Leiditech-2N7002W

Part #Leiditech-2N7002W
Download 
Leiditech-2N7002W
2N7002W  
1. FEATURES  
●
We declare that the material of product
 
compliance with  
RoHS requirements and Halogen Free.  
ESD Protected:1000V  
●
SC70(SOT-323)  
2. DEVICE MARKING AND ORDERING INFORMATION  
Device  
Marking  
Shipping  
2N7002W  
6C  
3000/Tape&Reel  
3. MAXIMUM RATINGS(Ta = 25ºC)  
Parameter  
Symbol  
VDSS  
VDGR  
ID  
Limits  
Unit  
Vdc  
Drain–Source Voltage  
Drain–Gate Voltage (RGS = 1.0 MΩ)  
Drain Current  
60  
60  
Vdc  
mAdc  
– Continuous
 
TC = 25°C  
TC = 100°C  
±115  
±75  
– Pulsed (Note 1)  
IDM  
±800  
Gate–Source Voltage  
– Continuous  
VGS  
±20  
±40  
Vdc  
Vdc  
– Non–repetitive (tp
≤
50μs)  
VGSM  
4. THERMAL CHARACTERISTICS  
Parameter  
Symbol  
Limits  
Unit  
Total Device Dissipation,  
FR−5 Board (Note 2) @ TA = 25ºC  
Derate above 25ºC  
PD  
225  
mW  
1.8  
mW/ºC  
ºC/W  
Thermal Resistance,  
RΘJA  
556  
Junction–to–Ambient(Note 2)  
Junction and
 
Storage temperature  
TJ,Tstg
−55
∼
+150  
º
C  
1. Pulse Test: Pulse Width
≤
300 μs, Duty Cycle
≤
2.0%.  
2. FR–5 = 1.0×0.75×0.062 in.  
01.06.2015  
1/6  
Rev
:  

2N7002W  
5. ELECTRICAL CHARACTERISTICS (Ta= 25
ºC
)  
OFF CHARACTERISTICS  
Characteristic  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Vdc  
Drain–Source Breakdown Voltage  
(VGS = 0, ID = 10μAdc)  
VBRDSS  
IDSS  
60  
–
–
–
–
–
μAdc  
μAdc  
μAdc  
Zero Gate Voltage Drain Current
 
TJ = 25°C  
1.0  
500  
(VGS = 0, VDS = 60 Vdc)  
TJ = 125°C  
–
Gate–Body Leakage Current, Forward  
(VGS = 20 Vdc)  
IGSSF  
IGSSR  
–
–
–
–
1.0  
Gate–Body Leakage Current, Reverse  
(VGS = – 20 Vdc)  
-1.0  
ON CHARACTERISTICS (Note 3)  
Gate Threshold Voltage  
Vdc  
mA  
Vdc  
VGS(th)  
(VDS = VGS, ID = 250μAdc)  
On–State Drain Current  
1.0  
1.6  
–
2.5  
–
ID(on)  
(VDS
≥
2.0 VDS(on), VGS = 10 Vdc)  
Static Drain–Source On–State Voltage  
(VGS = 10 Vdc, ID = 500 mAdc)  
(VGS = 5.0 Vdc, ID = 50 mAdc)  
Static Drain–Source On–State Resistance  
(VGS = 10 Vdc, ID = 500 mAdc)
 
TC = 25°C  
TC = 125°C  
500  
VDS(on)  
–
–
–
–
3.75  
0.375  
RDS(on)  
Ohms  
–
–
–
–
1.4  
–
7.5  
13.5  
7.5  
(VGS = 5.0 Vdc, ID = 50 mAdc)
 
TC = 25°C  
TC = 125°C  
1.8  
–
13.5  
Forward Transconductance  
mmhos  
gfs  
(VDS
≥
2.0 VDS(on), ID = 200 mAdc)  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
80  
–
–
pF  
pF  
pF  
Cibo  
Cobo  
Cibo  
(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)  
Output Capacitance  
–
–
–
17  
10  
50  
25  
(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)  
Reverse Transfer Capacitance  
(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)  
SWITCHING CHARACTERISTICS  
2.5  
5.0  
ns  
Turn-On Delay Time  
Turn-Off Delay Time  
(VDD = 25 Vdc , ID =500  
mAdc, RG = 25Ω,RL = 50  
Ω,Vgen = 10 V)  
td(on)  
td(off)  
–
–
7
20  
40  
11  
BODY–DRAIN DIODE RATINGS  
Diode Forward On–Voltage  
Vdc  
VSD  
(IS = 115 mAdc, VGS = 0 V)  
Source Current Continuous (Body Diode)  
Source Current Pulsed  
–
–
–
–
–
–
-1.5  
-115  
-800  
IS  
mAdc  
mAdc  
ISM  
3.Pulse Test: Pulse Width
≤
300 μs, Duty Cycle
≤
2.0%.  
01.06.2015  
2/6  
Rev
:  

