LRC-S-LP2309LT1G

Part #LRC-S-LP2309LT1G
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LRC-S-LP2309LT1G
S-LP2309LT1G  
P-Channel 60V (D-S) MOSFET  
1. FEATURES  
●
RDS(ON)
≤
215m ,
 
Vgs@-10V.  
Ω
●
●
●
●
RDS(ON)
≤
260m ,
 
Vgs@-4.5V.  
Ω
Super high density cell design for extremely low RDS(ON).  
Exceptional on-resistance and maximum DC current capability.  
We declare that the material of product
 
compliance with  
RoHS requirements and Halogen Free.  

●

S- prefix for automotive and other applications requiring  
unique site and control change requirements; AEC-Q101  
qualified and PPAP capable.  
SOT23(TO-236)  
2. APPLICATIONS  
●
Power Management in Note book  
●
Portable Equipment  
●
Battery Powered System  
●
DC/DC Converter  
●
Load Switch  
●
DSC  
●
LCD Display inverter  
3. DEVICE MARKING AND ORDERING INFORMATION  
Device  
Marking  
Shipping  
P09  
3000/Tape&Reel  
10000/Tape&Reel  
S-LP2309LT1G  
S-LP2309LT3G  
P09  
4. MAXIMUM RATINGS(Ta = 25ºC)  
Parameter  
Limits  
-60  
Symbol  
Unit  
V
Drain–Source Voltage  
VDSS  
VGS  
Gate–to–Source Voltage – Continuous  
±20  
V
-1.9  
Ta=25
℃
 
Ta=70
℃  
Continuous Drain Current  
Pulsed Drain Current  
ID  
IDM  
PD  
-1.5  
A
-7.6  
1.4  
Ta=25
℃  
Ta=70
℃  
Maximum Power Dissipation  
W
0.9  
Tj  
150  
Junction Temperature  
℃
℃
Tstg  
-55~+150  
Storage Temperature Range  
170  
225  
t
≤
10s  
Steady State  
90  
Thermal Resistance-Junction to Ambient(Note 1)  
RθJA  
℃
/W  
RθJC  
Thermal Resistance-Junction to Case(Note 1)  
1.The device mounted on 1in ² FR4 board with 2 oz copper  
Rev.B May.
 
2020  
Leshan Radio Company, LTD.  
1/6  

S-LP2309LT1G  
P-Channel 60V (D-S) MOSFET  
5. ELECTRICAL CHARACTERISTICS (Ta= 25
ºC
)  
Characteristic  
Symbol  
Min.  
Typ.  
Max.  
Unit  
STATIC  
Drain–Source Breakdown Voltage  
(VGS = 0, ID = -250μA)  
V
V
VBRDSS  
VGS(th)  
IGSS  
-60  
-1  
–
–
–
–
–
–
Gate Threshold Voltage  
-3  
(VDS = VGS, ID = -250μA)  
Gate Leakage Current  
nA  
μA  
±100  
-10  
(VDS =0V, VGS =±20V)  
Zero Gate Voltage Drain Current  
(VGS = 0V, VDS = -60 V)  
Static Drain–Source On–State Resistance  
(VGS = -10 V, ID = -1.8 A)  
(VGS = -4.5 V, ID = -1.4 A)  
Forward Voltage  
IDSS  
–
mΩ  
RDS(on)  
VSD  
–
–
170  
200  
215  
260  
V
–
–
-1.2  
(VGS = 0 V, IS = -1.2 A)  
DYNAMIC  
Total Gate Charge  
Qg  
Qgs  
Qgd  
Ciss  
Coss  
Crss  
–
–
–
–
–
–
4.06  
1.04  
2.1  
–
–
–
–
–
–
(VGS = -4.5 V, ID =-1A,VDS= -48 V)  
Gate-Source Charge  
nC  
pF  
(VGS = -4.5 V, ID =-1A,VDS= -48 V)  
Gate-Drain Charge  
(VGS = -4.5 V, ID =-1A,VDS= -48 V)  
Input Capacitance  
373  
24.2  
17.4  
(VGS = 0 V, f = 1.0MHz,VDS= -30 V)  
Output Capacitance  
(VGS = 0 V, f = 1.0MHz,VDS= -30 V)  
Reverse Transfer Capacitance  
(VGS = 0 V, f = 1.0MHz,VDS= -30 V)  
Turn-On Delay Time  
–
–
–
–
3.6  
3.6  
–
–
–
–
td(on)  
tr  
(VDS = -30V, RL= 30  
ID = -1A, VGS = -10V  
Rise Time  
ns  
16.7  
2.9  
Turn-Off Delay Time  
td(off)  
tf  
RG = 3.
1
Ω)  
Fall Time  
Gate-Resistance  
Rg  
Ω
6.5  
–
–
(VGS = 0 V, VDS=0V,f=1MHz)  
2.Pulse Test: Pulse Width
≤
300 μs, Duty Cycle
≤
2.0%.  
Rev.B May.
 
