LRC-S-LBSS4240LT1G
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LBSS4240LT1G
S-LBSS4240LT1G
General Purpose Transistors NPN Silicon
1. FEATURES
●
Low collector-emitter saturation voltage
●
High current capability
●
Improved device reliability due to reduced heat generation
●
We declare that the material of product
compliance with
RoHS requirements and Halogen Free.
●
S- prefix for automotive and other applications requiring
SOT23
unique site and control change requirements; AEC-Q101
qualified and PPAP capable.
2. APPLICATIONS
●
Supply line switching circuits
●
Battery management applications
●
DC/DC converter applications
●
Strobe flash units
●
Heavy duty battery powered equipment (motor and lamp drivers).
3. DEVICE MARKING AND ORDERING INFORMATION
Device
Marking
Shipping
LBSS4240LT1G
LBSS4240LT3G
ZE
3000/Tape&Reel
10000/Tape&Reel
ZE
4. MAXIMUM RATINGS(Ta = 25ºC)
Parameter
Symbol
VCEO
VCBO
VEBO
IC
Limits
Unit
V
Collector-Emitter Voltage
Collector-Base voltage
Emitter-Base Voltage
40
40
V
5
2
V
Collector current-continuoun
Total power dissipation
Junction temperature
A
PD
0.3
W
℃
℃
TJ
150
Storage temperature
TSTG
-55~+150
5. THERMAL CHARACTERISTICS
Parameter
Symbol
Value
417
Unit
ºC/W
ºC/W
ºC/W
(Note 1)
(Note 2)
Thermal resistance from junction to ambient
in free air
RθJA
260
Thermal resistance from junction to case(Note 1)
RθJ
C
150
×
×
k
1.30.0mm 25.0mm 1.6mm(FR4),Thic ness
of copper film:35u
m
.
2.Device mounted on a printed-circuit board,single sided copper,tinplated and mounted pad for collector 1 cm².
Leshan Radio Company, LTD.
Rev.E Jun. 2020
1/5
LBSS4240LT1G,S-LBSS4240LT1G
General Purpose Transistors NPN Silicon
6. ELECTRICAL CHARACTERISTICS (Ta= 25
ºC
)
Characteristic
Collector–Emitter Breakdown Voltage
(IC= 10mA,IB= 0A)
Symbol
Min.
Typ.
Max.
Unit
40
–
–
VBR(CEO)
V
Collector–Base Breakdown Voltage
(IC= 100μA,IE= 0A)
40
5
–
–
–
–
VBR(CBO)
VBR(EBO)
V
V
Emitter–Base Breakdown Voltage
(IE= 100μA,IC= 0A)
Collector-Emitter cutoff Current
(IB=0, VCE = 40V)
ICEO
ICBO
IEBO
µ
A
nA
nA
–
–
–
–
–
–
1
Collector-Base cut-off current
(IE = 0, VCB = 30 V)
100
100
Emitter-Base cut-off current
(IC = 0, VEB = 4 V)
DC current gain
350
300
300
150
–
–
–
–
–
–
–
–
(IC = 100 mA, VCE = 2 V)
(IC = 500 mA, VCE = 2 V)
(IC = 1 A, VCE = 2 V)
hFE
(IC = 2 A, VCE = 2 V)
Collector-Emitter saturation voltage
(IC = 100 mA, IB = 1 mA)
(IC = 500 mA, IB = 50 mA)
(IC = 750 mA, IB = 15 mA)
(IC = 1 A, IB = 50 mA)(Note 3)
(IC = 2 A, IB = 200 mA)(Note 3)
Base-Emitter saturation voltage
(IC = 2 A,IB = 200 mA)(Note 3)
(IC = 2 A,IB = 50 mA)(Note 3)
–
–
–
–
–
–
–
–
–
–
70
100
180
180
320
mV
VCE(sat)
VBE(sat)
V
–
–
–
–
1.1
1.1
Base-Emitter turn on voltage
(IC = 100 mA,VCE = 2 V)
V
VBE(on)
–
–
–
–
–
0.75
20
–
Collector capacitance
pF
Cc
fT
(IE = Ie = 0,VCB = 10 V,f = 1 MHz)
Transition frequency
MHz
100
(IC = 100 mA,VCE = 10 V, f = 100 MHz)
3.Pulse test: t p
≤
300 μs, δ
≤
0.02.
Rev.E Jun. 2020
Leshan Radio Company, LTD.
2/5
LBSS4240LT1G,S-LBSS4240LT1G
General Purpose Transistors NPN Silicon
(Ta= 25
ºC
)
7.
ELECTRICAL CHARACTERISTICS CURVES
800
3
IB=18mA
A
IB=8mA,10mA,12mA,14mA,16m
VCE=2V
700
600
500
400
300
200
100
0
150
℃
2.5
2
25
℃
IB=6mA
IB=4mA
1.5
1
-55
℃
IB=2mA
0.5
0
0.001
0.01
0.1
1
10
0
1
2
3
4
5
VCE,Collector to Emittor Voltage(V)
IC,Collector Current(A)
HFE vs. IC
IC vs. VCE
1.2
1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
IC=2A
IC=1.5
IC=1A
IC=0.9
A
-55
℃
25
℃
A
A
IC=0.7
0.8
0.6
0.4
0.2
0
IC=0.5A
IC=0.3A
IC=0.1A
150
℃
VCE=2V
Ta=25
℃
0.00005
0.0005
0.005
0.05
0.001
0.01
0.1
1
10
IC,Collector Current(A)
IB,Base Current(A)
VCE(sat) vs. IB
VBE(on) vs. IC
Rev.E Jun. 2020
Leshan Radio Company, LTD.
3/5
LBSS4240LT1G,S-LBSS4240LT1G
General Purpose Transistors NPN Silicon
(Ta= 25
ºC
)
7.
ELECTRICAL CHARACTERISTICS CURVES
(Con.)
0.50
1.2
0.45
IC/IB=20
1
0.8
0.6
0.4
0.2
0
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
-55
℃
℃
25
25
℃
150
℃
150
℃
-55
℃
IC/IB=20
0.001
0.01
0.1
1
10
0.001
0.01
0.1
1
10
IC,Collector Current(A)
IC,Collector Current(A)
VBE(sat) vs. IC
VCE(sat) vs. IC
Rev.E Jun. 2020
Leshan Radio Company, LTD.
4/5
LBSS4240LT1G,S-LBSS4240LT1G
General Purpose Transistors NPN Silicon
8.OUTLINE AND DIMENSIONS
Notes:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MILLIMETERS
INCHES
MIN NOM MAX
MIN NOM
MAX
DIM
A
0.89
1
1.11 0.035 0.04 0.044
0.1 0.001
0.002 0.004
0.5 0.015
0.018 0.02
A1 0.01
0.06
0.44
b
c
0.37
0.09
2.80
1.20
1.78
0.10
0.13 0.18
0.003 0.005 0.007
D
E
e
L
2.9
1.3
1.9
0.2
3.04 0.11
0.114 0.12
1.4 0.047
0.051 0.055
2.04 0.07
0.075 0.081
0.3 0.004
0.008 0.012
L1 0.35
0.54 0.69
0.014 0.021 0.029
H
E
2.10
0°
2.4
—
2.64 0.083
0.094 0.104
10° 0°
— 10°
θ
9.SOLDERING FOOTPRINT
Rev.E Jun. 2020
Leshan Radio Company, LTD.
5/5
