Microchip-Tech-APT1003RBLLG

Part #Microchip-Tech-APT1003RBLLG
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Microchip-Tech-APT1003RBLLG
APT1003RBLL  
APT1003RSLL  
1000V 4A 3.00  
R
POWER MOS 7
 
MOSFET  
D

3

PAK  
TO-247  
Power MOS 7

®

is a new generation of low loss, high voltage, N-Channel  
enhancement mode power MOSFETS.
 
Both conduction and switching  
losses are addressed with Power MOS 7

®

by significantly lowering R

DS(ON)  

and Q .
 
Power MOS 7

®

combines lower conduction and switching losses  
along

g

with exceptionally fast switching speeds inherent with APT’s  
patented metal gate structure.  
D
S
• Lower Input Capacitance  
• Lower Miller Capacitance  
• Lower Gate Charge, Qg  
• Increased Power Dissipation  
• Easier To Drive  
G
• TO-247 or Surface Mount D

3

PAK Package  
MAXIMUM RATINGS  
Symbol Parameter  
All Ratings:
 
T =
 
25°C unless otherwise specified.  
C
APT1003RBLL_SLL  
UNIT  
V

DSS  

I

D  

Drain-Source Voltage  
1000  
4
Volts  
Continuous Drain Current @ T

C

= 25°C  
Amps  
Volts  
1
I

D
M  

Pulsed Drain Current  
16  
V

GS  

V

GSM  

Gate-Source Voltage Continuous  
Gate-Source Voltage Transient  
Total Power Dissipation @ T

C

= 25°C  
Linear Derating Factor  
±30  
±40  
139  
1.11  
-55 to 150  
300  
4
Watts  
W/°C  
P

D  

T

J

,T

STG  

T

L  

Operating and Storage Junction Temperature Range  
°C  
Amps  
mJ  
Lead Temperature: 0.063″ from Case for 10 Sec.  
1
I

AR  

Avalanche Current  
(Repetitive and Non-Repetitive)  
1
E

AR  

E

AS  

Repetitive Avalanche Energy  
Single Pulse Avalanche Energy  
10  
4
425  
STATIC ELECTRICAL CHARACTERISTICS  
Symbol Characteristic
 
/ Test Conditions  
MIN  
1000  
TYP  
MAX  
UNIT  
Volts  
BV

DSS  

R

DS(on)  

Drain-Source Breakdown Voltage
 
(V

GS

= 0V, I

D

= 250µA)  
2
Drain-Source On-State Resistance  
(V

GS

= 10V, 2A)  
3.00  
100  
500  
±100  
5
Ohms  
Zero Gate Voltage Drain Current
 
(V

DS

= 1000V, V

GS

= 0V)  
Zero Gate Voltage Drain Current
 
(V

DS

= 800V, V

GS

= 0V, T

C

= 125°C)  
Gate-Source Leakage Current
 
(V

GS

= ±30V, V

DS

= 0V)  
Gate Threshold Voltage
 
(V

DS

= V

GS

, I

D

= 1mA)  
I

DSS  

µA  
I

GSS  

nA  
V

GS(th)  

Volts  
3
CAUTION:
These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  

DYNAMIC CHARACTERISTICS  
APT1003RBLL_SLL  
Tes
t
C
onditions  
Characteristic  
MIN  
TYP  
MAX  
Symbol  
C

iss  

C

oss  

C

rss  

Q

g  

UNIT  
Input Capacitance  
694  
135  
25  
34  
5
22  
8
4
V
= 0V  
GS  
Output Capacitance  
V
= 25V  
DS  
pF  
f = 1 MHz  
Reverse Transfer Capacitance  
3
V
= 10V  
Total Gate Charge  
GS  
V
= 500V  
Q

gs  

Q

gd  

DD  
Gate-Source Charge  
Gate-Drain (“Miller”) Charge  
Turn-on Delay Time  
Rise Time  
nC  
ns  
I
= 4A @ 25°C  
D
RESISTIV
E
S
WITCHING  
t

d(on)  

t

r  

V
= 15V  
GS  
V
= 500V  
DD  
I
= 4A @ 25°C  
t

d(off)  

