
)
0805 WLAN/BT Diplexer
AUTOMATED SMT ASSEMB
L
Y
The following section describes the guidelines for automated
SMT assembly of MLO
TM
RF devices which are typically Land
Grid Array (LGA) packages or side termination SMT pacages.
Stencil thickness and aperture openings should be adjusted
according to the optimal solder volume. The following are
general recommendations for SMT mounting of MLO
TM
devices onto the PCB.
Control of solder and solder paste volume is critical for
surface mount assembly of MLO
TM
RF devices onto the PCB.
SMT REFLOW PROFILE
Common IR or convection reflow SMT processes shall be
used for the assembl
y
.
S
tandard SMT reflow profiles, for
eutectic and Pb free solders, can be used to surface mount
the MLO
TM
devices onto the PCB. In all cases, a temperature
gradient of 3°C/sec, or less, should be maintained to prevent
warpage of the package and to ensure that all joints reflow
properly. Additional soak time and slower preheating time
may be required to improve the out-gassing of solder paste.
In addition, the reflow profile depends on the PCB density
and the type of solder paste used. Standard no-clean solder
paste is generally recommended. If another type of flux is
used, complete removal of flux residual may be necessar
y
.
Example of a typical lead free reflow profile is shown below.
tp
Tp
Critical Zone
T
L
to Tp
Ramp-up
T
L
t
L
Ts
m
ax
Ts
m
in
Ramp-down
ts
Preheat
25
t 25ºC to Peak
Time
Figure A.
T
y
pical Lead Free Profile and Parameters
Profile Parameter
Pb free, Convection, IR/Convection
3ºC/second max.
150ºC to 200ºC
Ramp-up rate (
T
s
max to Tp
Preheat temperature (
T
s
m
in to
T
s
m
ax)
Preheat time (ts)
Time above T
L
, 217ºC (t
L
)
Peak temperature (Tp)
60 – 180 seconds
60 – 120 seconds
260°C
Time within 5ºC of peak temperature (tp)
Ramp-down rate
Time 25ºC to peak temperature
10 – 20 seconds
4ºC/second max.
6 minutes max.
4
