MCC-Micro-Commercial-Components-SI2333-TP
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SI
2333
Features
•
TrenchFET Power Mosfet
•
Excellent R
DS(ON)
•
Epoxy Meets UL 94 V-0 Flammability Rating
•
Moisture Sensitivity Level 1
P
-Channel MOSFET
• Halogen
Free Available Upon Request By Adding Suffix “-HF”
• Lead
Free Finish/RoHS Compliant (“P” Suffix Designates RoHS
Compliant. See Ordering Information)
Maximum Ratings
•
•
•
•
Operating Junction Temperature Range : -55
o
C to +150
o
C
Storage Temperature Range: -55
o
C to +150
o
C
Thermal Resistance: 113
o
C/W Junction to Ambient
(Note 1)
Thermal Resistance: 357
o
C/W Junction to Ambient
(Note 2)
SOT-23
A
D
3
1
Parameter
Rating
-12
Unit
V
Symbol
V
DS
B
C
Drain -source Voltage
Gate -Source Voltage
2
V
GS
±
8
V
F
E
Drain Current-Continuous
(Note 1)
I
D
-6.0
-20
A
Drain Current-Pulse
I
D
M
A
H
G
J
0.35
(Note 2)
1.10
(Note 1)
L
Total
Power Dissipation
P
D
K
W
DIMENSIONS
MM
Internal Structure
INCHES
DIM
NOTE
MIN MAX MIN MAX
0.110 0.120
2.80
3.04
0.083 0.104
2.10 2.64
0.047 0.055
1.20 1.40
0.03
4
0.041
0.8
5
1.0
5
0.0
67
0.08
3
1.7
0
2.
10
0.018 0.024
0.45 0.60
D
A
B
C
D
E
F
G
H
J
1.
*$7
E
2.
6285&(
3.
‘5$,1
G
Marking:
S33
0.01 0.1
5
0.000
4
0.00
6
S
0.035
0.04
3
0.
90
1.1
0
0.003
0.007 0.08
0.18
0.01
2
0.020
0.3
0
0.51
K
L
0.020
0.50
0.00
7
0.20
Suggested Solder Pad Layout
0.
031
0.800
0.035
0.900
0.079
2.000
in
ches
mm
0.
037
0.950
0.037
0.950
Rev.3-1-
0
101
2019
1/4
SI
2333
ELECTRICAL CHARACTERISTICS (T
a
=25
℃
unless otherwise specified)
Parameter
Symbol
Test conditions
Min
Typ
Max
Unit
Static Characteristics
V
(BR)D
SS
V
GS(th)
I
GSS
V
GS
=0V, I
D
=
–
250µA
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
(Note 3)
Gate-Body Leakage Current
Zero Gate Voltage Drain Current
V
V
–
12
V
DS
=V
GS
, I
D
=
–
250µA
–
0.40
–
1.0
V
GS
=± 8V, V
DS
=0V
µA
µA
±0.1
I
DSS
V
DS
=
–
12V, V
GS
=0V
V
GS
=
–
4.5V, I
D
=
–
5.0A
–
1
28
32
40
63
Drain-Source On-Resistance
(Note 3)
R
DS(on)
V
GS
=
–
3.7V, I
D
=
–
4
.
6A
V
GS
=
–
2.5V, I
D
=
–
4
.
3A
mΩ
S
V
GS
=
–
1.8V, I
D
=
–
1
.0
A
V
GS
=
–
1.5V, I
D
=
–
0
.
5A
V
DS
=
-5
V, I
D
=
–
5.0A
150
Forward Tranconductance
(Note 3)
g
FS
18
Dynamic Characteristics
(Note 4)
C
iss
Input Capacitance
1275
V
DS
=
–
6V,V
GS
=0V, f=1MHz
C
oss
pF
Ω
Output Capacitance
255
236
C
rss
R
g
Reverse Transfer Capacitance
Gate Resistance
19
f =1MHz
1.9
Q
g
Total Gate Charge
21
1
4
Q
gs
Gate-Source Chage
2
.