25  
Turn-off Delay Time  
D
R
= 1.6  
G
t

f  

Fall Time  
10  
13  
42  
40  
48  
INDUCTIV
E
S
WITCHIN
G
@
2
5°C  
6
E

on  

E

off  

E

on  

E

off  

Turn-on Switching Energy  
V
= 667V,
 
V =
 
15V  
DD  
I
GS  
= 4A,
 
R =
 
5  
Turn-off Switching Energy  
D
G
INDUCTIV
E
S
WITCHIN
G
@
1
25°C  
µ
J  
6
Turn-on Switching Energy  
V
= 667V, V
 
= 15V  
DD  
I
GS  
= 4A,
 
R =
 
5  
G
Turn-off Switching Energy  
D
SOURCE-DRAI
N
D
IOD
E
R
ATING
S
A
N
D
C
HARACTERISTICS  
Symbol  
MIN  
TYP  
MAX  
Characteristic / Test Conditions  
UNIT  
I

S  

I

SM  

V

SD  

t

rr  

Q

rr  

4
16  
1.3  
Continuous Source Current
 
(Body Diode)  
Amps  
1
Pulsed Source Current  
(Body Diode)  
2
Diode Forward Voltage
 
(V

GS

= 0V, I

S

= -I

D

4A
)  
Volts  
ns  
Reverse Recovery Time
 
(I

S

= -I

D

4A
, dl

S

/dt = 100A/µs)  
Reverse Recovery Charge
 
(I

S

= -I

D

4A
, dl

S

/dt = 100A/µs)  
560  
3.2  
µC  
V/ns  
dv  
dv  
5
/
Peak Diode Recovery  
/
dt  
10  
dt  
THERMA
L
C
HARACTERISTICS  
Symbol  
Characteristic  
MIN  
TYP  
MAX  
0.90  
40  
UNIT  
R
Junction to Case  
Junction to Ambient  
JC  
°C/W  
R
JA  
1 Repetitive
 
Rating: Pulse width limited by maximum junction  
temperature  
4 Starting
 
T

j

= +25°C, L = 53.13mH, R

G

= 25
 
, Peak I

L

= 4A  
dv  
5
6
/
numbers reflect the limitations of the test circuit rather than the  
di  
dt  
2 Pulse
 
Test: Pulse width < 380 µs, Duty Cycle < 2%  
3 See
 
MIL-STD-750 Method 3471  
device itself.  
I
–
I
4A  
/
700A/µs  
V
V
T
150
°
C  
dt  
Eon includes

S

diode reverse recovery.
 
See figu

D

r
e

S

s

S

18, 20.  
D
R
J
AP
T
R
eserve
s
t
h
e
r
igh
t
t
o
c
hange
,
w
ithou
t
n
otice
,
t
h
e
s
pecification
s
a
n
d
i
nformatio
n
c
ontaine
d
h
erein.  
1.0  
0.9  
0.80  
0.7  
0.60  
0.5  
Note:  
0.40  
t
1
0.3  
t
2
SINGL
E
P
ULSE  
0.20  
t
1
Duty Factor
 
D =  
/
t
2
Peak T
 
= P  
x Z  
+ T  
JC C  
0.1  
J
DM  
0.05  
0
-5  
-4  
-3  
-2  
-1  
10  
10  
10  
RECTANGULA
R
P
ULS
E
D
URATIO
N
(
SECONDS)  
FIGUR
E
1
,
M
AXIMU
M
E
FFECTIV
E
T
RANSIEN
T
T
HERMA
L
I
MPEDANCE
,
J
UNCTION-TO-CAS
E
v
s
P
ULS
E
D
URATION  
10  
10  
1.0  

