Microchip-Tech-APL602J

Part #Microchip-Tech-APL602J
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Microchip-Tech-APL602J
APL602J  
600V 43A 0.125
Ω
 
S
S
LINEAR MOSFET  
Linear Mosfets are optimized for applications operating in the Linear  
region where concurrent
 
high voltage and high current can occur at  
near DC conditions (>100 msec).  
D
G
SOT-227  
“UL Recognized”  
ISOTOP

®  

• Higher FBSOA  
• Popular SOT-227 Package  
D
S
• Higher Power Dissipation  
G
MAXIMU
M
R
ATINGS  
All Ratings:
 
T =
 
25°C unless otherwise specified.  
C
APL602J  
600  
UNIT  
Symbol  
Parameter  
V

DSS  

Drain-Source Voltage  
Volts  
I

D  

Continuous Drain Current @ T

C

= 25°C  
43  
Amps  
Volts  
1
I

D
M  

Pulsed Drain Current  
172  
V

GS  

V

GSM  

Gate-Source Voltage Continuous  
Gate-Source Voltage Transient  
±30  
±40  
Watts  
W/°C  
Total Power Dissipation @ T

C

= 25°C  
Linear Derating Factor  
565  
P

D  

4.52  
-55 to 150  
300  
T

J

,T

STG  

T

L  

Operating and Storage Junction Temperature Range  
°C  
Amps  
mJ  
Lead Temperature: 0.063″ from Case for 10 Sec.  
1
I

AR  

Avalanche Current  
(Repetitive and Non-Repetitive)  
43  
1
E

AR  

E

AS  

50  
Repetitive Avalanche Energy  
Single Pulse Avalanche Energy  
4
3000  
STATI
C
E
LECTRICA
L
C
HARACTERISTICS  
Symbol Characteristic
 
/ Test Conditions / Part Number  
MIN  
600  
43  
TYP  
MAX  
UNIT  
Volts  
BV

DSS  

I

D

(ON)  
Drain-Source Breakdown Voltage (V

GS

= 0V, I

D

= 250 µA)  
On State Drain Current
 

2

(V

DS

> I

D

(ON) x R

DS

(ON) Max, V

GS

= 12V)  
Drain-Source On-State Resistance
 

2

(V

GS

= 12V, 21.5A)  
Zero Gate Voltage Drain Current
 
(V

DS

= 600V, V

GS

= 0V)  
Zero Gate Voltage Drain Current
 
(V

DS

= 480V, V

GS

= 0V, T

C

= 125°C)  
Gate-Source Leakage Current
 
(V

GS

= ±30V, V

DS

= 0V)  
Gate Threshold Voltage
 
(V

DS

= V

GS

, I

D

= 2.5mA)  
Amps  
Ohms  
R

DS

(ON)  
0.125  
25  
I

DSS  

µA  
250  
±100  
4
I

GSS  

nA  
V

GS

(TH)  
2
Volts  
CAUTION:
These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  

APL602J  
UNIT  
DYNAMIC CHARACTERISTICS  
Symbol Characteristic  
Test Conditions  

GS

= 0V  
MIN  
TYP  
7600  
1280  
620  
13  
MAX  
9000  
1810  
930  
26  
C

iss  

C

oss  

C

rss  

t

d

(on)  
t

r  

Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Rise Time  
V
V

DS

= 25V  
f = 1 MHz  
pF  
ns  
V

GS

= 15V  
V

DD

= 0.5 V

DSS  

24  
48  
I

D

= 43A @ 25°C  
t

d

(off)  
t

f  

58  
87  
Turn-off Delay Time  
Fall Time  
R

G

= 0.6
Ω
 
14  
17  
THERMA
L
C
HARACTERISTICS  
Symbol Characteristic  
MIN  
TYP  
MAX  
.22  
40  
UNIT  
R

θ
JC  

R

θ
JA  

Junction to Case  
°C/W  
Junction to Ambient  
V

Isolation

RM
S
V
oltag
e
(50-6
0
H
z
S
inusoida
l
W
avefor
m
F
ro
m
T
erminal
s
t
o
M
ountin
g
B
as
e
f
o
r
1
M
in.)  
Volts  
lb•in  
2500  
Maximum Torque for Device Mounting Screws and Electrical Terminations.  
Torque  
10  
1
2
3
Repetitive Rating: Pulse width limited by maximum junction  
See MIL-STD-750 Method 3471  
4
temperature.  
Starting T = +25°C, L = 3.24mH, R
 
= 25
Ω
, Peak I
 
= 43A  
j G
 
L  
Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%  
AP
T
R
eserve
s
t
h
e
r
igh
t
t
o
c
hange
,
w
ithou
t
n
otice
,
t
h
e
s
pecification
s
a
n
d
i
nformatio
n
c
ontaine
d
h
erein.  
0.25  
0.9  
0.20  
0.7  
0.15  
0.5  
Note:  
0.10  
t
1
0.3  
t
2
0.05  
t
1
Duty Factor
 
D =  
Peak T
 
= P
 
x Z  
/
t
2
+ T  
0.1  
0.05  
J
DM
θ
JC  
C
SINGL
E
P
ULSE  
10

-3  

0
10

-5  

10

-4  

10

-2  

10

-1  

1.0  
10  
RECTANGULA
R
P
ULS
E
D
URATIO
N
(
SECONDS)  
FIGUR
E
1
,
M
AXIMU
M
E
FFECTIV
E
T
RANSIEN
T
T
HERMA
L
I
MPEDANCE
,
J
UNCTION-TO-CAS
E
v
s
P
ULS
E
D
URATION  
RC MODEL  
Junction  
temp. ( ”C)  
0.0520  
0.155  
0.0261F  
0.423F  
Power  
(Watts)  
0.0126  
67.451F  
Case temperature  
FIGUR
E
1
a
,
T
RANSIENT THERMAL IMPEDANCE MODEL  