2020  
2/6  
Leshan Radio Company, LTD.  

S-LP2309LT1G  
P-Channel 60V (D-S) MOSFET  
6.ELECTRICAL CHARACTERISTICS CURVES  
2
1.8  
1.6  
1.4  
1.2  
1
2
VGS=4V,5V  
Ta=25
℃
 
1.8  
25
℃
 
VGS=3V  
1.6  
1.4  
1.2  
150
℃  
-55
℃  
VGS=2.8V  
1
0.8  
0.6  
0.4  
0.2  
0
0.8  
0.6  
VGS=2.6V  
0.4  
0.2  
0
0
1
2
3
0
1
2
3
4
5
VGS,Gate to Source Voltage(V)  
VDS,Drain to Source Voltage(V)  
ID vs. VGS  
ID vs. VDS  
0.25  
0.2  
0.15  
0.1  
0.05  
0
10  
1
VGS=4.5V  
VGS=10V  
0.1  
150
℃  
25
℃  
-55
℃  
0.01  
0.001  
Ta=25
℃  
1.8 2  
1
1.2  
1.4  
1.6  
0.2  
0.4  
0.6  
0.8  
1
ID,Drain Current(A)  
VSD,Diode forward Voltage(V)  
IS vs. VSD  
RDS(on) vs. ID  
Rev.B May.
 
2020  
Leshan Radio Company, LTD.  
3/6  

S-LP2309LT1G  
P-Channel 60V (D-S) MOSFET  
6.ELECTRICAL CHARACTERISTICS CURVES(Con.)  
0.4  
0.35  
0.3  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
ID=1.0A  
VGS=4.5V,ID=1.4A  
VGS=10V,ID=1.8A  
0.25  
0.2  
0.15  
0.1  
150
℃
 
25
℃  
0.05  
0
-55
℃  
-50 -25  
0
25  
50  
75 100
 
125 150  
2
4
6
8
10  
Tj,Temperature(
℃
)  
VGS,Gate to Source Voltage(V)  
RDS(on) vs. VGS  
RDS(on) vs. Tj  
2.4  
2.2  
2
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
f=1.0MHz  
ID=250uA  
Ta=25
℃  
Ciss  
1.8  
1.6  
1.4  
1.2  
1
Coss  
Crss  
0
0
-50 -25  
0
25  
50  
75 100
 
125 150  
20  
40  
60  
Tj,Tempature(
℃
)  
VDS(V)  
VGSTH vs. Tj  
Capacitance  
Rev.B May.
 
2020  
Leshan Radio Company, LTD.  
4/6  

S-LP2309LT1G  
P-Channel 60V (D-S) MOSFET  
6.ELECTRICAL CHARACTERISTICS CURVES(Con.)  
10  
1µs  
1
10µs  
100µs  
1ms  
100ms  
DC result  
10ms  
0.1  
PCB Size:  
30.0mm
×
25.0mm
×
1.6mm(FR4)  
0.01  
0.1  
1
10  
100  
VDS(V)  
Safe Operating Area  
Leshan Radio Company, LTD.  
Rev.B May.
 
2020  
5/6  

S-LP2309LT1G  
P-Channel 60V (D-S) MOSFET  
7.OUTLINE AND DIMENSIONS  
Notes:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD  
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM  
THICKNESS OF BASE MATERIAL.  
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
MILLIMETERS  
INCHES  
MIN NOM
 
MAX MIN NOM
 
MAX  
DIM  
A
0.89  
1
1.11 0.035 0.04 0.044  
0.1 0.001
 
0.002 0.004  
0.5 0.015
 
0.018 0.02  
A1 0.01  
0.06  
0.44  
b
c
0.37  
0.09  
2.80  
1.20  
1.78  
0.10  
0.13 0.18
 
0.003 0.005 0.007  
D
E
e
L
2.9  
1.3  
1.9  
0.2  
3.04 0.11
 
0.114 0.12  
1.4 0.047
 
0.051 0.055  
2.04 0.07
 
0.075 0.081  
0.3 0.004
 
0.008 0.012  
L1 0.35  
0.54 0.69
 
0.014 0.021 0.029  
H

E  

2.10  
0°  
2.4  
—  
2.64 0.083
 
0.094 0.104  
10° 0°
 
— 10°  
θ
8.SOLDERING FOOTPRINT  
Rev.B May.
 
2020  
6/6  
Leshan Radio Company, LTD.