LanTu-Micro-SCM090605-251YT
| Part # | LanTu-Micro-SCM090605-251YT |
Download  | LanTu-Micro-SCM090605-251YT |
Common Mode Choke
SCM090605 Series Data and signal line
Common-Mode Chokes Coils
◆
特征：
Features:
●
适用大电流的片式共模滤波器
●
所有系列产品的形状均控制在最小限度
能够大幅抑制共模噪音
● Chip common mode filter for large current applications
●The shape of all series products is controlled to a
minimum which can greatly suppress common
mode noise
●
高额定电流，低背设计
●
绕线结构,环形铁芯
●
符合 RoHS
,
无卤和
REACH
◆
用途：
● High rated currents and low profile
● Winding type, ring core
● RoHS, Halogen Free and REACH Compliance
Applications:
●
数字通信设备
●
Digital
ommunication equipment
●
Data and signal line
●
数据和信号线
◆
环境：
Environmental Data:
● Operating Temperature: –
40
℃
t
+125
℃
(Including coils self-temperature rise)
Test Equipment
：
●
工作温度：-
0℃ 至+125℃
（
包括线圈自身温升）
◆
试验设备：
●
电感值
:HP4274A
或同等仪器
●
电流
:HP4284+42841A
或同等仪器
●
阻抗
:E4991+ HP16092
测试夹具
●
直流电阻
: Chroma 16502
或同等仪器
◆
产品型号：
● L:HP4284A or HP4285A LCR meter or equivalent
● Isat & Irms: HP4284+42841A or equivalent
● Impedance: E4991 analyzer with HP16092 test fixture
● DCR:C
roma 16502 or equivalent
Product Identification
：
SCM
090605
100
N
T
①
②
③
④
⑤
①
②
③
外形尺寸
(L×W×H) (mm)
External Dimensions (L×W×H)
(mm)
类型
Type
Inductance
贴片共模滤波器
10 uH
SCM
SMT Common Mo
e
Line Filter
090605
9.2×6.0×5.0
④
⑤
包装
Packing
公差
Inductance
T
olerance
B
T
散装
Bulk Package
编带
Tape & Re
J:±5%,K: ±10%, L: ±15%
M: ±
%,P: ±25%, N: ±30%,Y: ±50%
SHENZHEN LANTU MICRO EL
CTRIC TECHNOLOGY CO., LTD.
1
Common Mode Choke
◆
外观尺寸：
Shape and Dimensions(dimensions are in mm)
：
SCM090605 Series
Recommended
Land Pattern
A
B
C
D
E
F
G
H
a
b
d
9.2±0.3 6.0±0.3 5.0±0.2 2.0
ref 2.54±0.2 5.7
ref 1.4
ref 1.0±0.1
9.6 2.54 2.0
1.2
◆
规格特性：
Specifications
：
●
SCM090605 Series Electrical Characteristics (Electrical specifications at 25
℃
)
Inductance
Tole
Impedance
DCR
Rated
Current
(A)
VDC
Common Mode
Rated
(V)
Part No
Ω
Ω
( )
L(μH)
‘@0A
1
Test
Freq
(
)
Test
Freq
Max
920
Max
0.08
0.12
0.25
0.16
0.13
0.15
0.31
0.42
0.75
0.95
Max
Typ
80
±30%
±30%
±30%
±30%
±50%
±50%
±50%
±50%
±50%
±50%
100KHz
100MHz
1.6
SCM090605-100
SCM090605-250
SCM090605-400
SCM090605-
10
SCM090605-251
SCM090605-501
SCM090605-102
SCM090605-202
SCM090605-472
SCM090605-652
25
40
100KHz
100KHz
100KHz
100KHz
100KHz
100KHz
100KHz
100KHz
10KHz
2800
3100
5500
1800
3300
6000
9200
20000
18400
20MHz
20MHz
20MHz
10MHz
20MHz
10MHz
10MHz
2MHz
1.0
0.9
1.0
1.2
1.0
0.8
0.6
0.5
0.4
80
80
80
80
80
80
80
80
80
51
250
500
1000
2000
4700
6500
2MHz
● Rated Current: the actual value of DC current when the temperature rise isΔT 40
℃
(
T
a=25
℃
)
● Hi-Pot
T
est: 500VAC ,60Hz,3mA, 3Sec
● Circuit:
T
est Mode:
SHENZHEN LANTU MICRO EL
CTRIC TECHNOLOGY CO., LTD.
2
Common Mode Choke
●
Reel dimensions
(mm)
●
Tape Dimension
(mm)
● Cover tape peel off condition
ion
Reel Dimensions
REEL
(PCS)
1000
Inside
Box(PCS)
3000
Outside
Carton(PCS)
12,000
W1
A
B
C
D
16.4
60
13
330
S
7.5
a) Cover tape peel force shall be 10 to 120g
b) Noodle strip peeling angle16
°to 180°
● Packing quantity
Outside Carton
Inside Box
REEL
PE 袋
不足整箱用内盒或填充物装满
SHENZHEN LANTU MICRO EL
CTRIC TECHNOLOGY CO., LTD.
