MCC-Micro-Commercial-Components-MT200CB18T2-BP

Part #MCC-Micro-Commercial-Components-MT200CB18T2-BP
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MCC-Micro-Commercial-Components-MT200CB18T2-BP
M
T
200
C
B
08T2
THRU
M
T
200
C
B
18T2  
Features  
•
Lead Free Finish/RoHS Compliant (NOTE 1)(“P” Suffix  
designates RoHS Compliant.
 
See ordering information)  
•
International standard package  
•
Heat transfer through aluminum oxide DBC ceramic isolated  
metal baseplate  
•
Glass passivated chip  
•
Simple Mounting  
200
Amp  
THYRISTOR
/DIODE  
MODULE  
8
00
~1800
Volts  
Applications  
•
Power Converters  
•
Lighting Control  
•
DC Motor Control and Drives  
•
Heat and temperature control  
T
2  
M6  
V

RRM  

V

RSM  

O
MCC Part Number  
A
A
P
M
T
20
0C
B
08T2  
M
T
200
C
B
12T2  
M
T
200
C
B
16T2  
M
T
200
C
B
18T2  
8
00V  
9
00V  
1
3
00V  
1
7
00V  
19
00V  
C
D
Q
1
2
00V  
1600V  
1800V  
B
F
E
G
H
2
1
3
M
R
L
K
N
I
J
DIMENSIONS  
INCHES MM  
MIN MAX  
DIM  
NOTE  
MIN  
MAX  
A
B
C
D
E
F
G
H
I
0.894 0.917 22.50  
1.169 1.193 29.50  
23.50  
30.50  
9.50  
0.343 0.366  
0.323 0.343  
8.50  
8.00  
8.90  
1.051 1.075 26.50  
1.130 1.154 28.50  
0.120 0.130 79.50  
0.500 0.524 12.50  
2.501 2.531 63.50  
3.689 3.713 93.50  
27.50  
29.50  
80.50  
13.50  
64.50  
94.50  
J
K
L
0.256  
6.50  
∅
0.500 0.524 12.50  
13.50  
M
N
1.327 1.350 33.50  
34.50  
0.032X0.11  
0.8X2.8  
0.677 0.700 17.00  
18.00  
5.50  
5.50  
23.70  
O
P
0.185 0.209  
0.185 0.209  
4.50  
4.50  
Q
R
0.902 0.925 22.70  
Note:1. High Temperature Solder Exemptions Applied, See EU Directive Annex 7a.  
Rev.3-1-12212021  
1/
5
 

M
T
200
C
B
08T2
THRU
M
T
200
C
B
18T2  
◆
Diode  
Maximum Ratings  
Symbol  
Item  
Output Current(D.C.)  
Conditions  
Values  
200  
Units  
A
I
D  
I
FSM  
i

2

t  
Tc=85
℃
 
Surge forward current  
t=10mS Tvj =45
℃  
6800  
A
A

2

s  
Circuit Fusing Consideration  
Isolation Breakdown Voltage(R.M.S)  
Operating Junction Temperature  
Storage Temperature  
231200  
3000  
Visol  
Tvj  
a.c.50HZ;r.m.s.;1min  
V
-40 to +125  
-40 to +125  
3±15%  
5±15%  
165  
℃
Tstg  
Mt  
℃
Mounting Torque  
To terminals(M6)  
To heatsink(M6)  
Nm  
Nm  
g
Ms  
Weight  
Module
(
Approximately
)
 
Thermal Characteristics  
Symbol  
R
th(j-c)  
Item  
Conditions  
Junction to Case  
Values  
0.08  
Units  
℃
/W  
Thermal Impedance, max.  
Rth(c-s) Thermal
 
Impedance, max.  
Case to Heatsink  
0.05  
℃
/W  
Electrical Characteristics  
Values  
Min. Typ.  
Symbol  
V
FM  
Item  
Conditions  
Units  
Max.  
1.70  
Forward Voltage Drop, max.  
V
T=25
℃
I
F
=620A  
T
vj
=25
℃
V
RD
=V
RRM  
T
vj
=125
℃
V
RD
=V
RRM  
Repetitive Peak Reverse Current,  
max.  
≤0.5  
≤9  
mA  
mA  
I
RRM  
Rev.3-1-12212021  
2/
5
 

M
T
200
C
B
08T2
THRU
M
T
200
C
B
18T2  
◆
Thyristor  
Maximum Ratings  
Symbol  
Item  
Conditions  
Values  
Units  
I

TAV  

Average On-State Current  
Sine 180

o

;Tc=85
℃  
200  
A
T
T

VJ

=45
℃
t=10ms, sine  

VJ

=125
℃
t=10ms, sine  
5500  
5000  
I

TSM  

Surge On-State Current  
A
T
T

VJ

=45
℃
t=10ms, sine  

VJ

=125
℃
t=10ms, sine  
151000  
125000  
i

2

t  
Circuit Fusing Consideration  
A2s  
Visol  
Tvj  
Isolation Breakdown Voltage(R.M.S)
 
a.c.50HZ;r.m.s.;1min  
Operating Junction Temperature  
3000  
V
-40 to +130  
-40 to +125  
3
±
15%  
℃
Tstg  
Mt  
Storage Temperature  
℃
Mounting Torque  
To terminals(M6)  
To heatsink(M6)  
Nm  
Nm  
Ms  
5
±
15%  
Critical Rate of Rise of On-State  
Current  
T

