Microchip-Tech-APT10021JLL

Part #Microchip-Tech-APT10021JLL
Download 
Microchip-Tech-APT10021JLL
APT10021JLL  
1000V 37A 0.210
Ω  
R
S
POWER MOS 7
 
MOSFET  
S
Power MOS 7

®

is a new generation of low loss, high voltage, N-Channel  
enhancement mode power MOSFETS.
 
Both conduction and switching  
losses are addressed with Power MOS 7

®

by significantly lowering R

DS(ON)  

and Q

g

. Power
 
MOS 7

®

combines lower conduction and switching losses  
along with exceptionally fast switching speeds inherent with APT’s  
patented metal gate structure.  
D
G
SOT-227  
“UL Recognized”  
ISOTOP

®  

D
S
• Lower Input Capacitance  
• Lower Miller Capacitance  
• Lower Gate Charge, Qg  
• Increased Power Dissipation  
• Easier To Drive  
G
• Popular SOT-227 Package  
MAXIMUM RATINGS  
Symbol Parameter  
All Ratings:
 
T =
 
25°C unless otherwise specified.  
C
APT10021JLL  
UNIT  
V

DSS  

I

D  

Drain-Source Voltage  
1000  
37  
Volts  
Continuous Drain Current @ T

C

= 25°C  
Amps  
Volts  
1
I

D
M  

Pulsed Drain Current  
148  
V

GS  

V

GSM  

Gate-Source Voltage Continuous  
Gate-Source Voltage Transient  
Total Power Dissipation @ T

C

= 25°C  
Linear Derating Factor  
±30  
±40  
Watts  
W/°C  
694  
P

D  

5.56  
-55 to 150  
300  
T

J

,T

STG  

T

L  

Operating and Storage Junction Temperature Range  
°C  
Amps  
mJ  
Lead Temperature: 0.063″ from Case for 10 Sec.  
1
I

AR  

Avalanche Current  
(Repetitive and Non-Repetitive)  
37  
1
E

AR  

E

AS  

Repetitive Avalanche Energy  
Single Pulse Avalanche Energy  
50  
4
3600  
STATI
C
E
LECTRICA
L
C
HARACTERISTICS  
Symbol Characteristic
 
/ Test Conditions  
MIN  
TYP  
MAX  
UNIT  
Volts  
Ohms  
BV

DSS  

R

DS(on)  

Drain-Source Breakdown Voltage
 
(V

GS

= 0V, I

D

= 250µA)  
1000  
2
Drain-Source On-State Resistance  
(V

GS

= 10V, 18.5A)  
0.210  
100  
500  
±100  
5
Zero Gate Voltage Drain Current
 
(V

DS

= 1000V, V

GS

= 0V)  
Zero Gate Voltage Drain Current
 
(V

DS

= 800V, V

GS

= 0V, T

C

= 125°C)  
Gate-Source Leakage Current
 
(V

GS

= ±30V, V

DS

= 0V)  
Gate Threshold Voltage
 
(V

DS

= V

GS

, I

D

= 5mA)  
I

DSS  

µA  
I

GSS  

nA  
V

GS(th)  

Volts  
3
CAUTION:
These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  

DYNAMIC CHARACTERISTICS  
Symbol Characteristic  
APT10021JLL  
Tes
t
C
onditions  
MIN  
TYP  
MAX  
UNIT  
C

iss  

C

oss  

C

rss  

Q

g  

Input Capacitance  
9750  
1615  
335  
395  
47  
V
= 0V  
GS  
Output Capacitance  
V
= 25V  
pF  
DS  
f = 1 MHz  
Reverse Transfer Capacitance  
3
Total Gate Charge  
V
= 10V  
GS  
V
= 500V  
Q

gs  

Q

gd  

t

d(on)  

t

r  

DD  
Gate-Source Charge  
Gate-Drain (“Mille
r
“
) Charge  
Turn-on Delay Time  
Rise Time  
nC  
ns  
I
= 37A @ 25°C  
D
260  
29  
RESISTIV
E
S
WITCHING  
V
= 15V  
GS  
22  
V
= 500V  
DD  
I
= 37A @ 25°C  
t

d(off)  