Typical Performance Curves  
APL602J  
120  
120  
100  
80  
V
=10V, 15 V  
GS  
V
=10, 15V  
GS  
100  
80  
8 V  
8 V  
7.5 V  
7.5 V  
60  
60  
40  
20  
0
7 V  
7 V  
40  
6.5 V  
6.5 V  
6 V  
6 V  
20  
0
5.5 V  
5.5 V  
0
50  
100  
150  
200  
250  
0
5
10  
15  
20  
25  
30  
V
,
D
RAIN-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
V
,
D
RAIN-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
DS  
DS  
FIGUR
E
2
,
H
IGH OUTPU
T
C
HARACTERISTICS  
FIGUR
E
3
,
L
OW OUTPU
T
C
HARACTERISTICS  
80  
60  
40  
1.30  
1.20  
1.10  
1.00  
0.90  
NORMALIZED TO  
V
> I
 
(ON) x  
R
(ON)MAX.  
DS  
DS  
D
V
= 10V
 
@ 21.5A  
GS  
250µSEC. PULSE TEST  
@ <0.5 % DUTY CYCLE  
V
=10V  
GS  
T
= +125°C  
J
20  
0
V
=20V  
100  
GS  
T
= -55°C  
0.80  
0.70  
J
T
= +25°C  
2
J
0
V
4
6
8
10  
0
20  
40  
60  
80  
120  
,
G
ATE-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
I
,
D
RAI
N
C
URREN
T
(
AMPERES)  
GS  
D
FIGUR
E
4
,
T
RANSFE
R
C
HARACTERISTICS  
FIGUR
E
5
,
R
(
ON
)
v
s
D
RAI
N
C
URRENT  
DS  
1.15  
45  
40  
35  
30  
25  
20  
15  
10  
1.10  
1.05  
1.00  
0.95  
0.90  
05  
0
25  
50  
75  
100  
125  
150  
-50  
0
50  
100  
150  
T
,
C
AS
E
T
EMPERATUR
E
(
°C)  
T
,
J
UNCTIO
N
T
EMPERATUR
E
(
°C)  
C
J
FIGUR
E
6
,
M
AXIMU
M
D
RAI
N
C
URREN
T
v
s
C
AS
E
T
EMPERATURE  
FIGUR
E
7
,
B
REAKDOW
N
V
OLTAG
E
v
s
T
EMPERATURE  

APL602J  
2.5  
2.0  
1.5  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
I
= 21.5A  
= 12V  
D
V
GS  
1.0  
0.5  
0.0  
-50 -25  
0
25  
50  
75 100
 
125 150  
-50 -25  
0
25  
50  
75 100
 
125 150  
T
,
J
UNCTIO
N
T
EMPERATUR
E
(
°C)  
T
,
C
AS
E
T
EMPERATUR
E
(
°C)  
J
C
FIGUR
E
8
,
O
N-RESISTANC
E
v
s
.
T
EMPERATURE  
FIGUR
E
9
,
T
HRESHOL
D
V
OLTAG
E
v
s
T
EMPERATURE  
172  
30,000  
OPERATIO
N
H
ERE  
LIMITE
D
B
Y
R
(
ON)  
DS  
100  
100µS  
10,000  
5,000  
C
C
iss  
10  
5
1mS  
oss  
10mS  
100mS  
1,000  
500  
C
rss  
1
T
=+25°C  
C
T =+150°C  
J
SINGL
E
P
ULSE  
D
C
L
ine  
.1  
100  
1
V
5
10  
50 100  
600  
.01  
.1  
1
10  
50  
,
D
RAIN-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
V
,
D
RAIN-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
DS  
DS  
FIGUR
E
1
0
,
M
AXIMU
M
S
AF
E
O
PERATIN
G
A
REA  
FIGUR
E
1
1, CAPACITANC
E
v
s
D
RAIN-TO-SOURC
E
V
OLTAGE  
SOT-22
7
(
ISOTOP

®

)
P
ackag
e
O
utline  
11.8 (.463)  
12.2 (.480)  
31.5 (1.240)  
31.7 (1.248)  
8.9 (.350)  
9.6 (.378)  
W=4.1 (.161)  
W=4.3 (.169)  
H=4.8 (.187)  
H=4.9 (.193)  
(4 places)  
7.8 (.307)  
8.2 (.322)  
Hex Nut M4  
(4 places)  
25.2 (0.992)  
25.4 (1.000)  
r = 4.0 (.157)  
(2 places)  
4.0 (.157)  
4.2 (.165)  
(2 places)  
0.75 (.030)
 
12.6 (.496)  
0.85 (.033)
 
12.8 (.504)  
3.3 (.129)  
3.6 (.143)  
1.95 (.077)  
2.14 (.084)  
14.9 (.587)  
15.1 (.594)  
* Source  
Drain  
30.1 (1.185)  
30.3 (1.193)  
* Source terminals are shorted  
internally. Current handling  
capability is equal for either  
Source terminal.  
38.0 (1.496)  
38.2 (1.504)  
* Source  
Dimensions in Millimeters and (Inches)  
Gate  
ISOTOP

®

i
s
a
R
egistere
d
T
rademar
k
o
f
S
G
S
T
homson.