Littelfuse-IXYS-CLA80E1200HF

Part #Littelfuse-IXYS-CLA80E1200HF
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Littelfuse-IXYS-CLA80E1200HF
CLA80E1200HF  
=
V

RRM  

I

TAV  

V

T  

120
0
V  
8
0
A  
High Efficiency Thyristor  
=
=
1.3
8
V  
Single Thyristor  
Part number  
CLA80E1200HF  
Backside: anode  
2
1
3
PLUS247  
Features / Advantages:  
Applications:  
Package:  
●
Thyristor for line frequency  
●
Planar passivated chip  
●
Long-term stability  
●
Line rectifying 50/60 Hz  
●
Softstart AC motor control  
●
DC Motor control  
●
Industry standard outline  
●
RoHS compliant  
●
Epoxy meets UL 94V-0  
●
Power converter  
●
AC power control  
●
Lighting and temperature control  
Disclaimer Notice  
Information furnished is believed to be accurate and reliable. However, users should independently  
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,  
and may not be used in, all applications. Read complete Disclaimer Notice at  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20191202d  
© 2019
 
IXYS all rights reserved  

CLA80E1200HF  
Ratings  
Thyristor  
Symbol  
V

RSM/DSM  

Definition  
Conditions  
min. typ. max. Unit  
T

VJ

= 25°C  
T

VJ

= 25°C  
T

VJ

= 25°C  
T

VJ

= 125°C  
T

VJ

= 25°C  
1300  
1200  
50  
V
V
max. non-repetitive reverse/forward blocking voltage  
max. repetitive reverse/forward blocking voltage  
V

RRM/DRM  

I

R/D  

V

R/D

=
1
200 V  
V

R/D

=
1
200 V  
I

T

= 80
 
A  
I

T

= 160
 
A  
I

T

= 80
 
A  
I

T

= 160
 
A  
T

C

= 115°C  
180° sine  
µA  
mA  
V
reverse current, drain current  
5
forward voltage drop  
1.40  
1.77  
1.38  
1.87  
80  
V

T  

V
T

VJ  

=
°C  
V
125  
V
average forward current  
RMS forward current  
T

VJ

= 150°C  
T

VJ

= 150°C  
A
I

TAV  

I

T(RMS)  

V

T0  

126  
0.88  
A
V
threshold voltage  
for power loss calculation only  
slope resistance  
6.3 m
Ω  
0.2 K/W  
K/W  
r

T  

R

thJC  

R

thCH  

P

tot  

thermal resistance junction to case  
thermal resistance case to heatsink  
0.3  
T

C

= 25°C  
T

VJ

= 45°C  
V

R

= 0 V  
620  
900  
970  
765  
825  
W
A
A
A
A
total power dissipation  
max. forward surge current  
t =
 
10 ms; (50 Hz), sine  
t = 8,3 ms; (60 Hz), sine  
t =
 
10 ms; (50 Hz), sine  
t = 8,3 ms; (60 Hz), sine  
t =
 
10 ms; (50 Hz), sine  
t = 8,3 ms; (60 Hz), sine  
t =
 
10 ms; (50 Hz), sine  
t = 8,3 ms; (60 Hz), sine  
V

R

= 40
0
V f
 
= 1
M
Hz  
t

P

= 30
 
µs  
I

TSM  

T

VJ

= 150°C  
V

R

= 0 V  
value for fusing  
T

VJ

= 45°C  
V

R

= 0 V  
I²t  
4.05 kA²s  
3.92 kA²s  
2.93 kA²s  
2.83 kA²s  
pF  
T

VJ

= 150°C  
V

R

= 0 V  
junction capacitance  
T

VJ

= 25°C  
T

C

= 150°C  
36  
C

J  

10  
5
W
W
W
P

GM  

max. gate power dissipation  
t

P

= 300
 
µs  
0.5  
P

GAV  

average gate power dissipation  
critical rate of rise of current  
T

VJ

= 15
0
°
C; f = 50 Hz  
repetitive, I

T

= 240
 
A  
150 A/µs  
(di/dt)

cr  

0.3  
t

P

= 200
 
µs
;
d
i

G

/dt =  
A/µs;  
I

G

= 0.
3
A
;
 
