LRC-LMUN5213DW1T1G

Part #LRC-LMUN5213DW1T1G
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LRC-LMUN5213DW1T1G
LMUN5213DW1T1G  
S-LMUN5213DW1T1G  
Dual Bias ResistorTransistors  
NPN Silicon Surface Mount Transistors  
with Monolithic Bias Resistor Network  
SC88(SOT-363)  
1. FEATURES  
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Simplifies circuit design  
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Reduces board space.  
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Reduces Component Count  
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We declare that the material of product
 
compliance with  
RoHS requirements and Halogen Free.  
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S- prefix for automotive and other applications requiring  
unique site and control change requirements; AEC-Q101  
qualified and PPAP capable.  
2. DEVICE MARKING AND RESISTOR VALUES  
Device  
Marking R1(K)
 
R2(K)  
Shipping  
LMUN5213DW1T1G  
LMUN5213DW1T3G  
7C  
7C  
47  
47  
47  
47  
3000/Tape&Reel  
10000/Tape&Reel  
3. MAXIMUM RATINGS(Ta = 25ºC)  
Parameter  
Symbol  
VCEO  
VCBO  
VEBO  
IC  
Limits  
50  
Unit  
V
Collector–Emitter Voltage  
Collector–Base Voltage  
50  
V
6
V
Emitter–Base Breakdown Voltage  
Collector Current — Continuous  
mA  
100  
4. THERMAL CHARACTERISTICS  
Parameter (One Junction Heated)  
Total Device Dissipation,  
Symbol  
Limits  
Unit  
PD  
187  
1.5  
mW  
mW/ºC  
ºC/W  
(Note 1) @ TA = 25ºC  
Derate above 25ºC  
Thermal Resistance,  
RΘJA  
670  
Junction–to–Ambient(Note 1)  
Limits  
Unit  
Parameter (Both Junctions Heated)
 
Symbol  
Total Device Dissipation,  
(Note 1) @ TA = 25ºC  
PD  
250  
2
mW  
mW/ºC  
ºC/W  
Derate above 25ºC  
Thermal Resistance,  
RΘJA  
RΘJL  
493  
Junction–to–Ambient(Note 1)  
Thermal Resistance,  
188  
ºC/W  
Junction–to–Lead(Note 1)  
Junction and
 
Storage temperature  
1. FR–4 @ Minimum Pad  
TJ,Tstg  
∼
º
C
−55
+150  
Rev.B Mar.
 
2021  
Leshan Radio Company, LTD.  
1/5  

LMUN5213DW1T1G, S-LMUN5213DW1T1G  
Bias Resistor Transistor  
5. ELECTRICAL CHARACTERISTICS (Ta= 25
ºC
)  
OFF CHARACTERISTICS  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Characteristic  
Collector–Emitter Breakdown Voltage  
(IC = 2.0 mA, IB = 0)  
VBR(CEO)  
V
50  
–
–
Collector–Base Breakdown Voltage  
(IC = 10 μA, IE = 0)  
VBR(CBO)  
V
50  
–
–
Emitter–Base Breakdown Voltage  
(IE = 200 μA, IC = 0)  
VBR(EBO)  
ICBO  
V
6
–
–
–
–
–
–
Collector-Base Cutoff Current  
(VCB = 50 V, IE = 0)  
nA  
nA  
mA  
100  
500  
0.1  
Collector-Emitter Cutoff Current  
(VCE = 50 V, IB = 0)  
ICEO  
–
Emitter-Base Cutoff Current  
(VEB = 6.0 V, IC = 0)  
IEBO  
–
ON CHARACTERISTICS (Note 2)  
DC Current Gain  
HFE  
VCE(sat)  
VOL  
80  
–
140  
–
0.25  
0.2  
–
(IC = 5.0 mA, VCE = 10 V)  
Collector–Emitter Saturation Voltage  
(IC = 10 mA, IB = 0.3 mA)  
Output Voltage (on)  
–
–
–
V
V
–
(VCC = 5.0 V, VB = 3.5 V, RL =1.0KΩ)  
Output Voltage (on)  
VOH  
4.9  
V
(VCC = 5.0 V, VB = 0.5 V, RL =1.0KΩ)  
Input Resistor  
R1  
32.9  
0.8  
47  
1
61.1  
1.2  
KΩ  
Resistor Ratio  
R1/R2  
2. Pulse Test: Pulse Width < 300 μs, Duty Cycle < 2.0%  
Rev.B Mar.
 
