Me-TECH-MS3904T5-P
| Part # | Me-TECH-MS3904T5-P |
| Download | Me-TECH-MS3904T5-P |
MS3904T5-P
NPN
Transistor
ROHS
FEATURE
Switching Transistor
Collector-emitter voltage VCE=40V
Collector current IC=0.2A
M
arking:1N
SOT-523
ABSOLUTE MAXIMUM RATINGS (TA=25ºC, RH= 45%-75%, unl ess otherwisenoted)
Parameter
Symbol
V
CEO
V
CBO
V
EBO
I
C
Value
Unit
V
Collector Emitter Voltage
Collector Base Voltage
Emitter Base Voltage
Collector Current
40
60
V
6
200
V
mA
mW
℃
/W
℃
Power Dissipation
P
tot
150
833
Thermal Resistance from Junction to Ambient
Junction Temperature
R
Θ
JA
T
j
150
Storage Temperature Range
T
stg
– 55 to + 150
℃
Parameter
Symbol
BV
CEO
BV
CBO
BV
EBO
I
CEX
Test Condition
Min
40
60
6
Max
Unit
Collector-emitter breakdown voltage
Collector-base breakdown voltage
Emitter-base breakdown voltage
Collector cut-off current
IC=1mA , IB=0
V
V
IC=10μA ,IE=0
IE=10μA,IC=0
V
VCE=30V,VEB(off)=3V
VEB=5V,IC=0
50
nA
nA
Emitter cut-off current
I
EBO
100
VCE=1V,IC=0.1mA
VCE=1V,IC=1mA
VCE=1V,IC=10mA
VCE=1V,IC=50mA
IC=10mA,IB=1mA
IC=50mA,IB=5mA
IC=10mA,IB=1mA
IC=50mA,IB=5mA
VCE=20V,IC=10mA,f=100MHz
40
70
DC current gain
h
FE
100
60
300
0.2
0.3
V
V
Collector-emitter saturation voltage
V
CE(sat)
0.65
300
0.85
0.95
V
Base-emitter saturation voltage
Transition frequency
V
BE(sat)
f
T
V
MHZ
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MS3904T5-P
NP
N
Transistor
ROHS
250
200
15
10
150
100
50
5
0
0.1
0
100
200
1
10
CB
, COLLECTOR-BASE VOLTAGE (V)
100
T
A
, AMBIENT TEMPERATURE (°C)
V
Fig. 1, Power Derating Curve
Fig. 2, Input and Output Capacitance vs.
Collector-Base Voltage
1,000
1
T
A
= 125°C
100
10
T
A
= +25°C
T
A
= -25°C
0.1
V
CE
= 1.0V
0.01
1
0.1
0.1
1
10
1,000
100
1
1,000
10
I
C
, COLLECTOR CURRENT (mA)
Fig. 3, Typical DC Current Gain vs. Collector Current
100
I
C
, COLLECTOR CURRENT (mA)
Fig. 4, Typical Collector-Emitter
Saturation Voltage vs. Collector Current
10
1
0.1
0.1
10
1,000
100
1
I
C
, COLLECTOR CURRENT (mA)
Fig. 5, Typical Base-Emitter
Saturation Voltage vs. Collector Current
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MS3904T5-P
NP
N
Transistor
ROHS
PACKAGE
Dimensions In Millimeters
Symbol
Min
Max
A
A1
A2
b1
b2
C
D
E
E1
e
e1
L
0.700
0.000
0.700
0.150
0.250
0.100
1.500
0.700
1.450
0.900
0.100
0.800
0.250
0.350
0.200
1.700
0.900
1.750
0.500 TYP
0.400 REF
0.900
1.100
L1
θ
0.260
0°
0.460
8°
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MS3904T5-P
NP
N
Transistor
ROHS
Soldering Parameters
Reflow Condition
Pb – Free assembly
Temperature Min (T
s(min)
Temperature Max (T
s(max)
)
)
150°C
200°C
Pre Heat
Time (min to max) (ts )
60 – 190 secs
Average ramp up rate (Liquidus Temp) (T
L
) to peak
5°C/second max
5°C/second max
Temperature (T
L
) (Liquidus)
217°C
60 – 150 seconds
260+0/-5
°
C
Reflow
Temperature (t
L
)
Time within actual peak Temperature (t
Ramp-down Rate
p
)
20 – 40 seconds
5°C/second max
8 minutes Max.
280°C
Time 25°C to peak Temperature (T
Do not exceed
P
)
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MS3904T5-P
NP
N
Transistor
ROHS
Page
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