5
Common Mode Choke
◆
可靠性测试：
Reliability Testing
：
Items
Requirements
Test Methods and Remarks
1. P
ing test:
Solder the inductor to the testing ji
sing leadfree
solder. Then apply a force in the
Define: A: sectional area of terminal
A
≦
8mm2 force
≧
5N time:30sec
8mm2<A
≦
20mm2 force
≧
10N time: 10sec
20mm2<A force
≧
20N time: 10sec
2.Solder paste thicknes
0.12mm
3.Meet the above requirements without any
loose terminal
Terminal Strength
Reference docu
ments: GB/T
Keep time: 10±1s Speed: 1.0mm/s.
2423.60-2008
端子強度
(SMT)
1.Terminal diameter(d) mm 0.35
＜
d
≤
0.50Applied force:5N Duration:
10sec2.Terminal diameter(d) mm0.50
＜
d
≤
0.80Applied force:10N Duration:
10sec3.Terminal diameter(d) mm0.80
＜
d
≤
1.25Applied force:20N Duration:
10sec4.Terminal diameter(d)
mD
＞
1.25Applied force:40N Duration:
10sec5.Meet the above
equirements
without any loose terminal.
Pull Force:the force shall be applied gradually to
the terminal and thenmaintained for 10 seconds.
erminal Strength
Reference docu
ments: GB/T
2423.60-2008
端子強度
(DIP)
1.No visible mechanical damage.
1.Solder the inductor to the test jig (glass epoxy
boar
2.shown in Using a leadfree solder. Then apply a
force in the direction shown
3.Flexure: 2mm.
Resistance to Flexure
JIS C 5321:1997
抗弯曲性试验
4.Pressurizing Speed: 0.5mm/sec.
5.Keep time: 30 sec.
Dropping
1.No case deformation or change
1.Drop the packaged products from 1m high in 1
angle, 3 ridges and 6surfaces, twice
each
direction.
Reference documents:
inapp
arance.
GB/T 2423.7-2018
2.No short and no open.
落下試驗
1.No visible mechanical damage.
1.Solder temperture:240
±
2
℃
2.Duration: 3 sec.
Solderability
2.Wetting shall exceed 75% coverage for
Referenc
ocuments:
GB/T 2423.28-2005
可焊性试验
3. Solder: Sn/3.0Ag/0.5Cu.
3.
T
erminals must have 95% minimum solder
coverage
4.Flux: 25% Resin and 75% ethanol in weight
SHENZHEN LANTU MICRO EL
CTRIC TECHNOLOGY CO., LTD.
6
Common Mode Choke
Items
Requirements
Test Methods and Remarks
1.No visible mechanical damage.
2. In
uctance change: Within ±10%.
3.Q factor change: Within ±20%.
1.Solder the inductor to the testing jig (glass epoxy
boardshown in ) using leadfree sol
.
2.The inductor shall be subjected to a simple
harmonic motion having total amplitude of 1.5mm,
the frequency being var
eduniformly between the
approximate limits of 10 and 55 Hz.
Vibration
3.The frequency
ange from 10 to 55 Hz and
return to 10 Hz shallbe traversed in approximately
1 minute. This motion shall be applied for a period
of 2 hours in each 3mutually perpendicula
directions(total of 6 hours).
Reference documents:
GB/T 2423.10-2019
振動試验
1.No visible mechanical damage.
1.Start at ( 85~125
℃
) for T time, rush to
2. Inductance change: Within ±10%.(Mn-Zn: (-55~40
℃
) for T time as one cycle, go through100
Within
≦
30% )
cycles.
3.Q factor change: Within ±20%.
2.Transforming interval: Max. 20 sec.
3.
T
ested cycle: 100 cycles.
4.The chip shall be stabilized at normal condition
for 1~2 hours
Thermal Shock
Reference documents:
GB/T 2423.22-2012
Method Na
冷热冲击试验
1.No visible mechanical damage.
1.
T
emperature:M(-55~-40
±
2
℃
)
2.Duration: 96±2 hours
2. In
tance change: Within ±10%.(Mn-Zn:
Low temperature Storage
Within
≦
30% )
3.The chip shall be stabilized at normal condition for
1~2 hoursbefore measuring.
Reference documents:
GB/T 2423.1-2008
Method Ab
3.Q factor change: Within ±20%.
低温储存试验
SHENZHEN LANTU MICRO EL
CTRIC TECHNOLOGY CO., LTD.
7
Common Mode Choke
Items
Requirements
Test Methods and Remarks
1.No visible mechanical damage.
1.Temperature:N(125~85
±
2
℃
).
2. In
uctance change: Within ±10%.(Mn-
2.Duration: 96±2 hours
High temperature
Storage
Within
≦
30% )
3.The chip shall be stabilized at normal condition
3.Q factor change: Within ±20%.
for 1~2 hoursbefore measuring.
