Microchip-Tech-APT20M38BVRG

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Microchip-Tech-APT20M38BVRG
APT20M38BVR  
200V 67A 0.038
Ω
 
POWER MOS V

®  

Power MOS V

®

is a new generation of high voltage N-Channel enhancement  
mode power MOSFETs. This new technology minimizes the JFET effect,  
increases packing density and reduces the on-resistance. Power MOS V

®  

also achieves faster switching speeds through optimized gate layout.  
TO-247  
D
S
• Faster Switching  
• Lower Leakage  
• 100% Avalanche Tested  
• Popular TO-247 Package  
G
MAXIMUM RATINGS  
Symbol Parameter  
All Ratings:
 
T =
 
25
°
C unless otherwise specified.  
C
APT20M38BVR  
UNIT  
V

DSS  

I

D  

Drain-Source Voltage  
200  
67  
Volts  
Continuous Drain Current @ T

C

= 25
°
C  
Amps  
Volts  
1
I

DM  

Pulsed Drain Current  
268  
V

GS  

V

GSM  

Gate-Source Voltage Continuous  
Gate-Source Voltage Transient  
±
30  
±
40  
Total Power Dissipation @ T

C

= 25
°
C  
Linear Derating Factor  
Watts  
370  
P

D  

2.96  
-55 to 150  
300  
W/
°
C  
T

J

,T

STG  

T

L  

Operating and Storage Junction Temperature Range  
°
C  
Amps  
mJ  
Lead Temperature: 0.063″ from Case for 10 Sec.  
1
I

AR  

Avalanche Current  
(Repetitive and Non-Repetitive)  
67  
1
E

AR  

E

AS  

30  
Repetitive Avalanche Energy  
Single Pulse Avalanche Energy  
4
1300  
STATIC ELECTRICAL CHARACTERISTICS  
Symbol Characteristic
 
/ Test Conditions  
MIN  
TYP  
MAX  
UNIT  
BV

DSS  

I

D(on)  

Drain-Source Breakdown Voltage
 
(V

GS

= 0V, I

D

= 250
µ
A)  
Volts  
200  
67  
2
On State Drain Current  
(V

DS

> I

D(on)

x R

DS(on)

Max, V

GS

= 10V)  
Amps  
2
R

DS(on)  

Drain-Source On-State Resistance  
(V

GS

= 10V, 0.5 I

D[Cont.]

)  
Ohms  
0.038  
25  
Zero Gate Voltage Drain Current
 
(V

DS

= V

DSS

, V

GS

= 0V)  
I

DSS  

µ
A  
Zero Gate Voltage Drain Current
 
(V

DS

= 0.8 V

DSS

, V

GS

= 0V, T

C

= 125
°
C)  
Gate-Source Leakage Current
 
(V

GS

=
±
30V, V

DS

= 0V)  
Gate Threshold Voltage
 
(V

DS

= V

GS

, I

D

= 1.0mA)  
250  
±
100  
4
I

GSS  

nA  
V

GS(th)  

Volts  
2
CAUTION:
These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
USA  
405 S.W. Columbia Street  
EUROPE  
Bend, Oregon 97702-1035  
F-33700 Merignac – France  
Phone: (541) 382-8028  
Phone: (33) 5 57 92 15 15  
FAX: (541) 388-0364  
FAX: (33) 5 56 47 97 61  
Avenue J.F. Kennedy
 
Bât B4 Parc Cadéra Nord  

DYNAMIC CHARACTERISTICS  
Symbol Characteristic  
APT20M38BVR  
Test Conditions  
MIN  
TYP  
MAX  
UNIT  
C

iss  

C

oss  

C

rss  

Q

g  

Input Capacitance  
5100  
1145  
390  
148  
47  
6120  
1600  
585  
225  
75  
V

GS

= 0V  
V

DS

= 25V  
f = 1 MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
3
V

GS

= 10V  
Total Gate Charge  
Q

gs  

Q

gd  

V

DD

= 0.5 V

DSS  

Gate-Source Charge  
Gate-Drain (“Mille
r
“
) Charge  
Turn-on Delay Time  
Rise Time  
nC  
ns  
I

D

= I

D[Cont.]

@ 25
°
C  
75  
110  
28  
t

d(on)  

t

r  

t

d(off)  

t

f  

V

GS

= 15V  
V

DD

= 0.5 V

DSS  

I

D

= I

D[Cont.]

@ 25
°
C  
R

G

= 1.6
Ω  
14  
21  
42  
Turn-off Delay Time  
Fall Time  
48  
75  
10  
20  
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS  
Symbol Characteristic
 
/ Test Conditions  
MIN  
TYP  
MAX  
67  
UNIT  
I

S  

Continuous Source Current
 
(Body Diode)  
Amps  
1
I

SM  

V

SD  

t

rr  

Pulsed Source Current  
Diode Forward Voltage  
(Body Diode)  
268  
1.3  
2
(V

GS

= 0V, I

S

= -I

D[Cont.]  

)
Volts  
ns  
Reverse Recovery Time
 
(I

S

= -I

D[Cont.]

, dl

S

/dt = 100A/
µ
s)  
Reverse Recovery Charge
 
(I

S

= -I

D[Cont.]

