LanTu-Micro-SCM7060-272T
| Part # | LanTu-Micro-SCM7060-272T |
Download  | LanTu-Micro-SCM7060-272T |
Common Mode Choke
SCM7060 Series Common Mode Line Filter
LT-
蓝图
Features:
◆
特征：
●
适用大电流的片式共模滤波器
●
所有系列产品的形状均控制在最小限度
同时共模阻抗超过了
70Ω~3000Ω(100MHz
时
)
能够大幅抑制共模噪音
● Chip common mode filter for large current applications
●The shape of all series products is controlled to a
minimum and the common mode impedance exceeds
70Ω~3000Ω (at 100MHz), which can greatly suppress
common mode noise
●
产品的高度尺寸也被控制在较低水平
能够适应不断小型轻量化的便携
式设备的高密度化趋势
● Compatible with high-density portable devices, which
are
always being made smaller and lighter, because
the height has been reduced
●
符合 RoHS
,
无卤和
REACH
◆
用途：
● RoHS, Halogen Free and REACH Compliance
Applications:
●
用于应对电子设备的电源线噪音
（笔记本电,伺服器,电池,等）
●
适合车载大电流电路
●
Power line noise countermeasure for electronic
equipment (
Notebook, server applications, Battery
, etc.)
●
Best for high current circuit such as car
●
wireless charging and power device design
●
无线充电电源装置
◆
环境：
Environmental Data:
● Operating Temperature: -55
℃
to +125
℃
(Including coils self-temperature rise)
Test Equipment
：
●
工作温度：-40℃ 至+125℃
（
包括线圈自身温升）
◆
试验设备：
● Isa
t
& I
rm
s
:
H
P4284+42841A or equivalen
●
电流
:HP4284+42841A
或同等仪器
●
阻抗
:E4991+ HP16092
测试夹具或同等仪器
● Impedance: E4991 analyzer with HP16092 test fixture or
equivalen
●
直流电阻
: Chroma 16502
或同等仪器
● DCR:Chroma 16502 or equivalent
◆
产品型号：
Product Identification
：
SCM
7060
701
T
①
②
③
④
①
②
③
外形尺寸
(L×W×H) (mm)
类型
Type
Impedance
External Dimensions (L×W×H)
贴片共模滤波器
700 Ω
(mm)
SCM
SMD Common Mode
Line Filter
7060
7.0×6.0×3.0
④
包装
Packing
B
散装
Bulk Package
编带
Tape & Reel
T
SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
1
Common Mode Choke
◆
外观尺寸：
Shape and Dimensions(dimensions are in mm)
：
Schematic
Recommended
Land Pattern
I J
A
A1
B
C
D
E
F
G
H
P/N
Typ
T
y
p
±0.5
7.00
±0.5
±0.5
6.00
Max
3.80
Typ
Typ
1.50
Typ
Typ
5.00
Typ
1.50
SCM7060
7.50
3.50
1.70
8.00
3.00
◆
规格特性：
Specifications
：
●
SCM7060 Series Electrical Characteristics (Electrical specifications at 25
℃
)
Impedance
DC
Rated
Rated
Insulatio
@100
M
Hz
（ ）
Ω
Part Number
Resistance Current
Voltage Resistance
Marking
(mΩ) Max
5.0
(A) Max
15.00
9.00
(V) Max
125
(MΩ) Min
10M
Min
Typ
70
SCM7060-400T
SCM7060-101T
SCM7060-301T
SCM7060-501T
SCM7060-601T
SCM7060-701T
40
400
101
100
140
300
450
700
700
10.0
125
10M
10
M
10.0
225
5.00
125
301
275
10.0
15.0
15.0
17.0
21.0
63.0
75.0
5.00
4.00
4.00
3.00
2.50
1.00
0.90
125
10M
10M
10M
10M
10M
10M
10M
501
601
701
102
132
272
302
500
125
500
125
1020
SCM7060-102T
800
125
SCM7060-132T
SCM7060-272T
SCM7060-302T
910
1300
2700
3000
125
125
125
2000
2500
●
Rated Current
: the actual value of DC current when the temperature rise isΔT 40
℃
(
T
a=25
℃
).
●
Circuit: Test Mode
SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
2
Common Mode Choke
●
Tape Dimension
(mm)
Tape Dimension
W1
Reel Dimensions
REEL
(PCS)
1500
Inside
Outside
Part No.