3
V
DS
=
–
6
V,V
GS
=
-4.5
V,I
D
=
–
5
A
nc
Q
gd
Gage-Drain Charge
Turn-On Delay
Time
3.6
26
24
t
d(on)
40
40
t
r
Turn-On Rise Time
V
DD
=
–
6
V,V
G
EN
=
–
4.5V,
I
D
=-4A
R
L
=
6
Ω
,R
G
EN
=
1
Ω
ns
t
d(off)
t
f
45
70
35
Turn-Off Delay
Time
Turn-Off Fall
Time
2
0
S
ource-Drain Diode
Characteristics
T
C
=25
℃
–
1.
4
–
20
Diode Forward Current
A
A
I
S
I
S
M
V
SD
t
rr
Diode
Pulsed
Forward Current
Diode Forward Voltage
(Note 3)
Diode
Reverse Recovery Time
(Note
4
)
V
GS
=0V, I
S
=-4A
–
1.
2
V
48
ns
nc
24
8
I
F
=
-4A
,
dI/dt=100A/μs
Diode
Reverse Recovery Charge
(Note
4
)
Q
rr
16
Note:
1. Device Mounted On FR-4 Substrated Board, With Minimum Recommended Pad Layout, Single Side.
2. Device Mounted on No Heat Sink.
3.
Pulse Test: Pulse Width
≤
300μs,Duty Cycle
≤
2%.
4.
Guaranteed by Design, Not Subject to Production Testing.
Rev.3-1-
0
101
2019
2/4
SI
2333
Curve Characteristics
Fig. 2 – Transfer Characteristics
Fig. 1 – Output Characteristics
-20
-16
-12
-8
-20
-16
-12
-8
V
DS
= -3V
Pulesd
T
A
=25°C
Pulsed
V
GS
=-5V,-4V,3V,2.5V,2V
T
A
=100°C
T
A
=25°C
V
GS
=-1.5V
-4
-4
-0
-0.0
-0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
-0
-1
-2
-3
-4
-5
Gate To Source Voltage (V)
Drain To Source Voltage (V)
Fig. 4 – R
DS(ON)
—
V
GS
Fig. 3 – R
DS(ON)
—
I
D
100
80
60
40
20
0
70
60
50
40
30
20
10
T
A
=25°C
Pulsed
Pulsed
V
GS
=-1.5V
I
D
=-5A
V
GS
=-1.8V
V
GS
=-2.5V
T
A
=100°C
T
A
=25°C
V
GS
=-3.7V,-4.5V
-0
-1
-2
-3
-4
-5
-6
-1
-2
-3
-4
-5
-6
-7
-8
Gate To Source Voltage (V)
Drain Current (A)
Fig. 5 – I
S
—
V
SD
Fig. 6 – Threshold Voltage
-10
-1.0
-0.8
-0.6
-0.4
-0.2
-0.0
-1
I
D
= -250μA
T
A
=100°C
T
A
=25°C
-0.1
-0.01
-0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-1.2
-1.4
25
50
75
100
125
Junction Temperature
(°C)
Source To Drain Voltage (V)
Rev.3-1-
01012019
3/4
SI
2333
Ordering Information
Device
Packing
Part Number-TP
Tape&Reel:3Kpcs/Reel
Note : Adding “-HF” Suffix For Halogen Free,
eg. Part
Number-TP-HF
***IMPORTANT NOTICE***
Micro Commercial Components Corp.
reserve
s
the right to make changes without further notice to any product herein to
make corrections, modifications , enhancements , improvements , or other changes .
Micro Commercial Components
Corp .
does not assume any liability arising out of the application or use of any product described herein; neither does it
convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all
risks of such use and will agree to hold
Micro Commercial Components Corp .
and all the companies whose products are
represented on our website, harmless against all damages.
***LIFE SUPPORT***
MCC’s products are not authorized for use as critical components in life support devices or systems without the express
written approval of Micro Commercial Components Corporation.
***CUSTOMER AWARENESS***
Counterfeiting of semiconductor parts is a growing problem in the industry. Micro Commercial Components (MCC) is taking
strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages
customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on
our web page cited below. Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine
parts, have full traceability, meet MCC’s quality standards for handling and storage.
MCC will not provide any warranty
coverage or other assistance for parts bought from Unauthorized Sources
. MCC is committed to combat this global
problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized
distributors.
Rev.3-1-
01012019
4/4
