MetalLions-ACM1211F-701T80
| Part # | MetalLions-ACM1211F-701T80 |
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ACM
1211
F
Series
SMD Common Mode Filters
FEATURES
■
Winding type realizes small size and low profile
■
Prevention of common mode noise at high frequency
Excellent solderability
■
■
Operating temperature -40~+125
℃
(Including self – temperature rise)
■
RoHS Compliant
FEATURES
■
Power line noise countermeasure for electronic equipment (Notebook, server applications, Battery , etc.)
Best for high current circuit such as car
■
■
Wireless charging and power device design
Explanation of Part Number
ACM 1211 F
–
70
1
T
80
1
2 3 4 5
6
1:Product Series:
Wire Wound Chip Common Mode Filters
♦
♦
2
:
Dimensions:
♦
3:
Material Code:Ferrite
♦
♦
4:
Common Mode Impedance
(Ω)
5
:
Packing(Tape & Reel
）
6
:
Rated Current
：
80
=
80
00mA
♦
Shapes and Dimensions
[Dimensions in mm]
A: 12.0±0.5
A1: 12.5±0.5
B: 10.8±0.5
C: 8.5
Max.
D: 7.0
Typ.
E: 2.7±0.2
F: 2.5±0.2
G: 2.5±0.2
mm
mm
mm
mm
mm
mm
mm
mm
1
2
4
3
4
3
1
172
2
Equivalent circuit
Land Pattern: [mm]
ACM
1211
F
Series
SMD Common Mode Filters
Electrical Characterisitics:
Impedance
（
Ω
）
@100MHz
Insulation
DC
Resistance
(mΩ) Max
Rated Current
(A) Max
Rated Voltage
(V) Max
Resistance
Part Number
Marking
(MΩ) Min
MIN
80
TYP
230
2.0
4.0
ACM1211F-800T100
ACM1211F-301T90
ACM1211F-501T80
ACM1211F-701T80
ACM1211F-801T80
ACM1211F-102T60
ACM1211F-222T18
ACM1211F-272
T
15
10.0
9.0
8.0
8.0
8.0
6.0
1.8
1.5
125
125
125
125
125
125
125
125
10
10
10
10
10
10
10
10
800
301
501
701
801
102
222
272
200
300
500
600
750
2200
2300
300
5.5
6.0
8.0
14
500
700
800
1000
2500
2700
35
50
Rated Current
：
Based on temperature rise
(
△
T
：
40
℃
TYP.)
TYPICAL ELECTRICAL CHARACTERISTICS
Impedance VS. Frequency
ACM1211F-800T100
ACM1211F-301T90
TEST EQUIPMENT
Impedance
Measured by using HP4291B RF Impedance Analyzer.
Measurement terminal
④
①
②
③
DC Resistance
Measured by using Chroma 16502 milliohm meter.
Measurement terminal
④
①
②
③
Insulation Resistance
Measured by using Chroma 19073
Measurement voltage : 50v ,Measurement time : 60 sec.
Measurement terminal
④
①
②
③
Reliability Test
MECHANICAL
TEST ITEM
SPECIFICATION
The product shall be connected to the test
TEST DETAILS
Solder ability
Apply cream solder to the printed circuit board .
circuit board by the fillet (the height is 0.2mm).
Refer to clause 8 for Reflow profile.
Resistance to
There shall be no damage or problems.
Temperature profile of reflow soldering
soldering
300
Soldering heat
(reflow soldering)
(Peak temperature 260
±
3
℃
10 sec)
250
200
150
100
50
30 sec Min
(230
+0
℃
)
Pre-heating
Slow cooling
(Stored at room
temperature)
150 ~ 180
℃
10
sec
.
2 min
2 min. or more
The specimen shall be passed through the reflow oven
with the condition shown in the above profile for 1 time.
The specimen shall be stored at standard atmospheric
eric conditions for 1 hour, after which the measurement
shall be made.
Terminal strength
The terminal electrode and the ferrite must
not damaged.
Solder a chip to test substrate , and then laterally apply
a load 9.8N in the arrow direction.
Strength on PC board
The terminal electrode and the ferrite must
Solder a chip to test substrate and then apply a load.
bending
not damaged.
Impedance:Within±20% of the initial value.
After the samples shall be soldered onto the test circuit
High
Insulation resistance and DC resistance on the
board,the test shall be done.
temperature
resistance
specification(refer to clause 2-1) shall be met.
The terminal electrode and the ferrite must not
damaged.
Measurement : After placing for 24 hours min.
Temperature : +125±2
℃
Applied voltage : Rated voltage
Applied current : Rated current
Testing time : 500±12 hours
MECHANICAL
TEST ITEM
SPECIFICATION
TEST DETAILS
Humidity
Impedance:Within±20% of the initial value.
After the samples shall be soldered onto the test circuit
resistance
Insulation resistance and DC resistance on the
board,the test shall be done.
specification(refer to clause 2-1) shall be met.
The terminal electrode and the ferrite must not
damaged.
Measurement : After placing for 24 hours min.
Temperature : +60±2
℃
, Humidity : 90 to 95 %RH
Applied voltage : Rated voltage
Applied current : Rated current
Testing time : 500±12 hours
Thermal shock
Impedance:Within±20% of the initial value.
Insulation resistance and DC resistance on the
specification(refer to clause 2-1) shall be met.
The terminal electrode and the ferrite must
not damaged.
1 cycle
30 min.
30 sec
+125
℃
-40
℃
30 min.
Impedance:Within±20% of the initial value.
After the samples shall be soldered onto the test
Low
Insulation resistance and DC resistance on the
circuit board,the test shall be done.
temperature
storage
specification(refer to clause 2-1) shall be met.
The terminal electrode and the ferrite must
not damaged.
Measurement : After placing for 24 hours min.
Temperature : -40±2
℃
Testing time : 500±12 hours
Vibration
Impedance:Within±20% of the initial value.
Insulation resistance and DC resistance on
the specification(refer to clause 2-1)
shall be met.
After the samples shall be soldered onto the test circuit
board,the test shall be done.
Frequency : 10 to 55 Hz
Amplitude : 1.52 mm
The terminal electrode and the ferrite must
not damaged.
Dimension and times : X ,Y and Z directions
for 2 hours each.
New solder More than 75%
Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated
over the whole of the sample before hard, the sample shall
then be preheated for about 2 minutes in a temperature
of 130
～
150
℃
and after it has been immersed to a depth
0.5mm below for 3±0.2 seconds fully in molten solder
M705 with a temperature of 245±2
℃
. More than 75% of the
electrode sections shall be couered
Solderability
with new solder smoothly when the sample is taken out
of the solder bath.
Packaging
Tape width
24 mm
Distance
16 mm
Pull-of force
10~120g
Packing Quantity
5
00 pcs./reel