W
P
A
B
C
D
Box(PCS)
Carton(PCS)
12.0
16.4
100
13
330
SCM7060
16.0
7.5
4500
18,000
● Cover tape peel off condition
a) Cover tape peel for
ce
s
h
a
ll b
e
10 to 120g
b) Noodle strip peeling angle165°to 180°
● Packing quantity
Outside Carton
不足整箱用内盒或填充物装满
REEL
PE 袋
Inside Box
SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
5
Common Mode Choke
◆
可靠性测试：
Reliability Testing
：
Items
Requirements
Test Methods and Remarks
1. Pulling test:
Solder the inductor to the testing jig using leadfree
Define: A: sectional area of terminal
A
≦
8mm2 force
≧
5N time:30sec
solder. Then apply a force in the
Terminal Strength
Reference docu
ments: GB/T
Keep time: 10±1s Speed: 1.0mm/s.
8mm2<A
≦
20mm2 force
≧
10N time: 10sec
20mm2<A force
≧
20N time: 10sec
2423.60-2008
2.Solder paste thickness:0.12mm
端子強度
(SMT)
3.Meet the above requirements without any
loose terminal
1.Terminal diameter(d) mm 0.35
＜
d
≤
0.50Applied force:5N Duration:
10sec2.Terminal diameter(d) mm0.50
＜
d
≤
Pull Force:the force shall be applied gradually to
the terminal and thenmaintained for 10 seconds.
erminal Strength
0.80Applied force:10N Duration:
Reference docu
10sec3.Terminal diameter(d) mm0.80
＜
d
≤
ments: GB/T
2423.60-2008
端子強度
(DIP)
1.25Applied force:20N Duration:
10sec4.Terminal diameter(d) mmD
＞
1.25Applied force:40N Duration:
10sec5.Meet the above requirements
without any loose terminal.
1.No visible mechanical damage.
1.Solder the inductor to the test jig (glass epoxy
board
2.shown in Using a leadfree solder. Then apply a
force in the direction shown
3.Flexure: 2mm.
Resistance to Flexure
4.Pressurizing Speed: 0.5mm/sec.
5.Keep time: 30 sec.
JIS C 5321:1997
抗弯曲性试验
Dropping
1.No case deformation or change
1.Drop the packaged products from 1m high in 1
Reference documents:
inappearance.
angle, 3 ridges and 6surfaces, t
w
ice
in
e
ac
h
GB/T 2423.7-2018
2.No short and no open.
direction.
落下試驗
1.No visible mechanical damage.
1.Solder temperture:240
±
2
℃
Solderability
2.Wetting shall exceed 75% coverage for
2.Duration: 3 sec.
Reference documents:
GB/
T
2
4
23.
28
–
2005
3. Solder: Sn/3.0Ag/0.5Cu.
3.
T
erminals must have 95% minimum solder
coverage
4.Flux: 25% Resin and 75% ethanol in weight
可焊性试验
SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
6
Common Mode Choke
Items
Requirements
Test Methods and Remarks
1.No visible mechanical damage.
1.Solder the inductor to the testing jig (glass epoxy
boardshown in ) using leadfree so
lde
r
.
2. Inductance change: Within ±10%.
3.Q factor change: Within ±20%.
2.The inductor shall be subjected to a simple
harmonic motion having total amplitude of 1.5mm,
the frequency being varieduniformly between the
approximate limits of 10 and 55 Hz.
Vibration
3.The frequency range from 10 to 55 Hz and
Reference documents:
GB/T 2423.10-2019
振動試验
return to 10 Hz shallbe traversed in approximately
1 minute. This motion shall be applied for a period
of 2 hours in each 3mutually perpendicular
directions(total of 6 hours).
1.Start at ( 85~125
℃
) for T time, rush to
1.No visible mechanical damage.
2. Inductance change: Within ±10%.(Mn-Zn: (-55~40
℃
) for T time as one cycle, go through100
Within
≦
30% )
cycles.
3.Q factor change: Within ±20%.
2.Transforming interval: Max. 20 sec.
3.
T
ested cycle: 100 cycles.
Thermal Shock
Reference documents:
GB/T 2423.22-2012
Method Na
4.The chip shall be stabilized at normal condition
for 1~2 hours
冷热冲击试验
1.No visible mechanical damage.
1.
T
emperature:M(-55~-40
±
2
℃
)
2.Duration: 96±2 hours
2. Inductance change: Within ±10%.(Mn-Zn
:
Low temperature Storage
Within
≦
30% )
3.The chip shall be stabilized at normal condition for
1~2 hoursbefore measuring.
Reference documents:
GB/T 2423.1-2008
Method Ab
3.Q factor change: Within ±20%.
低温储存试验
SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
7
Common Mode Choke
Items
Requirements
Test Methods and Remarks
1.No visible mechanical damage.
1.Temperature:N(125~85
±
2
℃
).
3.The chip shall be stabilized at normal condition
2. Inductance change: Within ±10%.(Mn
-Z
n
: 2
.
Du
ration: 96±2 hours
Within
≦
30% )
High temperature
Storage
3.Q factor change: Within ±20%.
for 1~2 hoursbefore measuring.
Reference documents:
GB/T 2423.2-2008
Method Bb
高温储存试验
1.No visible mechanical damage.
