Meritek-SIM02121Y2A0M32

Chip Ferrite Bead  

High Current Type  

SIM02-32 series  

F

EATURE  

•

Operating temperature: -40ºC ~ +125ºC (Including self-temperature rise)  

•

Monolithic inorganic material construction.  

•

Closed magnetic circuit avoids crosstalk.  

•

Excellent solderability and heat resistance  

•

High reliability  

•

Low DC resistance electrode structure  

P

ART

N

UMBERING

S

YSTEM  

SIM 02 100  

Y

2A5  

32  

(6)  

(1)  

(2)  

(3)  

(4)  

(5)  

No  

item  

Code  

Description  

(1)  

(2)  

(3)  

(4)  

(5)  

(6)  

Product Code  

Dimension  

SIM  

02  

Signal Chip Inductor, Multi-Layer Chip Ferrite Bead Type  

02: 0402, 1.0×0.50mm  

100: 1

0Ω  

See Dimension Table  

Impendence  

Tolerance  

100  

Y

First two: Significant, Third: Multiplier  

-25% ~ +25%  

Y: ±25%  

Rated Current  

Series Code  

2A5  

32  

2A5: 2.5A  

Max Current, ‘A’ denotes decimal point  

Internal Control Code  

Chip Ferrite Bead, High Current Type  

D

IMENSIONS  

Size Code  

A (mm)  

B (mm)  

C (mm)  

D (mm)  

E (mm)  

0.35  

0.50  

0.80  

1.05  

1.05  

1.05  

1.05  

F (mm)  

0.30  

0.40  

0.85  

1.00  

2.20  

3.30  

3.30  

G (mm)  

0.40  

0.60  

0.95  

1.45  

1.80  

1.80  

3.40  

SIM01 (0201)  

SIM02 (0402)  

SIM03 (0603)  

SIM05 (0805)  

SIM06 (1206)  

SIM86 (1806)  

SIM82 (1812)  

0.60±0.03  

1.00±0.10  

1.60±0.15  

2.00±0.20  

3.20±0.20  

4.50±0.20  

4.50±0.20  

0.30±0.03  

0.50±0.10  

0.80±0.15  

1.25±0.20  

1.60±0.20  

1.60±0.20  

3.20±0.20  

0.30±0.03  

0.50±0.10  

0.80±0.15  

0.85±0.20  

1.10±0.20  

1.60±0.20  

1.50±0.20  

0.15±0.05  

0.25±0.10  

0.30±0.20  

0.50±0.30  

0.50±0.30  

0.50±0.30  

0.50±0.30  

Rev. 8b 02/25/21  

Meritek Electronics Corporation

Chip Ferrite Bead  

High Current Type  

SIM02-32 series  

E

LECTRICAL

C

HARACTERISTICS  

Impedance  

Tolerance  

(%)  

Test Frequency  

DCR  

(Ω)

Max  

Rated Current  

(mA)  

Size  

Part Number  

(Ω)  

(MHz)  

100  

100  

100  

100  

100  

100  

SIM02100Y2A532  

SIM02121Y2A032  

SIM02221Y1A532  

SIM02330Y3A032  

SIM02600Y2A532  

SIM02800Y2A332  

10  

±25  

±25  

±25  

±25  

±25  

±25  

0.05  

2500  

2000  

1500  

3000  

2500  

2300  

120  

220  

33  

0.095  

0.15  

0402  

0.022  

0.032  

0.038  

60  

80  

C

HARICTERISTIC

C

URVES  

SIM02100Y2A532  

SIM02121Y2A032  

Frequency (MHz)  

Frequency (MHz)  

SIM02221Y1A532  

SIM02330Y3A032  

Frequency (MHz)  

Frequency (MHz)  

SIM02600Y2A532  

SIM02800Y2A332  

Frequency (MHz)  

Frequency (MHz)  

Rev. 8b 02/25/21  

Meritek Electronics Corporation

Chip Ferrite Bead  

High Current Type  

SIM02-32 series  

R

ECOMMENDED

S

OLDERING

P

ROFILES  

Reflow Condition  

Temp. Min T

s(min)  

Temp. Max T

s(max)  

Time (min. to max.) (t

s

)  

Temp. (T

L

)  

150°C  

200°C  

Pre  

Heat  

60 ~180 seconds  

217°C  

Reflow  

Time (min. to max.) (t

L

)  

60 ~150 seconds  

260°C  

Peak Temperature (T

P

)  

Time within 5°C of actual peak  

Temperature (t

p

)  

10 seconds max.  