V =
 
⅔
V

DRM  

V =
⅔
V

DRM  

non-repet., I

T

= 80
 
A  
T

VJ

= 150°C  
500 A/µs  
critical rate of rise of voltage  
gate trigger voltage  
1000 V/µs  
(dv/dt)

cr  

V

GT  

R

GK

=
∞; method 1 (linear voltage rise)  
V

D

= 6 V  
T

VJ

= 25°C  
T

VJ

= -40°C  
T

VJ

= 25°C  
T

VJ

= -40°C  
T

VJ

= 150°C  
1.5  
1.6  
V
V
gate trigger current  
V

D

= 6 V  
38 mA  
80 mA  
I

GT  

gate non-trigger voltage  
gate non-trigger current  
latching current  
V

D

=
⅔
V

DRM  

t

p

= 10
 
µs  
0.2  
5
V
V

GD  

I

GD  

I

L  

mA  
T

VJ

= 2
5
°
C  
150 mA  
I

G  

=
0.
3
A
; di

G

/dt =
 
0.3 A/µs  
holding current  
V

D

= 6 V
 
R

GK

=
∞  
T

VJ

= 2
5
°
C  
T

VJ

= 2
5
°
C  
100 mA  
I

H  

gate controlled delay time  
V

D

= ½ V  
2
µs  
µs  
t

gd  

DRM  
I

G  

V

R

= 100 V;
 
I

T  

di/dt =
 
20 A/µs
 
dv/dt =
 
20 V/µs  
=
0.
3
A
; di

G

/dt =
 
0.3 A/µs  
80A; V
 
=
⅔
V

DRM

T

VJ

=125 °C  
µs  
turn-off time  
=
150  
t

q  

t

p

= 200  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20191202d  
© 2019
 
IXYS all rights reserved  

CLA80E1200HF  
Ratings  
Package PLUS247  
Symbol  
I

RMS  

Definition  
Conditions  
min. typ. max.
 
Unit  
per terminal  
70  
150  
125  
150  
A
°C  
°C  
°C  
g
RMS current  
-40  
-40  
-40  
T

VJ  

virtual junction temperature  
T

op  

operation temperature  
storage temperature  
T

stg  

6
Weight  
20  
5.5  
5.5  
120  
N
mm  
mm  
F

C  

mounting force with clip  
terminal to terminal  
terminal to backside  
d

Spp/App  

d

Spb/Apb  

creepage distance on surface | striking distance through air  
Product Marking  
Part description  
C = Thyristor
 
(SCR)  
L = High
 
Efficiency Thyristor  
A = (up
 
to 1200V)  
80 = Current
 
Rating [A]  
E = Single
 
Thyristor  
1200 = Reverse
 
Voltage [V]  
HF = PLUS247
 
(3)  
Logo  
IXYS  
Part Number  
Date Code  
Lot#  
XXXXXXXXX  
yywwZ  
1234  
Location  
Ordering  
Ordering Number  
Marking on Product  
CLA80E1200HF  
Delivery Mode  
Quantity Code
 