80  
Turn-off Delay Time  
Fall Time  
D
R
= 0.6
Ω  
G
t

f  

20  
INDUCTIV
E
S
WITCHIN
G
@
2
5°C  
6
E

on  

E

off  

E

on  

E

off  

Turn-on Switching Energy  
1560  
930  
V
= 667V,
 
V =
 
15V  
GS  
DD  
I
= 37A, R
 
= 5
Ω  
Turn-off Switching Energy  
D
G
µ
J  
INDUCTIV
E
S
WITCHIN
G
@
1
25°C  
6
2515  
1250  
Turn-on Switching Energy  
V
= 667V, V
 
= 15V  
GS  
DD  
I
= 37A, R
 
= 5
Ω  
Turn-off Switching Energy  
D
G
SOURCE-DRAI
N
D
IOD
E
R
ATING
S
A
N
D
C
HARACTERISTICS  
Symbol  
MIN  
TYP  
MAX  
Characteristic / Test Conditions  
UNIT  
I

S  

37  
148  
1.3  
CContinuous Source Current
 
(Body Diode)  
Amps  
1
I

SM  

Pulsed Source Current  
Diode Forward Voltage  
(Body Diode)  
2
V

SD  

t

rr  

(V

GS

= 0V, I

S

= -37A)  
Volts  
ns  
Reverse Recovery Time
 
(I

S

= -37A, dl

S

/dt = 100A/µs)  
Reverse Recovery Charge
 
(I

S

= -37A, dl

S

/dt = 100A/µs)  
1300  
38.0  
Q

rr  

µC  
dv  
/
dv  
5
V/ns  
Peak Diode Recovery  
/
dt  
10  
dt  
THERMA
L
C
HARACTERISTICS  
Symbol Characteristic  
MIN  
TYP  
MAX  
0.18  
40  
UNIT  
R

θ
JC  

R

θ
JA  

Junction to Case  
°C/W  
Junction to Ambient  
1 Repetitive
 
Rating: Pulse width limited by maximum junction  
temperature  
2 Pulse
 
Test: Pulse width < 380 µs, Duty Cycle < 2%  
3 See
 
MIL-STD-750 Method 3471  
4 Starting
 
T = +25°C, L = 5.26mH, R
 
= 25
Ω
, Peak I
 
= 37A  
j
G
L
dv  
5
/
numbers reflect the limitations of the test circuit rather than the  
di  
dt  
device itself.  
I
≤
–
I
37A  
/
≤
700A/µs  
V

R

≤
1000V
T
≤
150
°
C  
dt  
S
D
J
6
Eon includes diode reverse recovery.
 
See figures 18, 20.  
AP
T
R
eserve
s
t
h
e
r
igh
t
t
o
c
hange
,
w
ithou
t
n
otice
,
t
h
e
s
pecification
s
a
n
d
i
nformatio
n
c
ontaine
d
h
erein.  
0.20  
0.18  
0.9  
0.16  
0.14  
0.7  
0.12  
0.10  
0.08  
0.06  
0.04  
0.5  
0.3  
Note:  
t
1
t
2
t
1
Duty Factor
 
D =  
Peak T
 
= P
 
x Z  
/
t
2
+ T  
0.1  
J
DM
θ
JC  
C
0.02  
0
0.05  
SINGL
E
P
ULSE  
10

-3  

10

-5  

10

-4  

10

-2  

10

-1  

1.0  
10  
RECTANGULA
R
P
ULS
E
D
URATIO
N
(
SECONDS)  
FIGUR
E
1
,
M
AXIMU
M
E
FFECTIV
E
T
RANSIEN
T
T
HERMA
L
I
MPEDANCE
,
J
UNCTION-TO-CAS
E
v
s
P
ULS
E
D
URATION  

Typical Performance Curves  
APT10021JLL  
100  
90  
80  
70  
60  
50  
40  
30  
20  
7V  
6.5  
V
=15 &10V  
8V  
GS  
RC MODEL  
Junction  
temp. ( ”C)  
6V  
0.0244  
0.0731F  
0.701F  
5.5V  
Power  
0.133  
(Watts)  
0.0218  
20.065F  
5V  
30  
10  
0
Case temperature  
0
5
10  
15  
20  
25  
V
,
D
RAIN-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
DS  
FIGUR
E
2
,
T
RANSIENT THERMAL IMPEDANCE MODEL  
FIGUR
E
3
,
L
OW VOLTAGE OUTPU
T
C
HARACTERISTICS  
1.40  
180  
NORMALIZED TO  
V
> I
 