3 times Max.  

Reflow times:  

D

ERATING

C

URVE  

Derating Curve  

Environment

T

e

mperature

+Δ

T

e

mperature (°C)  

Rev. 8b 02/25/21  

Meritek Electronics Corporation

Chip Ferrite Bead  

High Current Type  

SIM02-32 series  

R

ELIABILITY

T

EST

C

ONDITON

A

ND

R

EQUIREMENT  

Item  

Test Conditions  

Requirement  

Temperature  

Rise Test  

Applied the allowed DC current.  

T

e

mperature measured by digital surface thermometer.  

Rated Current <

1A ΔT 20

℃

Max.  

Rated Current

≧

1A ΔT 40

℃

Max.  

Preheat: 150°C for 60sec., Solder: Sn:96.5% – Ag:3% – Cu:0.5%  

Solderability

Solder temperature: 245±5°C, Flux for lead free: Rosin. 9.5%  

More than 95% of the terminal  

electrode should be covered with  

solder.  

Depth: completely cover the termination. Dip time: 4±1sec.  

Resistance  

to Soldering  

Heat  

Solder temperature: 260±5°C for 10±1 seconds;  

T

e

mperature ramp/immersion and emersion rate: 25mm/s ±6 mm/s.  

Depth: Completely cover the termination.  

Appearance: no damage.  

Impedance: within±15%of initial value.  

Inductance: within±10%of initial value.  

Preconditioning: Run through IR reflow for 2 times.  

Oscillation Frequency: 10~2K~10 Hz for 20 minutes  

Equipment: Vibration checker,

T

o

tal Amplitude:1.52mm ± 10%  

T

e

sting Time: 12 hours (20 minutes, 12 cycles each of 3 orientations)  

Appearance: no damage.  

Impedance: within±15%of initial value.  

Inductance: within±10%of initial value.  

Vibration  

Shock  

T

e

st condition:  

Peak  

Value  

(g’s)  

50  

Normal  

duration  

(ms)  

Velocity  

change  

(ft/sec)  

11.3  

Wave  

From  

Appearance: no damage.  

Impedance: within±10%of initial value.  

Inductance: within±10%of initial value.  

Type  

SMD  

Lead  

11  

Half-sine  

Half-sine  

50  

11  

11.3  

Preconditioning: Run through IR reflow for 2 times.  

With component mounted on a PCB apply a force  

>0805:1kg, <=0805:0.5kg  

to the side of a device being tested. This force shall be applied for 60 +1  

seconds. Also, the force shall be applied gradually as not to shock the  

component being tested.  

Appearance: no damage.  

Impedance: within±15%of initial value.  

Inductance: within±10%of initial value.  

Terminal  

strength  

Preconditioning: Run through IR reflow for 2 times.  

Number of cycles: 500. Condition for 1 cycle:  

No.  

Temp. (°C)  

Time (min.)  

30±5  

Appearance: no damage.  

Impedance: within±15%of initial value.  

Inductance: within±10%of initial value.  

Thermal  

Shock  

1

-40±2°C  

2

25±2°C  

≤30 seconds  

30±5  

3

+125±2°C  

Measured at room temperature after placing for 24±2 hrs.  

Shall be mounted on a FR4 substrate of the  

following dimensions:  

Appearance: no damage.  

Impedance: within±10%of initial value.  

Inductance: within±10%of initial value.  

Dimensions  

Bending depth  

Bending  

>=0805:40x100x1.2mm  

<0805:40x100x0.8mm  

1.2mm  

0.8mm  

Duration of 10 sec for a min.  

Preconditioning: Run through IR reflow for 2 times.  

Humidity: 85±2%R.H.

T

e

mperature: 85±2°C.  

Duration: 1000hrs Min. with 100% rated current.  

Measured at room temperature after 24±2 hrs.  

