Microchip-Tech-APT22F120L
| Part # | Microchip-Tech-APT22F120L |
Download  | Microchip-Tech-APT22F120L |
APT22F120B2
APT22F120L
1200V, 23A, 0.70
Ω
Max, t
≤
270ns
rr
N-Channel FREDFET
Power MOS 8
™
is a high speed, high voltage N-channel switch-mode power MOSFE
T
.
T-Ma
x
TM
TO-264
This ‘FREDFET’ version has a drain-source (body) diode that has been optimized for
high reliability in ZVS phase shifted bridge and other circuits through reduced t
, soft
rr
recovery, and high recovery dv/dt capability.
Low gate charge, high gain, and a greatly
reduced ratio of C
/C result
in excellent niose immunity and low switching loss.
The
rss iss
APT22F120B2
APT22F120L
intrinsic gate resistance and capacitance of the poly-silicon gate structure help control
di/dt during switching, resulting in low EMI and reliable paralleling, even when switching
at very high frequency.
Single die FREDFET
FEATURES
TYPICAL APPLICATIONS
• ZVS
phase shifted and other full full bridge
• Fast
switching with low EMI
• Half
bridge
• Low
t for
high reliability
rr
• PFC
and other boost converter
• Buck
converter
• Ultra
low C
rss
for improved noise immunity
• Low
gate charge
• Single
and two switch forward
• Flyback
• Avalanche
energy rated
• RoHS
compliant
Absolute Maximum Ratings
Symbol
Ratings
23
Unit
Parameter
Continuous Drain Current @ T
C
= 25°C
I
D
Continuous Drain Current @ T
C
= 100°C
15
A
Pulsed Drain Current
1
90
±30
1875
12
I
DM
V
GS
E
AS
I
AR
V
mJ
A
Gate-Source Voltage
Single Pulse Avalanche Energy
2
Avalanche Current, Repetitive or Non-Repetitive
Thermal and Mechanical Characteristics
Symbol Characteristic
Min
Typ
Max
1040
0.12
Unit
P
D
T
o
tal Power Dissipation @ T
C
= 25°C
W
R
θ
JC
Junction to Case Thermal Resistance
°C/W
°C
R
θ
CS
0.11
Case to Sink Thermal Resistance, Flat, Greased Surface
T
J
,T
STG
-55
150
300
Operating and Storage Junction
T
e
mperature Range
T
L
Soldering
T
e
mperature for 10 Seconds (1.6mm from case)
oz
g
0.22
6.2
W
T
Package Weight
in·lbf
N·m
10
T
o
rque
Mounting
T
o
rque ( TO-264 Package), 4-40 or M3 screw
1.1
Static Characteristics
T =
25°C unless otherwise speci
fi
ed
J
APT22F120B2_L
Parameter
Test Conditions
Min
Typ
Max
Unit
V
Symbol
V
BR(DSS)
V
= 0V
,
I =
250
μ
A
Drain-Source Breakdown Voltage
Breakdown Voltage
T
e
mperature Coef
fi
cient
Drain-Source On Resistance
3
Gate-Source Threshold Voltage
Threshold Voltage
T
e
mperature Coef
fi
cient
1200
GS
D
∆
V
BR(DSS)
/
∆
T
J
Reference to 25°C, I
= 250
μ
A
D
V/°C
Ω
1.41
0.53
4
V
= 10V
,
I =
12A
D
R
DS(on)
V
GS(th)
0.70
5
GS
V
2.5
V
= V
DS
,
I =
2.5mA
D
GS
∆
V
GS(th)
/
∆
T
J
mV/°C
-10
V
= 1200V
= 0V
T =
25°C
J
250
1000
±100
DS
I
DSS
I
GSS
Zero Gate Voltage Drain Current
Gate-Source Leakage Current
μ
A
V
T =
125°C
J
GS
V
= ±30V
nA
GS
Dynamic Characteristics
T =
25°C unless otherwise speci
fi
ed
J
Symbol
Parameter
Test Conditions
Min
Typ
27
Max
Unit
g
fs
V
= 50V
,
I =
12A
S
Forward Transconductance
Input Capacitance
DS
D
C
iss
C
rss
C
oss
8370
100
615
V
= 0V
,
V =
25V
DS
GS
Reverse Transfer Capacitance
Output Capacitance
f = 1MHz
pF
4
C
o(cr)
Effective Output Capacitance, Charge Related
Effective Output Capacitance, Energy Related
240
V
= 0V
,
V =
0V to 800V
DS
GS
5
C
o(er)
125
Q
g
Q
gs
Q
gd
t
d(on)
T
o
tal Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Current Rise Time
Turn-Off Delay Time
Current Fall Time
260
42
V
= 0 to 10V
,
I =
12A,
GS
D
nC
ns
V
= 600V
DS
120
45
Resistive Switching
V =
800V
,
I =
12A
DD
t
r
t
d(off)
t
f
27
D
R
= 2.2
Ω
6
,
V
= 15V
GG
145
42
G
Source-Drain Diode Characteristics
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
Continuous Source Current
(Body Diode)
MOSFET symbol
showing the
integral reverse p-n
junction diode
(body diode)
I
S
23
A
Pulsed Source Current
(Body Diode)
1
I
SM
V
SD
t
rr
90
I
= 12A
,
T =
25°C, V
= 0V
Diode Forward Voltage
1.