(ON) x  
25
0
µ
SEC. PULSE TEST  
@ <0.5 % DUTY CYCLE  
R
MAX.  
DS(ON)  
DS  
D
V
= 10V  
@
I =
 
18.5A  
160  
140  
120  
100  
80  
GS  
D
1.30  
1.20  
1.10  
1.00  
T
= +125°C  
J
V
=10V  
GS  
T
= +25°C  
= -55°C  
J
V
=20V  
GS  
60  
T
J
40  
0.90  
0.80  
20  
0
0
1
2
3
4
5
6
7
8
0
20  
40  
60  
80  
100  
V
,
G
ATE-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
I
,
D
RAI
N
C
URREN
T
(
AMPERES)  
GS  
D
FIGUR
E
4
, TRANSFE
R
C
HARACTERISTICS  
FIGUR
E
5
,
R  
v
s
D
RAI
N
C
URRENT  
DS(ON)  
1.15  
1.10  
1.05  
1.00  
40  
35  
30  
25  
20  
15  
10  
0.95  
0.90  
5
0
25  
50  
75  
100  
125  
150  
-50 -25  
0
25  
50 75 100
 
125 150  
T
,
C
AS
E
T
EMPERATUR
E
(
°C)  
T
,
J
UNCTIO
N
T
EMPERATUR
E
(
°C)  
C
J
FIGUR
E
6
,
M
AXIMU
M
D
RAI
N
C
URREN
T
v
s
C
AS
E
T
EMPERATURE  
FIGUR
E
7
,
B
REAKDOW
N
V
OLTAG
E
v
s
T
EMPERATURE  
2.5  
1.2  
I
= 18.5A  
= 10V  
D
V
GS  
1.1  
1.0  
0.9  
0.8  
2.0  
1.5  
1.0  
0.5  
0.0  
0.7  
0.6  
-50 -25  
0
25 50  
75 100
 
125 150  
-50 -25  
0
25  
50  
75 100 125 150  
T
,
J
UNCTIO
N
T
EMPERATUR
E
(
°C)  
T
,
C
AS
E
T
EMPERATUR
E
(
°C)  
J
C
FIGUR
E
8
,
R  
vs
.
T
EMPERATURE  
FIGUR
E
9
,
T
HRESHOL
D
V
OLTAG
E
v
s
T
EMPERATURE  
DS(ON)  

APT10021JLL  
148  
100  
30,000  
10,000  
OPERATIO
N
H
ERE  
LIMITE
D
B
Y
R
(
ON)  
DS  
100µS  
C
iss  
50  
1mS  
10  
C
oss  
1,000  
10mS  
C
T
=+25°C  
rss  
C
T =+150°C  
J
SINGL
E
P
ULSE  
10  
1
10  
1
100  
1000  
0
10  
20  
30  
40  
50  
V
,
D
RAIN-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
V
,
D
RAIN-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
DS  
DS  
FIGUR
E
1
0
,
M
AXIMU
M
S
AF
E
O
PERATIN
G
A
REA  
FIGUR
E
1
1, CAPACITANC
E
v
s
D
RAIN-TO-SOURC
E
V
OLTAGE  
300  
16  
12  
8
I
= 37A  
D
100  
V
=200V  
T =+150°C  
J
DS  
T =+25°C  
J
V
=500V  
DS  
V
=800V  
DS  
10  
4
0
1
0
100  
200  
300  
400  
500  
600  
0.3  
V
0.5  
0.7  
0.9  
1.1  
1.3  
1.5  
Q
,
T
OTA
L
G
AT
E
C
HARG
E
(
nC)  
,
S
OURCE-TO-DRAI
N
V
OLTAG
E
(
VOLTS)  
g
SD  
FIGUR
E
1
2
,
G
AT
E
C
HARG
E
v
s
G
ATE-TO-SOURC
E
V
OLTAGE  
FIGUR
E
1
3, SOURCE-DRAI
N
D
IOD
E
F
ORWAR
D
V
OLTAGE  
400  
80  
V
= 667V  
DD  
= 5
Ω  
t
R
T
d(off)  
70  
60  
50  
40  
30  
20  
10  
0
G
= 125°C  
J
L = 100µH  
300  
t
f
V
= 667V  
DD  
= 5
Ω  
R
T
G
= 125°C  
J
200  
L = 100µH  
100  
0
t
r
t
d(on)  
5
10 15 20 25 30 35 40 45 50 55 60  
(A)  
FIGURE 14,
 