Typical Performance Curves  
APT1003RBLL_SLL  
=15 & 10V  
10  
8
V
GS  
7V  
7.5V  
6.5V  
RC MODEL  
6
Junction  
temp. (
q
C)  
6V  
0.386  
0.508  
0.00336F  
0.0903F  
4
Power  
(watts)  
5.5V  
5V  
2
Case temperature. (
q
C)  
0
0
5
10  
15  
20  
25  
30  
V
,
D
RAIN-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
DS  
FIGUR
E
2
, TRANSIENT THERMAL IMPEDANCE MODEL  
FIGUR
E
3
,
L
OW VOLTAGE OUTPU
T
C
HARACTERISTICS  
16  
1.40  
V
> I
 
(ON) x  
250µSEC. PULSE TEST  
@ <0.5 % DUTY CYCLE  
R
(ON)MAX.  
DS  
NORMALIZED TO  
DS  
D
V
= 10V
 
@ 2A  
GS  
14  
12  
10  
8
1.30  
1.20  
1.10  
1.00  
V
=10V  
GS  
T
= -55°C  
J
V
=20V  
6
GS  
T
= +25°C  
J
4
0.90  
0.80  
2
T
= +125°C  
J
0
0
V
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
10  
,
G
ATE-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
FIGUR
E
4
, TRANSFE
R
C
HARACTERISTICS  
I
,
D
RAI
N
C
URREN
T
(
AMPERES)  
GS  
D
FIGUR
E
5
,
R
(
ON
)
v
s
D
RAI
N
C
URRENT  
DS  
4
3.5  
3
1.15  
1.10  
1.05  
1.00  
0.95  
2.5  
2
1.5  
1
0.90  
0.85  
0.5  
0
25  
50  
75  
100  
125  
150  
-50 -25  
0
25  
50  
75 100
 
125 150  
T
,
C
AS
E
T
EMPERATUR
E
(
°C)  
T
,
J
UNCTIO
N
T
EMPERATUR
E
(
°C)  
C
J
FIGUR
E
6
,
M
AXIMU
M
D
RAI
N
C
URREN
T
v
s
C
AS
E
T
EMPERATURE  
FIGUR
E
7
,
B
REAKDOW
N
V
OLTAG
E
v
s
T
EMPERATURE  
1.2  
2.5  
I
= 2A  
D
V
= 10V  
GS  
1.1  
1.0  
0.9  
0.8  
2.0  
1.5  
1.0  
0.5  
0.0  
0.7  
0.6  
-50 -25  
0
25 50  
75 100
 
125 150  
-50 -25  
0
25  
50  
75 100 125 150  
T
,
J
UNCTIO
N
T
EMPERATUR
E
(
°C)  
T
,
C
AS
E
T
EMPERATUR
E
(
°C)  
J
C
FIGUR
E
8
,
O
N-RESISTANC
E
v
s
.
T
EMPERATURE  
FIGUR
E
9
,
T
HRESHOL
D
V
OLTAG
E
v
s
T
EMPERATURE  

APT1003RBLL_SLL  
4,000  
1,000  
16  
10  
OPERATIO
N
H
ERE  
LIMITE
D
B
Y
R
(
ON)  
DS  
5
C
iss  
100µS  
1
C
C
oss  
100  
10  
.5  
1mS  
T
=+25°C  
10mS  
C
T =+150°C  
J
rss  
SINGL
E
P
ULSE  
10  
.1  
1
100  
1000  
0
10  
20  
30  
40  
50  
V
,
D
RAIN-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
V
,
D
RAIN-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
FIGUR
E
1
1, CAPACITANC
E
v
sDRAIN-TO-SOURC
E
V
OLTAGE  
DS  
DS  
FIGUR
E
1
0
,
M
AXIMU
M
S
AF
E
O
PERATIN
G
A
REA  
16  
12  
8
100  
I
= 4A  
D
V
=
2
00V  
DS  
T =+150°C  
J
T =+25°C  
V
=
5
00V  
J
DS  
V
=
8
00V  
DS  
10  
4
0
1
0
5
10 15 20 25 30 35 40 45
 
