MATSUKI-ME2N7002D
| Part # | MATSUKI-ME2N7002D |
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ME2N7002D
N-Channel MOSFET – ESD Protected
GENERAL DESCRIPTION
FEATURES
●
Simple Drive Requirement
●
Small Package Outline
●
ROHS Compliant
The ME2N7002D is the N-Channel logic enhancement mode power
field effect transistors are produced using high cell density , DMOS
trench technology. This high density process is especially tailored to
minimize on-state resistance. These devices are particularly suited
for low voltage application such as cellular phone and notebook
computer power management and other battery powered circuits
where high-side switching , and low in-line power loss are needed in
a very small outline surface mount package.
●
ESD Rating = 2000V HBM
Mechanical data
●
●
●
●
●
●
●
High density cell design for low R
DS(ON)
Voltage controlled small signal switching.
Rugged and reliable.
High saturation current capability.
High-speed switching.
Not thermal runaway.
The soldering temperature and time shall
not exceed 260
℃
for more than 10 seconds.
PIN CONFIGURATION
(SOT-23)
T
o
p View
Absolute Maximum Ratings
(T
A
=25
℃
Unless Otherwise Noted)
Parameter
Drain-Source Voltage
Symbol
Ratings
60
Unit
V
V
DS
V
GS
Gate-Source Voltage
±20
V
Continuous Drain Current
Pulsed Drain Current (Note 1)
I
D
300
mA
mA
I
DM
2000
0.35
P
D
@T
A
=25°C
P
D
@T
A
=75°C
T
J
,
T
s
tg
Maximum Power Dissipation
W
0.21
Operating Junction and Storage
T
e
mperature Range
Junction-to-Ambient Thermal Resistance
(PCB mounted) (Note 2)
-55 ~ 150
°C
R
θ
JA
357
°C/W
DCC
正式發行
Apr,2011-Ver1.0
01
ME2N7002D
N-Channel MOSFET – ESD Protected
Electrical Characteristics
(T
A
=25
℃
Unless Otherwise Specified)
Symbol
BV
DSS
V
GS(th)
g
fs
I
GSS
I
DSS
Parameter
Limit
Min. Typ. Max.
Unit
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Forward Transconductance
Gate Body Leakage
V
GS
=0, I
D
=10uA
60
–
–
–
–
–
–
–
–
2.5
–
V
V
V
DS
=V
GS
, I
D
=250uA
V
DS
=15V, I
D
=250mA
V
GS
= ±20V , V
DS
=0V
V
DS
=60V, V
GS
=0V
V
GS
=10V, I
D
=500mA
V
GS
=4.5V, I
D
=200mA
1.0
100
mS
uA
uA
–
–
–
–
±10
1
Zero Gate Voltage Drain Current
3
R
DS(ON)
Drain-Source On-State Resistance
Ω
4
Dynamic
I
D
=200mA , V
DS
=15V
V
GS
=4.5V
Q
g
Total Gate Charge
–
–
0.8
nC
nS
V
DD
=30V , R
L
=150
Ω
,
I
D
=200mA , V
GEN
=10V
R
G
=10
Ω
T
d(on)
T
d(off)
Turn-on Time
Turn-off Time
–
–
–
–
20
40
C
iss
C
oss
C
rss
Input Capacitance
–
–
–
–
–
–
35
10
5
V
GS
=0V
V
DS
=25V
pF
Output Capacitance
f=1.0MHz
Reverse Transfer Capacitance
Source-Drain Diode
Symbol
Parameter
Limit
Min. Typ. Max.
Unit
0.82 1.3
V
SD
Diode Forward Voltage
I
S
=200mA, V
GS
=0V
–
V
Notes
:
1. Maximum
DC current limited by the package
2. Surface
mounted on FR4 board, t
≦
5sec.
DCC
正式發行
Apr,2011-Ver1.0
02
ME2N7002D
N-Channel MOSFET – ESD Protected
Typical Characteristics (T
J
=25
℃
Noted)
DCC
正式發行
Apr,2011-Ver1.0
03
ME2N7002D
N-Channel MOSFET – ESD Protected
SOT-23 Package Outline
INCHES
MIN MAX
MILLIMETERS
DIM
MIN
MAX
3.04
1.40
1.11
0.5
A
B
C
D
G
H
J
0.1102 0.1197
2.80
0.0472 0.0551
1.20
0.0350 0.0440
0.89
0.0150 0.0200
0.37
0.0701 0.0807
1.78
2.04
0.0005 0.0040
0.013 0.100
0.0034 0.0070
0.085 0.177
K
L
0.007
–
0.018
–
0.0350 0.0401
0.89
0.0830 0.1039
2.10
0.0177 0.0236
0.45
1.02
2.64
0.60
S
V
DCC
正式發行
Apr,2011-Ver1.0
04
ME2N7002D
N-Channel MOSFET – ESD Protected
Device name:ME2N7002D
Package:SOT-23
Marking Code:
K72
K72: Device Marking Code
M: Date code
MONTH CODE
ODD YEARS(2007,2009)
EVEN YEARS(2006,2008)
Jan
Feb
Mar
Apr
May
Jun
Jul
1
2
Jan
Feb
Mar
Apr
May
Jun
Jul
E
F
3
H
J
4
5
K
L
N
P
6
7
Aug
Sep
Oct
Nov
Dec
8
Aug
Sep
Oct
Nov
Dec
9
U
X
Y
Z
T
V
C
DCC
正式發行
Apr,2011-Ver1.0
05
