Laird-Signal-Laird-Tech-21164171
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Eccosorb® BSR / MFS
High Loss, Magnetically Loaded, Elastomeric Microwave Absorber
HIGH-LOSS ELASTOMERIC ABSORBER
Eccosorb BSR / MFS is a thin, flexible, high-loss, electrically non-conductive silicone absorber.
It is designed for the frequency range from 6 GHz to 18 Ghz and above . It has low outgassing
properties and high temperature resistance.
BSR / MFS is flexible and can be fitted to
compound curves.
BSR and MFS refer to the same product where BSR-1 is MFS-124 and
BSR-2 is MFS-117.
FEATURES AND BENEFITS
Flexible structure for improved fit
High thermal stability
Electrically non-conductive
High magnetic loss
MARKETS
Mobile / Data Infrastructure
Security and Defense
Automotive Electronics
Industrial Electronics
Space
Low outgassing
Good adhesion to metals
VALUE
Simplified design due to mechanical and electrical properties
Environmentally friendly solution meeting regulatory requirements of RoHS and REACH
Improved reliability performance of electronics
o
o
o
Better signal integrity due to high reduction of EMI
Consistent electronics performance due to low outgassing properties
Reliable mechanical attachment
TYPICAL PROPERTIES
Frequency Range (GHz)
Service Temperature °C
Flame Rating
TYPICAL DATA
6 – 35
–
40 +170
UL 94 V-0
> 70
Hardness (Shore A)
Density (g/cc)
4.2
Elongation (%)
50
Tensile Strength (MPa)
Volume Resistivity (ohm-cm)
Thermal Expansion (per °C)
Thermal Conductivity (W/mK)
Water Absorption (% 24 hours)
Dielectric Strength (v/mil)
Outgassing (%TML) (%CVCM)*
5.0
2 x 1
0
9
63 x 10
-6
0.865
< 0.1
> 10
0.47 / 0.28
Data for design engineer guidance only. Observed performance varies in application.
Engineers are reminded to test the material in application.
*
Outgassing data per ASTM E595-07; criteria for acceptability is 1.00% TML and 0.10%
CVCM.
APPLICATIONS
Eccosorb BSR/MFS is engineered to reduce or eliminate surface currents, cavity
resonance, coupling, and generally dampen reflections. It will significantly improve the
operation of microwave devices by lowering the Q of cavities.
USA: +1.866.928.8181
Europe: +49.8031.24600
Asia: +86.755.2714.1166
It can also be used terminations, loads, attenuators in microwave circuits, and in
waveguides and transmission systems.
Hybrid Thermal/EMI Absorber
Eccosorb BSR/MFS is recommended for use in high reliability aerospace, military, and
space applications, exhibiting excellent thermal cycling, shock and vibration absorption
characteristics.
Some other applications include power amplifiers, oscillators and down/up converters.
AVAILABILITY
Standard sheets are 305 x 305mm (12”x12”).
Standard thicknesses are 0.25mm (0.010”),0.32mm (1/8”),0.50mm (0.020”),
0.64mm(1/4”),1.0mm (0.040”), 1.27 mm (1/2”),1.5mm (0.060”) and 2.54mm (0.100”)
It can be supplied with or without pressure sensitive adhesive (PSA).
Available in other thicknesses, sizes, and customer specified shapes upon request.
INSTRUCTIONS FOR USE
This material is designed to function directly in front of a metallic surface.
For applications where the service temperature exceeds 121°C (250°F), the material can
be bonded to most substrates by using an RTV silicone based adhesive in conjunction with
a suitable primer.
This material can be readily cut with a sharp knife and template.
It is a very flexible
material and conforms to contoured surfaces.
USA: +1.866.928.8181
Europe: +49.8031.24600
Asia: +86.755.2714.1166
RFP-DS-BSR MFS 092221
A
ny information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end
user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or
consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2015 Laird Technologies,
Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third
parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