1.Temperature: 60
±
2
℃
2. Inductance change: Within ±10%.(Mn-Zn: 2.Humidity: 90% to 95% RH.
Within
≦
30% )
3.Duration: 96±2 hours.
Damp Heat
(Steady States)
3.Q factor change: Within ±20%.
4.The chip shall be stabilized at normal condition
for 1~2 hoursbefore measuring.
Reference documents:
GB/T 2423.3-2016
恒定湿热试验
1.No significant defects in appearance.
2.
Δ
L/L
≦
10% (Mn-Zn:
Δ
L/L
≦
30% )
3.
Δ
Q/Q
≦
30%
（
SMD series only
）
Heat endurance of
Reflow soldering
1.Refer to the above reflow curve and go through
the reflow for twice.
2.The peak temperature : 260+0/-5
℃
Reference documents:
GJB 360B-2009
4.
Δ
DCR/DCR
≦
10%
回流焊耐热性试验
No case deformation or change in
To dip parts into IPA solvent for 5±0.5Min,then
drying them at room temp for 5Min,at last ,to
brushing making 10 times.
Resistance to solvent
test
appearance or obliteration of marking
Reference documents:
IEC 68-2-45:1993
耐溶剂性试验
1.During the test no smoke, no peculiar,
smell, no fire
Overload test
Reference documents:
JIS C5311-6.13
过负荷试验
Apply twice as rated current for 5 minutes.
2.The characteristic is normal after test
1.During the test no breakdown
voltage resistance test
Reference documents:
MIL-STD-202G Method
301
2.The characteristic is normal after test
1. For parts with two coils
2. DC1000V, Current: 1mA, Time: 1Min.
3. Refer to ca
tal
o
gu
e
o
f
specific products
绝缘耐压测试
SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
8
Common Mode Choke
◆
推荐回流焊温度曲线
Recommended reflow soldering curve
：
The recommended reflow conditions as above graph, is set according to our soldering
equipment. DUE to
va
r
io
u
s
m
anufactures may have different reflow soldering equipment,
products, process conditions, set methods. And so on,
w
he
n
s
e
tti
n
g the reflow conditions,
Please adjust and confirm according to users’ environment/equipment.
SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
9
Common Mode Choke
使用注意事项
REMINDERS FOR USING THESE PRODUCTS
●
保存时间为
12
个月以内，保存条件（温度
5~40°C
以下、湿度
35
～
66%RH
以下），需充分注意。
若超过保存时间，端
子
电
极
的
可
焊性将可能老化。
The storage period is within 12 months. Be sure to follow the storage conditions (temperature: 5~40°C,
humidity: 35 to 65% RH or less). If the storage period elapses, the soldering of the terminal electrodes may
deteriorate
。
●
请勿在气体腐蚀环境（盐、酸、碱等）下使用和保存。
Do not use or store in locations where th
er
e
ar
e
c
onditions such as gas corrosion (salt, acid, alkali, etc.).
●
手上的油脂会导致可焊性降低，应避免用手直接接触端子。
Don’t touch electrodes directly with bare hands as oil secretions may inhibit soldering Always ensure
optimum conditions for soldering
。
●
请小心轻拿轻放
,
避免由于产品的跌落或取出不当而导致的损坏。
Please always handle products carefully to prevent any damage caused bydropping down or inappropriate
removing
。
●
端子过度弯曲会导致断线
,
请不要过度弯曲端子。
Don’t bend the terminals with excessive stress in case of any wire fracture
。
●
不要清洗产品
,
如需要清洗时请联系我司。
Don’t rinse coils by yourself and please contact SXN if necessary
。
●
请勿将本产品靠近磁铁或带有磁力的物体
Don’t expose the products to magnets or magnetic fields
●
在实施焊接前，请务必进行预热。预热温度与焊接温度及芯片温度的温度差要在
150°C
以内。
Before soldering, be sure to preheat components. The preheating temperature should be set so
th
a
t t
h
e
temperature differenc
e b
et
w
ee
n the solder temperature and chip temperature does not exceed 150°C.
●
安装后的焊接修正应在规格书规定的条件范围内。若加热过度可能导致短路、性能降低、寿命减少。
Soldering corrections after mounting should be within the range of the conditions determined in the
specifications. If overheated, a short circuit, performance deterioration, or lifediv shortening may occur.
●
装置会因通电而自我发热（温度上升），因此在热设计方面需留有充分余地
。
Self heating (temperature increase) occurs when the power is turned ON, so the tolerance should be
sufficient for the set thermal design.
●
非磁屏蔽型在基板设计时需注意配置线圈，受到电磁干扰可能会导致误动作。
Carefully lay out the coil for the circuit board design of the non-magnetic shield type. A malfunction may
occur due to magneti
c i
n
ter
fer
e
nce.
SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
10