Reference documents:
GB/T 2423.2-2008
Method Bb
高温储存试验
1.No visible mechanical damage.
1.Temperature: 60
±
2
℃
2. Inductance change: Within ±10%.(Mn-Zn: 2.Humidity: 90% to 95% RH.
Damp Heat
Wit
≦
30% )
3.Duration: 96±2 hours.
(Steady States)
Reference documents:
GB/T 2423.3-2016
恒定湿热试验
3.Q factor change: Within ±20%.
4.The chip shall be stabilized at normal condition
for 1~2 hoursbefore measuring.
1.No significant defects in appearance.
2.
Δ
L/L
≦
1
% (Mn-Zn:
Δ
L/L
≦
30% )
3.
Δ
Q/Q
≦
30%
（
SMD series only
）
4.
Δ
DCR/DCR
≦
10%
Heat endurance of
Reflow soldering
1.Refer to the above reflow curve and go through
the
flow for twice.
2.The peak temperature : 260+0/-5
℃
Reference documents:
GJB 360B-2009
回流焊耐热性试验
No case deformation or change in
To dip parts into IPA solvent for 5±0.5Min,then
drying them at room temp for 5Min,at last ,to
brushing making 10 times.
Resistance to solvent
test
appearance or obliteration of marking
Referenc
ocuments:
IEC 68-2-45:1993
耐溶剂性试验
1.During the test no smoke, no peculiar,
smell, no fire
Overload test
Reference documents:
JIS C5311-6.13
过负荷试验
Apply twice as rated current for 5 minutes.
2.Th
haracteristic is normal after test
1.During the test no breakdown
voltage resistance test
Reference documents:
MIL-STD-202G Method
301
2.The characteristic is normal after test
1. For parts with two coi
s
2. DC1000V, Current: 1mA, Time: 1Min.
3. Refer to catalogue of specific products
绝缘耐压测试
SHENZHEN LANTU MICRO EL
CTRIC TECHNOLOGY CO., LTD.
8
Common Mode Choke
◆
推荐回流焊温度曲线
Recommended reflow soldering curve
：
The recommended reflow conditions as above graph, is set according to our soldering
equipment. DUE to var
us manufactures may have differen
reflow soldering equipment,
products, process conditions, set methods. And so on, when setting the reflow conditions,
Please adjust and confirm according to users’ environment/equipment.
SHENZHEN LANTU MICRO EL
CTRIC TECHNOLOGY CO., LTD.
9
Common Mode Choke
使用注意事项
REMINDERS FOR USING THESE PRODUCTS
●
保存时间为
12
个月以内，保存条件（温度
5~40°C
以下、湿度
35
～
66%RH
以下），需充分注意。
若超过保存时间，端子电极的可焊性将可能老化。
The storage period is within 12 months. Be sure to follow the storage conditions (temperature: 5~40°C,
humidity: 35 to 65% RH or less). If the storage period elapses, the soldering of the terminal electrodes may
deteriorate
。
●
请勿在气体腐蚀环境（盐、酸、碱等）下使用和保存。
Do no
se or store in locations where ther
are conditions such as gas corrosio
(salt, acid, alkali, etc.).
●
手上的油脂会导致可焊性降低，应避免用手直接接触端子。
Don’t touch electrodes directly with bare hands as oil secretions may inhibit soldering Always ensure
optimum conditions for soldering
。
●
请小心轻拿轻放
,
避免由于产品的跌落或取出不当而导致的损坏。
Please always handle pr
ucts carefully to prevent any dama
e caused bydropping down or inap
opriate
removing
。
●
端子过度弯曲会导致断线
,
请不要过度弯曲端子。
Don’t bend the terminals with excessive stress in
ase of any wire fracture
。
●
不要清洗产品
,
如需要清洗时请联系我司。
Don’t rinse coils by yourself and please contact SXN if necessary
。
●
请勿将本产品靠近磁铁或带有磁力的物体
Don’t expose the products to magnets or magnetic fields
●
在实施焊接前，请务必进行预热。预热温度与焊接温度及芯片温度的温度差要在
150°C
以内。
Before soldering, be sure
o preheat components. The prehea
ng temperature should be set so th
t the
temperature difference between the solder temperature and chip temperature does not exceed 150°C.
●
安装后的焊接修正应在规格书规定的条件范围内。若加热过度可能导致短路、性能降低、寿命减少。
Soldering corrections after mounting should be within the range of the conditions determined in the
specifications. If overheated, a short circuit, performance deterioration, or lifediv shortening may occur.
●
装置会
通电而自我发热（温度上升），因
在热设计方面需留有充分余地。
Self heating (temperature increase) occurs when the power is turned ON, so the tolerance should be
sufficient for the set thermal design.
●
非磁屏蔽型在基板设计时需注意配置线圈，受到电磁干扰可能会导致误动作。
Carefully lay out the coil for the circuit board design of the non-magnetic shield type. A malfunction may
occur due to magnetic interference.
SHENZHEN LANTU MICRO EL
CTRIC TECHNOLOGY CO., LTD.
10