VJ

= T

VJM

, 2/3V

DRM

,I

G

=500mA  
Tr<0.5us,tp>6us  
di/dt  
200  
A/us  
Critical Rate of Rise of Off-State  
Voltage, min.  
dv/dt  
a
T

J

=T

VJM

,2/3V

DRM

linear voltage rise  
1000  
50  
V/us  
m/s

2  

Maximum allowable acceleration  
Thermal Characteristics  
Symbol  
R
th(j-c)  
Item  
Conditions  
Junction to Case  
Values  
0.16  
Units  
℃
/W  
Thermal Impedance, max.  
Rth(c-s)  
Thermal Impedance, max.  
Case to Heatsink  
0.10  
℃
/W  
Electrical Characteristics  
Values  
Symbol  
Item  
Conditions  
Units  
V

TM  

Peak On-State Voltage, max.  
T=25
℃
I

T

=620A  
1.70  
V
Repetitive Peak Reverse Current,  
max. / Repetitive Peak Off-State  
Current, max.  
T

VJ

=T

VJM

,V

R

=V

RRM

,V

D

=  
V

DRM  

I

RRM

/I

DRM  

40  
mA  
For power-loss  
calculations only  
(T

VJ

=125
℃
)  
V

TO  

On state threshold voltage  
0.85  
1.5  
V
Value of on-state  
slope resistance. max  
r

T  

T

VJ

=T

VJM  

mΩ  
V

GT  

I

GT  

V

GD  

I

GD  

I

L  

Gate Trigger Voltage, max.  
Gate Trigger Current, max.  
Non-triggering gate voltage, max.  
Non-triggering gate current, max.  
Latching current, max.  
T

VJ

=25
℃
, V

D

=6V  
3
V
T

VJ

=25
℃
, V

D

=6V  
200  
0.25  
10  
mA  
V
T

VJ

=125
℃
,V

D

=2/3V

DRM  

T

VJ

=125
℃
, V

D

=2/3V

DRM  

T

VJ

=25
℃
, R

G

= 33 Ω  
T

VJ

=25
℃
, V

D

=6V  
mA  
mA  
mA  
300  
150  
1000  
400  
I

H  

Holding current, max.  
T

VJ

=25
℃
,  
I

G

=1A, diG/dt=1A/us  
tgd  
tq  
Gate controlled delay time  
1
us  
us  
Circuit commutated turn-off time  
T

VJ

=T

VJM  

100  
Rev.3-1-12212021  
2/
5  
MCCSEMI.COM  

M
T
200
C
B
08T2
THRU
M
T
200
C
B
18T2  
Performance Curves  
300  
W
300  
A
DC  
240  
sin.180  
rec.120  
DC  
200  
rec.60  
180  
sin.180  
rec.120  
rec.30  
120  
60  
rec.60  
rec.30  
100  
P

TAV  

0
I

TAVM  

0
0
I
TAV  
50  
100  
150  
A
200  
0
Tc  
50  
100  
℃
130  
Fig1. Power dissipation  
Fig2.Forward Current Derating Curve  
6000  
A
0.30  
50HZ  
℃
/ W  
Z
th(j-
S
)  
0.1  
3000  
Z
th(j-
C
)  
0
0
10  
100  
ms 1000  
0.001  
t
1
0.1  
00  
Fig3. Transient thermal impedance  
Fig4. Max Non-Repetitive Forward Surge  
Current  
Rev.3-1-12212021  
3/
5
 

M
T
200
C
B
08T2
THRU
M
T
200
C
B
18T2  
Performance Curves  
600  
A
Typ
.  
400  
200  
125
℃  
max
.  
I

T  

0
25
℃  
– –
 
125
℃  
0
V

TM  

0.5  
1.0  
1.5  
V
2.0  
Fig5. Forward Characteristics  
100  
1/2
·
MT200CB20T2  
V
20V;20
Ω  
10  
V

GT  

∧
PG(tp)  
1
-40
℃
 
25
℃  
T

vj  

125
℃  
V

GD125  

℃
I

GT  

V

G  

I

GD125  

℃
0.1  
0.001 I

G  

0.01  
0.1  
1
10  
A 100  
Fig6. Gate trigger Characteristics  
Rev.3-1-12212021  
4
/
5  
MCCSEMI.COM  

M
T
200
C
B
08T2
THRU
M
T
200
C
B
18T2  
Ordering Information  
Device  
Packing  
Part Number-BP  
Bulk
:
8
PCS/BOX ;
8
0
PCS/CTN  
***IMPORTANT NOTICE***  
Micro Commercial Components Corp
. reserves the right to make changes without further notice to any product herein to  
make corrections, modifications , enhancements , improvements , or other changes .
Micro Commercial Components  
Corp
. does not assume any liability arising out of the application or use of any product described herein; neither does it  
convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all  
risks of such use and will agree to hold
Micro Commercial Components Corp
. and all the companies whose products are  
represented on our website, harmless against all damages.  
***LIFE SUPPORT***  
MCC’s products are not authorized for use as critical components in life support devices or systems without the express  
written approval of Micro Commercial Components Corporation.  
***CUSTOMER AWARENESS***  
Counterfeiting of semiconductor parts is a growing problem in the industry. Micro Commercial Components (MCC) is taking  
strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages  
customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on  
our web page cited below. Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine  
parts, have full traceability, meet MCC’s quality standards for handling and storage.
MCC will not provide any warranty  
coverage or other assistance for parts bought from Unauthorized Sources
. MCC is committed to combat this global  
problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized  
distributors.  
Rev.3-1-12212021  
4/
5