50  
Q
,
T
OTA
L
G
AT
E
C
HARG
E
(
nC)  
0.3  
V
0.5  
0.7  
0.9  
1.1  
1.3  
1.5  
,
S
OURCE-TO-DRAI
N
V
OLTAG
E
(
VOLTS)  
g
SD  
FIGUR
E
1
2
,
G
AT
E
C
HARGE
S
v
s
G
ATE-TO-SOURC
E
V
OLTAGE  
FIGUR
E
1
3, SOURCE-DRAI
N
D
IOD
E
F
ORWAR
D
V
OLTAGE  
25  
70  
V
= 667V  
DD  
= 5  
R
T
G
t
d(off)  
60  
50  
40  
30  
20  
10  
0
= 125°C  
J
20  
15  
10  
5
L = 100µH  
V
= 667V  
DD  
= 5  
t
f
R
T
G
= 125°C  
J
L = 100µH  
t
d(on)  
t
r
0
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
I
(A)  
I (A)  
D
D
FIGURE 14,
 
DELAY TIMES vs CURRENT  
FIGURE 15, RISE
 
AND FALL TIMES vs CURRENT  
90  
80  
70  
60  
50  
40  
30  
20  
140  
V
= 667V  
V
I
= 667V  
DD  
DD  
= 4A  
R
= 5  
G
D
120  
100  
80  
T
= 125°C  
T
= 125°C  
E
J
off  
J
E
on  
L = 100µH  
E

ON

includes  
diode reverse recovery.  
L = 100µH  
E

ON

includes  
diode reverse recovery.  
60  
E
off  
40  
E
on  
20  
0
10  
0
0
1
2
3
4
5
6
7
8
0
5
10 15 20 25 30 35 40 45 50  
I
(A)  
R
,
G
AT
E
R
ESISTANC
E
(
Ohms)  
G
D
FIGUR
E
1
6, SWITCHING ENERG
Y
v
s CURRENT  
FIGURE 17, SWITCHING
 
ENERGY VS. GATE RESISTANCE  

APT1003RBLL_SLL  
10%  
90%  
Gat
e
V
oltage  
Gat
e
V
oltage  
Drai
n
C
urrent  
T 125°C  
T 125°C  
J
J
t

d(off)  

90%  
Drai
n
V
oltage  
t

d(on)  

t

r  

10%  
5%  
5%  
0
90%  
t

f  

Drai
n
V
oltage  
Drai
n
C
urrent  
10%  
Switchin
g
E
nergy  
Switchin
g
E
nergy  
Figur
e
1
9
,
T
urn-of
f
S
witchin
g
W
aveform
s
a
n
d
D
efinitions  
Figur
e
1
8
,
T
urn-o
n
S
witchin
g
W
aveform
s
a
n
d
D
efinitions  
APT15DF100  
V

CE  

I

C  

V

DD  

G
D.U.T.  
Figure 20, Inductive Switching Test Circuit  
D

3

PA
K
P
ackag
e
O
utline  
TO
–
247 Package Outline  
4.69 (.185)  
5.31 (.209)  
15.49 (.610)  
16.26 (.640)  
1.49 (.059)  
2.49 (.098)  
5.38 (.212)  
6.20 (.244)  
6.15 (.242) BSC  
20.80 (.819)  
21.46 (.845)  
3.50 (.138)  
3.81 (.150)  
2.87 (.113)  
3.12 (.123)  
4.50 (.177) Max.  
1.65 (.065)  
2.13 (.084)  
0.40 (.016)  
0.79 (.031)  
19.81 (.780)  
20.32 (.800)  
1.01 (.040)  
1.40 (.055)  
Gate  
Drain  
Source  
2.21 (.087)  
2.59 (.102)  
5.45 (.215) BSC  
2-Plcs.  
Dimensions in Millimeters and (Inches)  
APT’
s
p
roduct
s
a
r
e
c
overe
d
b
y
o
n
e
o
r
m
or
e
o
f
U
.S.patent
s
4
,895,810 5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,05
8
a
n
d
f
oreig
n
p
atents. U
S
a
n
d
F
oreig
n
p
atent
s
p
ending. Al
l
R
ight
s
R
eserved.