2021  
Leshan Radio Company, LTD.  
2/5  

LMUN5213DW1T1G, S-LMUN5213DW1T1G  
Bias Resistor Transistor  
6.ELECTRICAL CHARACTERISTICS CURVES  
1000  
100  
10  
1
VCE=10V  
IC/IB=10  
85
℃
 
150
℃  
85
℃  
25
℃  
-55
℃  
25
℃  
0.1  
150
℃  
-55
℃  
0.01  
0.001  
0.01  
0.1  
0
0.01  
0.02  
0.03  
IC Collector Current(A)  
IC Collector Current(A)  
HFE vs. IC  
VCE(sat) vs. IC  
1E-01  
1E-02  
1E-03  
1E-04  
1E-05  
1E-06  
100  
10  
1
V

O

=0.2V  
-55
℃  
150
℃  
-55
℃  
150
℃  
25
℃  
85
℃  
25
℃  
85
℃  
V

O

=5V  
0.1  
0
0.01  
0.02  
0.03  
0.04  
0.05  
0
1
2
3
4
5
IC Collector Current(A)  
Vin Input Voltage(V)  
Vin vs. IC  
IC vs. Vin  
Rev.B Mar.
 
2021  
Leshan Radio Company, LTD.  
3/5  

LMUN5213DW1T1G, S-LMUN5213DW1T1G  
Bias Resistor Transistor  
6.ELECTRICAL CHARACTERISTICS CURVES(Con.)  
3
3
2
2
1
f=1.0MHz  
Ta=25
℃  
0
10  
20  
30  
40  
50  
VT Reverse Voltage(V)  
Capacitance  
Rev.B Mar.
 
2021  
Leshan Radio Company, LTD.  
4/5  

LMUN5213DW1T1G, S-LMUN5213DW1T1G  
Bias Resistor Transistor  
7.OUTLINE AND DIMENSIONS  
Notes:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD  
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM  
THICKNESS OF BASE MATERIAL.  
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
MILLIMETERS  
INCHES  
MIN NOM MAX
 
MIN NOM MAX  
DIM  
A
—  
—  
—  
1.10  
0.10  
—  
0
— 0.043  
— 0.004  
A1 0.00  
A2 0.70
 
0.90 1.00 0.027
 
0.035 0.039  
b
C
D
E
0.15 0.20 0.25 0.006
 
0.008 0.01  
0.08 0.15 0.22 0.003
 
0.006 0.009  
1.80 2.00 2.20  
0.07 0.078
 
0.086  
2.00 2.10 2.20 0.078
 
0.082 0.086  
E1 1.15
 
1.25 1.35 0.045
 
0.049 0.053  
e
0.65 BSC  
0.026 BSC  
L
0.26 0.36 0.46
 
0.010 0.014 0.018  
L2  
0.15 BSC  
0.15  
0.30  
0.10  
0.10  
0.006 BSC  
0.01  
aaa  
bbb  
ccc  
ddd  
0.01  
0.00  
0.00  
8.SOLDERING FOOTPRINT  
Leshan Radio Company, LTD.  
Rev.B Mar.
 
2021  
5/5  

DISCLAIMER  
●
Before you use our Products, you are requested to carefully read this document and fully understand its  
contents. LRC
 
shall not
 
be in any way responsible or
 
liable for failure,
 
malfunction or accident arising  
from the use of any LRC’s Products against warning, caution or note contained in this document.  
All information contained in this document is current as of the issuing date and subject to change without  
any prior notice. Before purchasing or using LRC’s Products,please confirm the latest information with a  
LRC sales representative.  
●