MASPOWER-MS10N120HGT1
| Part # | MASPOWER-MS10N120HGT1 |
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MS10N120HGC0/T1/E0
Planar Process N-Channel MOS
Features
V
DS
=1200V,I
D
=10A
R
DS(on)
<2Ω @ V
GS
=10V
High density cell design for ultra low Rdson
Low gate charge
Improved dv/dt capability
RoHS product
Applications
High Voltage Switched-mode and
resonant-mode power supplies
High Voltage Pulse Power Applications
High Voltage Discharge circuits in
Lasers Pulsers, Spark Igniters, RF
Generators
High Voltage DC-DC converters
High Voltage DC-AC inverters
Absolute Ratings
(
T
c=25
℃
)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V
DSS
V
GSS
1200
V
V
±
30
Drain Current-continuous
Drain Current-pulse(note1)
I
D
10
15
A
A
I
DM
Single Pulsed Avalanche Energy
(note2)
E
AS
PD
30
430
mJ
Maximum Power Dissipation
(TO-247)
Maximum Power Dissipation
(TO-263)
PD
277
W
Maximum Power Dissipation
(TO-220F)
PD
67.9
Operating and Storage
Temperature Range
Maximum lead temperature for
soldering purposes
T
J
,T
STG
TL
-55~+175
300
℃
℃
Electrical Characteristics
(T
CASE
=25
℃
unless otherwise specified)
H1.01
Maspower
1
MS10N120HGC0/T1/E0
Planar Process N-Channel MOS
Parameter
Symbol Tests
conditions Min
Typ Max
Units
Drain-Source Voltage
BV
DSS
I
DSS
I
D
=250uA,V
GS
=0V 1200
–
–
–
V
Zero Gate Voltage Drain
Current
V
DS
=V
DSS
,V
GS
=0V
–
–
1
μA
Gate-Body Leakage
Current
I
GSS
V
GS
=
±
30V
,
V
DS
=0V
–
±
100 nA
On-Characteristics
Gate Threshold Voltage
V
GS(th)
V
DS
=V
GS
,I
D
=250μA
V
GS
=10V,I
D
=1A
2.5
–
–
5.5
–
V
Static Drain-Source
On-Resistance
R
DS(ON)
2
Ω
Forward
V
DS
=20V,I
D
=5A
(note3)
g
fs
–
13
–
S
Transconductance
Dynamic Characteristics
Input capacitance
C
iss
–
–
1871
153
–
–
pF
pF
V
DS
=25V, V
GS
=0V,
f=1.0MHZ
Output capacitance
C
oss
Reverse transfer
capacitance
C
rss
–
9
–
pF
Electrical Characteristics
(T
CASE
=25
℃
unless otherwise specified)
Parameter
Symbol Tests
conditions Min
Typ Max
Units
Switching-Characteristics
Turn-On delay time
Turn-On rise time
Turn-Off delay time
Turn-Off rise time
t
d(on)
–
–
–
–
25
33
–
–
–
–
ns
ns
ns
ns
t
r
t
d(Off)
t
f
V
DS
=600V,I
D
=5A,
V
GS
=10V (note3,4)
150
50
Total Gate Charge
Gate-Source charge
Gate-Drain charge
Q
g
–
–
–
41
11
13
–
–
–
nC
nC
nC
V
DS
=600V,I
D
=5A,
V
GS
=10V (note3,4)
Q
gs
Q
gd
Drain-Source Diode Characteristics and Maximum Ratings
Maximum Continuous
Drain-Source Diode
Forward Curret
V
SD
V
GS
=0V,I
S
=10A
–
–
1.2
V
Diode Forward Current
Reverse recovery time
I
S
TC=25
℃
–
–
–
10
–
A
Trr
I
S
=5A,dI/dT=100A/μS
530
nS
H1.01
Maspower
2
MS10N120HGC0/T1/E0
Planar Process N-Channel MOS
VR=100V,VGS=0V
(note4)
Reverse recovery charge
Qrr
–
3.53
–
μC
Thermal Characteristic
Value
TO-263 TO-247 TO-220F
Parameter
Symbol
Unit
Thermal Resistance,junction
to
℃
/W
℃
R
th
(j-C)
R
th
(j-A)
0.45
40
0.35
36
1.84
62.5
Case
Thermal Resistance,junction
to
Ambient
/W
Notes:
1. Repetitive
Rating : Pulse width limited by maximum junction temperature
2. L
= 15 mH, IAS = 2 A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C
3. Pulse
T
est : Pulse width ≤ 300us, Duty cycle ≤ 2%
4. Essentially
independent of operating temperature
Order information
Order codes
Package
Packaging
MS10N120HGC0
MS10N120HGT1
MS10N120HGE0
TO-247
TO-220F
TO-263
Tube
Tube
Tube
H1.01
Maspower
3
MS10N120HGC0/T1/E0
Planar Process N-Channel MOS
Electrical Characteristics
H1.01
Maspower
4
MS10N120HGC0/T1/E0
Planar Process N-Channel MOS
H1.01
Maspower
5
MS10N120HGC0/T1/E0
Planar Process N-Channel MOS
Package Mechanical DATA
H1.01
Maspower
6
MS10N120HGC0/T1/E0
Planar Process N-Channel MOS
H1.01
Maspower
7