2
425
850
V
SD
J
GS
T =
25°C
J
375
720
2.2
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
Peak Recovery dv/dt
ns
T =
125°C
J
3
I
= 12A
T =
25°C
J
SD
Q
rr
μ
C
A
di
SD
/
dt = 100A/
μ
s
T =
125°C
J
5.8
T =
25°C
J
12.3
16.5
I
rrm
T =
125°C
J
I
≤
12A, di/dt
≤
1000A/
μ
s, V
= 800V,
SD
DD
dv/dt
V/ns
25
T =
125°C
J
1
2
3
Repetitive Rating: Pulse width and case temperature limited by maximum junction temperature.
Starting at T
J
= 25°C, L = 26.04mH, R
G
= 25
Ω
, I
AS
= 12A.
Pulse test: Pulse Width < 380
μ
s, duty cycle
< 2%.
4
5
C
o(cr)
is de
fi
ned as a
fi
xed capacitance with the same stored charge as C
OSS
with V
DS
= 67% of V
(BR)DSS
.
C
o(er)
is de
fi
ned as a
fi
xed capacitance with the same stored energy as C
OSS
with V
DS
= 67% of V
(BR)DSS
.
T
o
c
alculate C
o(cr)
for any value of
V
DS
less than V
(BR)DSS,
use this equation:
C
o(er)
= -3.80E-7/V
DS
^2 + 4.62E-8/V
DS
+ 6.57E-11.
6
R
G
is external gate resistance, not including internal gate resistance or gate driver impedance.
(MIC4452)
Microsemi reserves the right to change, without notice, the speci
fi
cations and information contained herein.
APT22F120B2_L
20
16
12
8
60
50
40
30
20
V
= 10V
T
= 125°C
GS
J
T
J
= -55°C
V
GS
= 6, 7, 8 & 9V
5V
T
J
= 25°C
4
0
4.5V
10
0
T
J
= 125°C
T
J
= 150°C
0
V
5
10
15
20
25
30
0
0
0
5
10
15
20
25
30
, DRAIN-TO-SOURCE VOLTAGE (V)
V
, DRAIN-TO-SOURCE VOLTAGE (V)
DS(ON)
DS
Figure 1,
Output Characteristics
Figure 2,
Output Characteristics
3.0
2.5
2.0
1.5
1.0
90
80
70
60
50
40
30
20
NORMALIZED TO
= 10V
12A
V
DS
> I
D(ON)
x R
DS(ON)
MAX.