DELAY TIMES vs CURRENT  
5
10 15
 
20 25 30
 
35 40 45 50 55 60  
(A)  
I
I
D
D
FIGURE 15, RISE
 
AND FALL TIMES vs CURRENT  
4000  
3500  
3000  
2500  
2000  
1500  
1000  
12,000  
10,000  
8,000  
6,000  
4,000  
V
= 667V  
V
I
= 667V  
DD  
DD  
= 37A  
R
= 5
Ω  
G
D
T
= 125°C  
T
= 125°C  
J
E
J
on  
E
L = 100µH  
L = 100µH  
off  
E

ON

includes  
E

ON

includes  
diode reverse recovery.  
diode reverse recovery.  
E
on  
E
off  
2,000  
0
500  
0
5
10 15 20 25 30 35 40 45 50 55 60  
(A)  
0
5
10 15 20 25 30 35 40 45 50  
I
R
,
G
AT
E
R
ESISTANC
E
(
Ohms)  
D
G
FIGUR
E
1
6, SWITCHING ENERG
Y
v
s CURRENT  
FIGURE 17, SWITCHING
 
ENERGY VS. GATE RESISTANCE  

APT10021JLL  
90%  
10%  
Gat
e
V
oltage  
Drai
n
C
urrent  
Gat
e
V
oltage  
t

d(off)  

T 125°C  
T 125°C  
J
J
t

d(on)  

Drai
n
V
oltage  
t

f  

90%  
t

r  

90%  
10%  
0
5%  
5%  
Drai
n
V
oltage  
10%  
Drai
n
C
urrent  
Switchin
g
E
nergy  
Switchin
g
E
nergy  
Figur
e
1
8
,
T
urn-o
n
S
witchin
g
W
aveform
s
a
n
d
D
efinitions  
Figur
e
1
9
,
T
urn-of
f
S
witchin
g
W
aveform
s
a
n
d
D
efinitions  
APT30DF60  
V

CE  

I

C  

V

DD  

G
D.U.T.  
Figure 20, Inductive Switching Test Circuit  
SOT-22
7
(
ISOTOP

®

)
P
ackag
e
O
utline  
11.8 (.463)  
12.2 (.480)  
31.5 (1.240)  
31.7 (1.248)  
8.9 (.350)  
9.6 (.378)  
W=4.1 (.161)  
W=4.3 (.169)  
H=4.8 (.187)  
H=4.9 (.193)  
(4 places)  
7.8 (.307)  
8.2 (.322)  
Hex Nut M4  
(4 places)  
25.2 (0.992)  
25.4 (1.000)  
r = 4.0 (.157)  
(2 places)  
4.0 (.157)  
4.2 (.165)  
(2 places)  
0.75 (.030)
 
12.6 (.496)  
0.85 (.033)
 
12.8 (.504)  
3.3 (.129)  
3.6 (.143)  
1.95 (.077)  
2.14 (.084)  
14.9 (.587)  
15.1 (.594)  
* Source  
Drain  
30.1 (1.185)  
30.3 (1.193)  
* Source terminals are shorted  
internally. Current handling  
capability is equal for either  
Source terminal.  
38.0 (1.496)  
38.2 (1.504)  
* Source  
Dimensions in Millimeters and (Inches)  
Gate  
ISOTOP

®

i
s
a
R
egistere
d
T
rademar
k
o
f
S
G
S
T
homson. APT’
s
p
roduct
s
a
r
e
c
overe
d
b
y
o
n
e
o
r
m
or
e
o
f
U
.S.patent
s
4
,895,810
 
5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,05
8
a
n
d
f
oreig
n
p
atents. U
S
a
n
d
F
oreig
n
p
atent
s
p
ending. Al
l
R
ight
s
R
eserved.