Leiditech-SQ2308CES

Part #Leiditech-SQ2308CES
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Leiditech-SQ2308CES
SQ2308CES  
Description  
uses advanced trench  
technology  
SQ2308CES  
The  
Dimensions SOT-23  
charge and  
to provide excellent R

DS(ON)

, low gate  
This  
operation with gate voltages as low as 4.5
V
.  
device is suitable for use as a Battery protection  
or in other Switching application.  
General Features  
V

DS

= 60V
 
I

D

=3A  
R

DS(ON)

< 100
m
Ω @ V

GS

=10V  
Pin Configuration  
Application  
Battery protection  
●
●
Load switch  
●
Uninterruptible power supply  
Package Marking and Ordering Information  
Device  
Device Marking  
Device Package  
Reel Size  
Tape width  
Quantity  
SQ2308CES  
6003  
SOT-23  
–
–
3000 units  
unless otherwise noted)  
Absolute Maximum Ratings (TC=25
℃
 
Symbol  
V
DS  
Parameter  
Rating  
60  
Units  
Drain-Source Voltage  
V
V
V
GS  
±
20  
3.0  
Gate-Sou
r
ce Voltage  
Continuous Drain Current, V

GS

@ 10V

1  

A
A
I

D

@T

A

=25
℃  
I

D

@T

A

=70
℃  
I
DM  
Continuous Drain Current, V

GS

@ 10V

1  

Pulsed Drain Current

2  

1.8  
9.2  
A
T
o
tal Power Dissipation

3  

1
W
P

D

@T

A

=25
℃  
T
STG  
Storage
T
e
mperature Range  
-55 to 150  
-55 to 150  
125  
℃
T

J  

Operating Junction
T
e
mperature Range  
Thermal Resistance Junction-Ambient

1  

Thermal Resistance Junction-Case

1  

℃
R

θ

JA  
℃
/W  
℃
/W  
R

θ

JC  
80  
Rev
:
01.0
6
.2021  
1
/
5  

SQ2308CES  
Electrical Characteristics (TJ=25
℃
, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
V

GS

=0V , I

D

=250uA  
Reference to 25
℃
, I

D

=1mA  
V

GS

=10V , I

D

=2A  
Min.  
60  
Typ.  
—  
Max. Unit  
BV
DSS  
Drain-Source Breakdown Voltage  
—  
—  
V
△
BV
DSS
/△
T

J

BV

DSS

T
e
mperature Coefficient  
—  
0.054  
80  
V/
℃  
—  
100  
Static Drain-Source On-Resistance

2  

Gate Threshold Voltage  
V

GS

=4.5V , I

D

=1A  
—  
1.2  
85  
—  
110  
2.5  
m
Ω
 
R
DS(ON)  
V
GS(th)  
V
△
V

GS(th)

V

GS(th)

T
e
mperature Coefficient  
—  
—  
-4.96  
—  
—  
1
mV/
℃  
V

GS

=V

DS

, I

D

=250uA  
V

DS

=48V , V

GS

=0V , T

J

=25
℃  
I
DSS  
Drain-Source Leakage Current  
uA  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
5
±
100  
—  
V

DS

=48V , V

GS

=0V , T

J

=55
℃  
I
GSS  
gfs  
Q

g  

Gate-Source Leakage Current  
Forward Transconductance  
T
o
tal Gate Charge (4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
nA  
S
V

GS

=
±
20V , V

DS

=0V  
V

DS

=5V , I

D

=2A  
13  
5
7.0  
2.4  
2.7  
3.2  
13  
Q
gs  
Q
gd  
T
d(on)  
T

r  

1.68  
1.9  
1.6  
7.2  
25  
V

DS

=48V , V

GS

=4.5V , I

D

=2A  
nC  
ns  
Turn-On Delay Time  
Rise Time  
V

DD

=30V , V

GS

=10V ,  
R

G

=3.3  
,
T
d(off)  
T

f  

Turn-Off Delay Time  
Fall Time  
50  
I

D

=2A  
14.4  
511  
38  
28.8  
715  
53  
C
iss  
C
oss  
C
rss  
I
S  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Continuous Source Current