250
μ
SEC. PULSE TEST
V
@
GS
@ <0.5 % DUTY CYCLE
T
J
= -55°C
T
J
= 25°C
T
J
= 125°C
0.5
0
10
0
-55 -25
0
25 50 75
100 125 150
T , JUNCTION
TEMPERATURE (°C)
1
2
3
4
5
6
7
8
V
, GATE-TO-SOURCE VOLTAGE (V)
J
GS
Figure 3,
R
vs Junction Temperature
Figure 4,
Transfer Characteristics
DS(ON)
35
30
25
20
15
10
5
20,000
10,000
C
iss
T
J
= -55°C
T
J
= 25°C
1000
T
J
= 125°C
C
oss
100
10
C
rss
0
0
2
4
6
8
10
12
14
200 800
1000 1200
, DRAIN-TO-SOURCE VOLTAGE (V)
DS
400
600
I ,
DRAIN CURRENT (A)
V
D
Figure 5,
Gain vs Drain Current
Figure 6, Capacitance vs Drain-to-Source Voltage
16
14
12
10
8
90
I
= 12A
D
80
70
60
50
V
DS
=
240V
V
DS
=
600V
40
T
J
= 25°C
6
30
V
DS
=
960V
T
J
= 150°C
4
20
2
10
0
0
0
50 100
150 200 250 300 350 400
0
0.3
0.6
0.9
1.2
1.5
Q ,
TOTAL GATE CHARGE (nC)
V
SD
, SOURCE-TO-DRAIN VOLTAGE (V)
g
Figure 7, Gate Charge vs Gate-to-Source Voltage
Figure 8, Reverse Drain Current vs Source-to-Drain Voltage
APT22F120B2_L
200
100
200
100
I
I
DM
DM
R
ds(on)
10
1
10
1
13
μ
s
100
μ
s
13
μ
s
100
μ
s
1ms
10ms
1ms
T
=
150°C
J
10ms
T
C
=
25°C
R
ds(on)
Scaling for Different Case & Junction
T
e
mperatures:
100ms
100ms
DC line
T
=
125°C
C
=
75°C
J
DC line
I
D
=
I
D(T =
25
°
C)
*(
T
–
T
C
)/125
T
J
C
0.1
0.1
1
10
100
1200
1
10
, DRAIN-TO-SOURCE VOLTAGE (V)
DS
100
1200
V
, DRAIN-TO-SOURCE VOLTAGE (V)
V
DS
Figure 9, Forward Safe Operating Area
Figure 10, Maximum Forward Safe Operating Area
0.14
0.12
0.10
0.08
0.06
0.04
D = 0.9
0.7
Note:
0.5
0.3
t
1
t
2
t
= Pulse Duration
t
1
SINGLE PULSE
1
t
/
2
+ T
Duty Factor D =
0.02
0
0.1
Peak T
= P
x Z
J
DM
θJC C
0.05
10
-5
10
-4
10
-3
10
-2
10
-1
1.0
RECTANGULAR PULSE DURATION (seconds)
Figure 11. Maximum Effective Transient Thermal Impedance Junction-to-Case vs Pulse Duration
®
TO-264 (L) Package Outline
T-MAX (B2)
Package Outline
e3 100% Sn Plated
4.69 (.185)
4.60 (.181)
5.31 (.209)
15.49 (.610)
16.26 (.640)
5.21 (.205)
19.51 (.768)
20.50 (.807)
1.49 (.059)
2.49 (.098)
1.80 (.071)
2.01 (.079)
3.10 (.122)
3.48 (.137)
5.38 (.212)
6.20 (.244)
5.79 (.228)
6.20 (.244)
20.80 (.819)
21.46 (.845)
25.48 (1.003)
26.49 (1.043)
2.87 (.113)
3.12 (.123)
4.50 (.177) Max.
2.29 (.090)
2.69 (.106)
2.29 (.090)
2.69 (.106)
1.65 (.065)
2.13 (.084)
0.40 (.016)
19.81 (.780)
20.32 (.800)
1.016(.040)
19.81 (.780)
21.39 (.842)
Gate
Drain
Source
Gate
Drai n
Source
1.01 (.040)
1.40 (.055)
0.48 (.019)
0.84 (.033)
2.59 (.102)
3.00 (.118)
0.76 (.030)
1.30 (.051)
2.21 (.087)
2.59 (.102)
2.79 (.110)
5.45 (.215) BSC
2-Plcs.
3.18 (.125)
5.45 (.215) BSC
2-Plcs.
These dimensions are equal to the TO-247 without the mounting hole.
Dimensions in Millimeters and (Inches)
Dimensions in Millimeters and (Inches)