, dl

S

/dt = 100A/
µ
s)  
160  
1.3  
Q

rr  

µ
C  
THERMAL CHARACTERISTICS  
Symbol Characteristic  
MIN  
TYP  
MAX  
0.34  
40  
UNIT  
R

θ
JC  

R

θ
JA  

Junction to Case  
°
C/W  
Junction to Ambient  
1
2
3
4
Repetitive Rating: Pulse width limited by maximum junction  
temperature.  
See MIL-STD-750 Method 3471  
Starting T = +25
°
C, L = 0.58mH, R
 
= 25
Ω
, Peak I
 
= 67A  
j
G
L
Pulse Test: Pulse width < 380
µ
S, Duty Cycle < 2%  
APT Reserves the right to change, without notice, the specifications and information contained herein.  
0.4  
D=0.5  
0.1  
0.2  
0.05  
0.1  
0.05  
Note:  
0.02  
0.01  
t
1
0.01  
0.005  
t
2
t
1
Duty Factor
 
D =  
Peak T
 
= P
 
x Z  
/
t
SINGLE PULSE  
2
+ T  
J
DM  
θ
JC  
C
0.001  
10

-5  

10

-4  

10

-3  

10

-2  

10

-1  

1.0  
10  
RECTANGULAR PULSE DURATION (SECONDS)  
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION  

APT20M38BVR  
150  
120  
90  
150  
120  
90  
V
=15V  
V
=10V & 15V  
10V  
GS  
GS  
7V  
7V  
6.5V  
6.5V  
6V  
5V  
6V  
60  
60  
5.5V  
4.5V  
5.5V  
30  
30  
5V  
4.5V  
5
0
0
0
V
20  
40  
60  
80  
100  
0
V
1
2
3
4
6
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)  
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)  
DS  
DS  
FIGURE 2, TYPICAL OUTPUT CHARACTERISTICS  
FIGURE 3, TYPICAL OUTPUT CHARACTERISTICS  
150  
120  
90  
60  
30  
0
1.3  
T
= -55
°
C  
NORMALIZED TO  
J
V
= 10V
 
@ 0.5 I
 
[Cont.]  
D
GS  
T
= +25
°
C  
J
1.2  
1.1  
1.0  
0.9  
0.8  
T
= +125
°
C  
J
V
> I
 
(ON) x  
R
(ON)MAX.  
DS  
D
DS  
250
µ
SEC. PULSE TEST  
V
=10V  
GS  
@ <0.5 % DUTY CYCLE  
V
=20V  
160  
T
= +125
°
C  
= +25
°
C  
GS  
J
T
J
T
= -55
°
C  
J
0
V
2
4
6
8
10  
0
40  
80  
120  
200  
, GATE-TO-SOURCE VOLTAGE (VOLTS)  
I ,
 
DRAIN CURRENT (AMPERES)  
GS  
D
FIGURE 4, TYPICAL TRANSFER CHARACTERISTICS  
FIGURE 5, R
 
(ON) vs DRAIN CURRENT  
DS  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
70  
60  
50  
40  
30  
20  
10  
0
25  
50  
75  
100  
125  
150  
-50 -25  
0
25 50 75 100
 
125 150  
T ,
 
CASE TEMPERATURE (
°
C)  
T , JUNCTION TEMPERATURE (
°
C)  
C
J
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE  
FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE  
1.2  
2.5  
I
= 0.5
 
I [Cont.]  
D
D
V
= 10V  
GS  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
2.0  
1.5  
1.0  
0.5  
0.0  
-50 -25  
0
25 50  
75 100
 
125 150  
-50 -25  
0
25 50 75
 
100 125 150  
T , JUNCTION TEMPERATURE (
°
C)  
T ,
 
CASE TEMPERATURE (
°
C)  
J
C
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE  
FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE  

APT20M38BVR  
300  
15,000  
10,000  
10
µ
S  
OPERATION HERE  
LIMITED BY R
 
(ON)  
100
µ
S  
DS  
C
iss  
oss  
rss  
100  
50  
5,000  
C
1mS  
C
1,000  
500  
10  
5
10mS  
T
T
=+25
°
C  
=+150
°
C  
C
J
100mS  
DC  
SINGLE PULSE  
1
100  
1
V
5
10  
50 100
 
200  
.01  
V
.1  
1
10  
50  
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)  
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)  
DS  
DS  
FIGURE 10, MAXIMUM SAFE OPERATING AREA  
FIGURE 11, TYPICAL CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE  
300  
20  
16  
12  
8
I
= I
 
[Cont.]  
D
D
V
=40V  
DS  
=100V  
100  
V
T
=+150
°
C  
T =+25
°
C  
J
DS  
J
50  
V
=160V  
DS  
10  
5
4
0
1
0
50  
g
100  
150  
200  
250  
300  
0
V
0.4  
0.8  
1.2  
1.6  
2.0  
Q ,
 
TOTAL GATE CHARGE (nC)  
, SOURCE-TO-DRAIN VOLTAGE (VOLTS)  
SD  
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGE  
FIGURE 13, TYPICAL SOURCE-DRAIN DIODE FORWARD VOLTAGE  
TO-247 Package Outline  
4.69 (.185)  
5.31 (.209)  
15.49 (.610)  
16.26 (.640)  
1.49 (.059)  
2.49 (.098)  
5.38 (.212)  
6.20 (.244)  
6.15 (.242) BSC  
20.80 (.819)  
21.46 (.845)  
3.50 (.138)  
3.81 (.150)  
2.87 (.113)  
3.12 (.123)  
4.50 (.177) Max.  
1.65 (.065)  
2.13 (.084)  
0.40 (.016)  
0.79 (.031)  
19.81 (.780)  
20.32 (.800)  
1.01 (.040)  
1.40 (.055)  
Gate  
Drain  
Source  
2.21 (.087)  
2.59 (.102)  
5.45 (.215) BSC  
2-Plcs.  
Dimensions in Millimeters and (Inches)  
APT’s devices are covered by one or more of the following U.S.patents:
 
4,895,810  
5,256,583  
5,045,903  
4,748,103  
5,089,434  
5,283,202  
5,182,234  
5,231,474  
5,019,522  
5,434,095  
5,262,336  
5,528,058