1,4  

Pulsed Source Current

2,4  

V

DS

=15V , V

GS

=0V , f=1MHz  
V

G

=V

D

=0V , Force Current  
pF  
25  
35  
—  
2.3  
9.2  
A
A
I
SM  
—  
V
SD  
t
rr  
Diode Forward Voltage

2  

Reverse Recovery Time  
—  
—  
—  
1.2  
—  
V
V

GS

=0V , I

S

=1A , T

J

=25
℃  
9.7  
nS  
I
F
=2A  
,
dI/dt=100A/µs  
,
T

J

=25
℃  
Q

rr  

Reverse Recovery Charge  
—  
5.8  
—  
nC  
Note :  
1.The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The power dissipation is limited by 150
℃
junction temperature.  
4.The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
Rev
:
01.0
6
.2021  
2
/
5  

SQ2308CES  
Typical Characteristics  
100  
95  
90  
85  
80  
75  
10  
I

D

=2A  
V

GS

=10V  
8
6
4
2
0
V

GS

=7V  
V

GS

=5V  
V

GS

=4.5V  
V

GS

=3V  
0
0.5  
1
1.5  
2
2
4
6
8
10  
V

DS

, Drain-to-Source Voltage (V)  
V

GS

(V)  
Fig.1 Typical Output Characteristics  
Fig.2 On-Resistance v.s Gate-Source  
10  
8
6
T

J

=150
℃
 
T

J

=25
℃  
4
2
0
0.2  
0.4  
0.6  
0.8  
1
V

SD

, Source-to-Drain Voltage (V)  
Fig.3 Forward Characteristics of Reverse  
Fig.4 Gate-Charge Characteristics  
2.0  
1.5  
1.0  
0.5  
-50  
0
50  
100  
150  
T

J

, Junction Temperature (
℃
)  
Fig.5 Normalized V

GS(th)

v.s T

J  

Fig.6 Normalized R

DSON

v.s T

J  

Rev
:
01.0
6
.2021  
3
/
5  

SQ2308CES  
1000  
100  
10  
1 0 . 0 0  
1 . 0 0  
0 . 1 0  
0 . 0 1  
F=1.0MHz  
Ciss  
100us  
1 0 m  
1 0 0 m  
Coss  
1s  
T

A

= 2
5
℃
 
Crss  
21  
DC  
S i n g l e
 
P  
0 . 1  
1
10  
V

DS

(V)  
100  
1000  
1
5
9
13  
17  
25  
V

DS

Drain to Source Voltage(V)  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
1
DUTY=0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
0.01  
P

DM  

T

ON  

0.001 SINGLE
 
PULSE  
T
D = T

ON

/T  
T

Jpeak

= T

A

+
P

D
M

x R

θJA  

0.0001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
V

DS  

90%  
10%  
V

GS  

T

d(on)  

T

r  

T

on  

T

d(off)  

T

f  

T

off  

Fig.10 Switching Time Waveform  
Fig.11 Gate Charge Waveform  
Rev
:
01.0
6
.2021  
4
/
5  

SQ2308CES  
Package Mechanical Data-SOT-23  
Dimensions in Millimeters  
Symbol  
MIN.  
0.900  
0.000  
0.900  
0.300  
0.080  
2.800  
1.200  
2.250  
MAX.  
1.150  
0.100  
1.050  
0.500  
0.150  
3.000  
1.400  
2.550  
A
A1  
A2  
b
c
D
E
E1  
e
0.950TYP  
0.550REF  
e1  
L
1.800  
2.000  
L1  
θ
0.300  
0°  
0.500  
8°  
Shanghai Leiditech Electronic Co.,Ltd  
Email: sale1@leiditech.com  
T
e
l :
 
+86- 021 50828806  
Fax : +86- 021 50477059  
Rev
:
01.0
6
.2021  
5
/
5