Laird-Signal-Laird-Tech-27095381
| Part # | Laird-Signal-Laird-Tech-27095381 |
Download  | Laird-Signal-Laird-Tech-27095381 |
Eccostock®HIK500F
High Temperature, Low Loss, Adjusted Dielectric
Constant Stock
HIGH TEMPERATURE ADJUSTED DIELECTRIC CONSTANT STOCK
Eccostock HiK500F is a series of low loss plastic material with adjusted dielectric constants up to
30. When subjected to high temperatures, the surface will darken. This however has no adverse
effect. Eccostock HiK500F offers low moisture absorption and low outgassing properties for
space applications.
FEATURES AND BENEFITS
MARKETS
•
Low loss
•
Commercial Telecom
•
Security and Defense
•
Adjusted dielectric constant
•
High temperature resistance
SPECIFICATIONS
TYPICAL PROPERTIES
ECCOSTOCK HIK500F
-56 to 204 (-69 to 400)
2.2
Temperature Range °C (°F)
Density g/cc
Dielectric Strength, volts/mil
Dielectric Constant Accuracy K<16 (K>16)
Dissipation Factor, 1 to 10 GHz
Volume Resistivity, ohm-cm
Flexural Strength, psi (kg/cm
2
)
Coefficient of Linear Expansion, °C
Izod Impact, kg-cm/cm(ft-lb/in of notch)
>300
±3% (±10%)
<0.002
>10
14
10,000 (703)
36 x 10
-6
1.65 (0.3)
Outgassing
0.47/0.041
(%TML) (%CVCM)*
Properties will vary to a degree with the dielectric constant.
Typical values for the middle of the dielectric
constant range are given above. Data for design engineer guidance only. Observed performance varies in
application. Engineers are reminded to test the material in application.
*
Outgassing data per ASTM E595-07; criteria for acceptability is 1.00% TML and 0.10% CVCM.
APPLICATIONS
•
Eccostock HiK500F is primarily used for reducing the overall size of a waveguide by increasing
the dielectric constant.
•
It can also be used in cavity tuning probes, patch antennas, dielectric lens antennas and
dielectric support pieces.
•
Since water absorption is low, Eccostock HiK500F can be used in outdoor applications.
Americas: +1.866.928.8181
Europe: +49.(0)8031.2460.0
Asia: +86.755.2714.1166
Eccostock® HIK500F
AVAILABILITY
•
Eccostock HiK500F is available in the following dielectric constants: 3, 4, 5, 6, 7, 8, 9, 10, 11,
12, 16, 20, 25 and 30
•
Sheets: 30.5cm x 30.5cm (12” x 12”)
in thicknesses of 0.64, 0.95, 1.27, 1.59, 1.91, 2.54, 3.81,
5.08, 6.35 & 7.62 cm (1/4, 3/8, 1/2, 5/8, 3/4, 1.0, 1.5, 2.0, 2.5 & 3.0”)
•
Rods: 30.5 cm (12”) long in diameters of
0.32, 0.64, 0.95, 1.27, 1.59, 1.91, 2.54, 3.81, 5.08,
6.35 & 7.62 cm (1/8, 1/4, 3/8, 1/2, 5/8, 3/4, 1.0, 1.5, 2.0, 2.5 & 3.0”)
•
Bars: 30.5cm (12”) long
in squares of 0.64, 0.95, 1.27, 1.59, 1.91, 2.54, 3.81 & 5.08 cm
(1/4, 3/8, 1/2, 5/8, 3/4, 1.0, 1.5 & 2.0”)
•
Other sizes, shapes, thicknesses, dielectrics and configurations are available on special order.
INSTRUCTIONS FOR USE
•
Eccostock HiK500F must be machined using diamond blades. Carbide tools are not
recommended and may break due to the hardness of the material. Water solution cooling
agents are also highly recommended.
RELATED PRODUCTS
•
Eccostock HiK500F can be bonded to itself using Eccostock® HiK Cement with its
corresponding dielectric constant.
RFP-DS-HIK500F 112515
A
ny information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird
Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any
kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2015 Laird Technologies, Inc. All Rights Reserved. Laird, Laird
Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license
under any Laird Technologies or any third party intellectual property rights.