Appearance: no damage.  

Impedance: within±15%of initial value.  

Inductance: within±10%of initial value.  

Load  

Humidity  

Preconditioning: Run through IR reflow for 2 times.  

T

e

mperature: 125±2°C  

Applied current: rated current. Duration: 1000±12 Hrs.  

Measured at room temperature after 24±2 Hrs.  

Appearance: no damage.  

Impedance: within±15%of initial value.  

Inductance: within±10%of initial value.  

Life Test  

Rev. 8b 02/25/21  

Meritek Electronics Corporation

Chip Ferrite Bead  

High Current Type  

SIM02-32 series  

P

ACKAGING

S

PECIFICATIONS  

Reel Specification & Packaging Quantity  

Reel Dimension (mm)  

Size  

Quantity  

Paper 15K  

Paper 10K  

Paper 4K  

Paper 4K  

Plastic 3K  

Plastic 2K  

Plastic 1K  

Tape Width  

8mm  

Reel Diameter  

A

B

C

D

0201  

0402  

0603  

0805  

1206  

1806  

1812  

7”  

7”  

7”  

7”  

7”  

7”  

7”  

9.5±0.5  

9.5±0.5  

9.5±0.5  

9.5±0.5  

9.5±0.5  

13.5±0.5  

13.5±0.5  

60.0+2.0  

60.0+2.0  

60.0+2.0  

60.0+2.0  

60.0+2.0  

60.0+2.0  

60.0+2.0  

13.5±0.5  

13.5±0.5  

13.5±0.5  

13.5±0.5  

13.5±0.5  

13.5±0.5  

13.5±0.5  

178.0±2.0  

178.0±2.0  

178.0±2.0  

178.0±2.0  

178.0±2.0  

178.0±2.0  

178.0±2.0  

8mm  

8mm  

8mm  

8mm  

12mm  

12mm  

P

ACKAGING

S

PECIFICATIONS  

Paper Tape Specification  

Plastic Tape Specification  

Paper Tape Dimension (mm)  

Size  

A0  

B0  

W

F

P

0  

P

P

2  

–

D

t

Ko  

0201  

0402  

0603  

0603*  

0805  

0.4±0.06  

0.7±0.06  

1.12±0.03  

1.80±0.05  

1.78±0.03  

2.1±0.05  

8±0.3  

8±0.3  

8±0.1  

8±0.1  

8±0.1  

3.5±0.05  

3.5±0.05  

3.5±0.1  

3.5±0.1  

3.5±0.1  

4±0.1  

4±0.1  

4±0.1  

4±0.1  

4±0.1  

2±0.05  

2±0.05  

4±0.1  

4±0.1  

4±0.1  

1.5+0.1  

0.45max  

0.6±0.03  

0.95±0.05  

0.75±0.03  

0.95±0.05  

0.45max  

0.62±0.03  

0.96+0.05/-0.03  

0.97±0.03  

1.3±0.05  

–

1.5+0.1  

0.6±0.03  

0.95±0.05  

0.75±0.03  

0.95±0.05  

2±0.1  

2±0.1  

2±0.1  

1.56+0.1/-0.05  

1.56+0.1/-0.05  

1.56+0.1/-0.05  

Plastic Tape Dimension (mm)  

Size  

A0  

B0  

W

F

P

P

0  

P

2  

D1  

t

Ko  

1206  

1806  

1812  

1.75±0.1  

1.75±0.1  

3.45±0.1  

3.35±0.1  

4.7±0.1  

4.7±0.1  

8±0.1  

12±0.1  

12±0.1  

3.5±0.05  

5.5±0.05  

5.5±0.05  

4±0.1  

4±0.1  

8±0.1  

4±0.1  

4±0.1  

4±0.1  

2±0.05  

2±0.05  

2±0.05  

1±0.1  

0.23±0.05  

0.24±0.05  

0.24±0.05  

1.25±0.1  

1.75±0.1  

1.60±0.1  

1.5±0.1  

1.5±0.1  

Notes:

*0603 impedance value

26Ω,

thickness is 0.60mm  

*Specifications subject to change without notice.  

Rev. 8b 02/25/21  

Meritek Electronics Corporation