No.  
30 508680  
Standard  
CLA80E1200HF  
Tube  
T

VJ

=
1
50°C  
Equivalent Circuits for Simulation  
* on die level  
Thyristor  
V

0  

I
R

0  

threshold voltage  
slope resistance *  
0.88  
3.8  
V
V

0 max  

R

0 max  

m
Ω  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20191202d  
© 2019
 
IXYS all rights reserved  

CLA80E1200HF  
Outlines PLUS247  
A
D2  
E
A2  
A
Q
R
A
View A – A  
D1  
D
4
1
2
3
L1  
E1  
Sym.  
Inches  
Millimeter  
L
min.  
max.  
0.190 0.205  
0.090 0.100  
0.075 0.085  
0.045 0.055  
0.075 0.084  
0.115 0.123  
0.024 0.031  
0.819 0.840  
min.  
4.83  
2.29  
1.91  
1.14  
1.91  
2.92  
0.61  
max.  
A
5.21  
2.54  
2.16  
1.40  
2.13  
3.12  
0.80  
A1  
A2  
b
b1  
b2  
C
A1  
b
C
b1  
b2  
D
20.80 21.34  
D1  
D2  
E
0.515  
–
13.07  
0.51  
–
e
0.010 0.053  
0.620 0.635  
1.35  
15.75 16.13  
13.45  
E1  
e
0.530  
–
–
0.215 BSC  
0.780 0.800  
0.150 0.170  
0.220 0.244  
0.170 0.190  
5.45 BSC  
L
19.81 20.32  
L1  
Q
3.81  
5.59  
4.32  
4.32  
6.20  
4.83  
R
2
1
3
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20191202d  
© 2019
 
IXYS all rights reserved  

CLA80E1200HF  
Thyristor  
200  
800  
700  
600  
500  
400  
300  
200  
10000  
V

R

= 0 V  
160  
T

VJ

= 45°C  
T

VJ

= 45°C  
120  
I

TSM  

[A]  
I

2

t  
I

T  

T

VJ

= 125°C  
1000  
T

VJ

= 125°C  
[A

2

s]  
80  
[A]  
125°C  
150°C  
40  
0
50 Hz, 80% V

RRM  

T

VJ

= 25°C  
100  
0.5  
1.0  
1.5  
2.0  
0.01  
0.1  
1
1
2
3
4 5
 
6 7 8
 
9
1
0  
t [s]  
V

T

[V]  
t [ms]  
Fig. 3
 
I

2

t versus time (1-10 ms)  
Fig. 2
 
Surge overload current  
Fig. 1
 
Forward characteristics  
10  
1000  
100  
80  
60  
1: I  
, T
 
= 150°C  
GD VJ  
2: I
 
, T  
GT VJ  
=
=
25°C  
3: I
 
, T  
GT VJ  
-40°C  
dc =  
1
0.5  
0.4  
0.33  
0.17  
0.08  
3
typ.  
Limit  
2
I

T(AV)M  

t

gd  

V

G  

1
1
40  
20  
0
6
[V]  
[µs]  
[A]  
5
4
10  
T
= 125°C  
VJ  
4: P  
= 0.5 W  
GAV  
5: P  
6: P  
=
1 W  
GM  
=
10 W  
GM  
0.1  
1
10  
1
10  
100  
1000 10000  
100  
1000  
0
20 40 60 80
 
100 120 140 160  
I

G

[mA]  
Fig. 5
 
Gate controlled delay time  
I

G

[mA]  
T

C

[°C]  
Fig. 4
 
Gate trigger characteristics  
Fig. 6
 
Max. forward current  
at case temperature  
180  
160  
140  
120  
0.24  
dc =  
1
0.5  
0.4  
0.33  
0.17  
0.08  
0.20  
R

thHA  

0.4  
0.16  
Z

thJC  

0.12  
[K/W]  
0.6  
0.8  
1.0  
2.0  
4.0  
P

(AV)  

100  
[W]  
80  
60  
40  
20  
0
R

thi

[K/W]  
0.0268  
0.0131  
0.0218  
0.0364  
0.1019  
t

i

[s]  
0.0100  
0.0001  
0.0150  
0.9500  
0.1400  
0.08  
0.04  
0.00  
0
20 40 60 80
 
100  
0
50  
100  
150  
10

0  

10

1  

10

2  

10

3  

10

4  

I

T(AV)

[A]  
T

amb

[°C]  
t [ms]  
Fig. 7a
 
Power dissipation versus direct output current  
Fig. 7b
 
and ambient temperature  
Fig. 8
 
Transient thermal impedance  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20191202d  
© 2019
 
IXYS all rights reserved