2N7002W  
6.
ELRCTRICAL CHARACTERISTICS CURVES  
1.6  
1.2  
1
150
℃  
1.2  
0.8  
0.4  
0
25
℃  
0.8  
0.6  
0.4  
0.2  
0
VGS=4.5V  
VGS=4V  
VGS=5V  
VGS=6V  
VGS=7,8,9,10V  
-55
℃  
VGS=3.5V  
VGS=3V  
VGS=2.5V  
0
1
2
3
4
5
6
0
2
4
6
8
10  
VDS, Drain-to-Source Voltage(V)  
VGS, Gate-to-Source Voltage(V)  
ON-Region Characteristics  
Transfer Characteristcs  
8
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
VGS=10V  
VGS=5V  
150
℃  
85
℃  
150
℃  
85
℃  
25
℃  
25
℃  
-55
℃  
-55
℃  
0
0.05  
0.1  
0.15  
0.2  
0
0.05  
0.1  
0.15  
0.2  
ID, Drain Current(A)  
ID, Drain Current(A)  
RDS(on) vs.
 
ID  
RDS(on) vs.
 
ID  
01.06.2015  
3/6  
Rev
:  

2N7002W  
6.
ELRCTRICAL CHARACTERISTICS CURVES
(
Con.)  
10  
9
8
7
6
5
4
3
2
1
0
2.5  
2
VGS=10V  
VGS=5V  
1.5  
1
ID=500mA  
ID=200mA  
0.5  
0
2
4
6
8
10  
-50  
0
50  
100  
150  
Temperataure(
℃
)  
VGS, Gate-to-Source Voltage(V)  
RDS(on) vs. Temperature  
RDS(on) vs. VGS  
35  
30  
25  
20  
15  
10  
5
10  
VGS=0V  
VGS=0V  
1
Ciss  
85
℃  
25
℃  
Coss  
Crss  
0.1  
0.01  
0
0
5
10  
15  
20  
25  
30  
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1
VSD, Source-to-Drain Voltage(V)  
VDS, Drain-to-Source Voltage(V)  
Capacitor vs.VDS  
IS vs.VSD  
01.06.2015  
4/6  
Rev
:  

2N7002W  
6.
ELRCTRICAL CHARACTERISTICS CURVES
(
Con.)  
1.4  
1.2  
1
1.0E-06  
1.0E-07  
1.0E-08  
1.0E-09  
1.0E-10  
ID=250uA  
VGS=0  
150
℃  
0.8  
0.6  
0.4  
0.2  
0
125
℃  
85
℃  
25
℃  
-50  
0
50  
100  
150  
0
10  
20  
30  
40  
50  
60  
Temperature(
℃)  
VDS, Drain-to-Source Voltage(V)  
VGS(th) vs. Temperature  
IDS vs. VDS  
01.06.2015  
5/6  
Rev
:  

2N7002W  
7.OUTLINE AND DIMENSIONS  
Notes:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD  
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM  
THICKNESS OF BASE MATERIAL.  
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
MILLIMETERS  
INCHES  
DIM MIN NOM MAX
 
MIN NOM
 
MAX  
0.80 0.90 1.00
 
0.032 0.035 0.039  
A1 0.00
 
0.05 0.10
 
0.000 0.002 0.004  
A
A2  
b
0.70REF  
0.028REF  
0.30 0.35 0.40
 
0.012 0.014 0.016  
0.10 0.18 0.25
 
0.004 0.007 0.010  
1.80 2.10 2.20
 
0.071 0.083 0.087  
1.15 1.24 1.35
 
0.045 0.049 0.053  
1.20 1.30 1.40
 
0.047 0.051 0.055  
c
D
E
e
e1  
L
0.65REF  
0.026REF  
0.20 0.38 0.56
 
0.008 0.015 0.022  
2.00 2.10 2.40
 
0.079 0.083 0.095  
H

E  

8.SOLDERING FOOTPRINT  
Shanghai Leiditech Electronic Co.,Ltd  
Email: sale1@leiditech.com  
T
e
l :
 
+86- 021 50828806  
Fax : +86- 021 50477059  
01.06.2015  
6/6  
Rev
: