Microchip-Tech-APT31M100B2
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APT31M100B2
APT31M100L
1000V, 32A, 0.38
Ω
Max
N-Channel MOSFET
T-Ma
x
TM
TO-264
Power MOS 8
™
is a high speed, high voltage N-channel switch-mode power MOSFE
T
.
A proprietary planar stripe design yields excellent reliability and manufacturability.
Low
switching loss is achieved with low input capacitance and ultra low C
rss
“Miller” capaci-
tance. The
intrinsic gate resistance and capacitance of the poly-silicon gate structure
help control slew rates during switching, resulting in low EMI and reliable paralleling,
even when switching at very high frequency.
Reliability in
fl
yback, boost, forward, and
other circuits is enhanced by the high avalanche energy capability.
APT31M100B2
APT31M100L
D
S
Single die MOSFET
G
FEATURES
TYPICAL APPLICATIONS
• PFC
and other boost converter
• Fast
switching with low EMI/RFI
• Buck
converter
• Low
R
DS(on)
• Two
switch forward (asymmetrical bridge)
• Single
switch forward
• Flyback
• Ultra
low C
rss
for improved noise immunity
• Low
gate charge
• Avalanche
energy rated
• RoHS
compliant
• Inverters
Absolute Maximum Ratings
Symbol Parameter
Ratings
32
Unit
Continuous Drain Current @ T
C
= 25°C
I
D
Continuous Drain Current @ T
C
= 100°C
20
A
Pulsed Drain Current
1
I
DM
V
GS
E
AS
I
AR
120
±30
1875
16
V
mJ
A
Gate-Source Voltage
Single Pulse Avalanche Energy
2
Avalanche Current, Repetitive or Non-Repetitive
Thermal and Mechanical Characteristics
Symbol Characteristic
Min
Typ
Max
1040
0.12
Unit
P
D
T
o
tal Power Dissipation @ T
C
= 25°C
W
R
θ
JC
Junction to Case Thermal Resistance
°C/W
°C
R
θ
CS
0.11
Case to Sink Thermal Resistance, Flat, Greased Surface
T
J
,T
STG
-55
150
300
Operating and Storage Junction
T
e
mperature Range
T
L
Soldering
T
e
mperature for 10 Seconds (1.6mm from case)
oz
g
0.22
6.2
W
T
Package Weight
in·lbf
N·m
10
T
o
rque
Mounting
T
o
rque ( TO-264 Package), 4-40 or M3 screw
1.1
Static Characteristics
T =
25°C unless otherwise speci
fi
ed
J
APT31M100B2_L
Parameter
Test Conditions
Min
Typ
Max
Unit
V
Symbol
V
BR(DSS)
V
= 0V
,
I =
250
μ
A
Drain-Source Breakdown Voltage
Breakdown Voltage
T
e
mperature Coef
fi
cient
Drain-Source On Resistance
3
Gate-Source Threshold Voltage
Threshold Voltage
T
e
mperature Coef
fi
cient
1000
GS
D
∆
V
BR(DSS)
/
∆
T
J
Reference to 25°C, I
= 250
μ
A
D
V/°C
Ω
1.15
0.34
4
V
= 10V
,
I =
16A
D
R
DS(on)
V
GS(th)
0.38
5
GS
V
3
V
= V
DS
,
I =
2.5mA
D
GS
∆
V
GS(th)
/
∆
T
J
mV/°C
-10
V
= 1000V
= 0V
T =
25°C
J
100
500
DS
I
DSS
I
GSS
Zero Gate Voltage Drain Current
Gate-Source Leakage Current
μ
A
V
T =
125°C
J
GS
V
= ±30V
nA
±100
GS
Dynamic Characteristics
T =
25°C unless otherwise speci
fi
ed
J
Symbol
Parameter
Test Conditions
Min
Typ
34
Max
Unit
g
fs
V
= 50V
,
I =
16A
S
Forward Transconductance
Input Capacitance
DS
D
C
iss
C
rss
C
oss
8500
115
700
V
= 0V
,
V =
25V
DS
GS
Reverse Transfer Capacitance
Output Capacitance
f = 1MHz
pF
4
C
o(cr)
Effective Output Capacitance, Charge Related
Effective Output Capacitance, Energy Related
290
150
V
= 0V
,
V =
0V to 667V
DS
GS
5
C
o(er)
Q
g
Q
gs
Q
gd
t
d(on)
T
o
tal Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Current Rise Time
Turn-Off Delay Time
Current Fall Time
260
46
V
= 0 to 10V
,
I =
16A,
GS
D
nC
ns
V
= 500V
DS
125
39
Resistive Switching
V =
667V
,
I =
16A
DD
t
r
t
d(off)
t
f
35
D
R
= 2.2
Ω
6
,
V
= 15V
GG
130
33
G
Source-Drain Diode Characteristics
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
Continuous Source Current
(Body Diode)
D
S
MOSFET symbol
showing the
integral reverse p-n
junction diode
(body diode)
I
S
32
A
G
Pulsed Source Current
(Body Diode)
1
I
SM
120
1
V
SD
t
rr
I
= 16A
,
T =
25°C, V
= 0V
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
V
SD
J
GS
3
I
= 16A
1140
30
ns
μ
C
SD
Q
rr
di
SD
/
dt = 100A/
μ
s, T
= 25°C
J
I
≤
16A, di/dt
≤
1000A/
μ
s, V
= 667V,
SD
DD
V/ns
dv/dt
Peak Recovery dv/dt
10
T =
125°C
J
1
2
3
Repetitive Rating: Pulse width and case temperature limited by maximum junction temperature.
Starting at T
J
= 25°C, L = 14.65mH, R
G
= 2.2
Ω
, I
AS
= 16A.
Pulse test: Pulse Width < 380
μ
s, duty cycle
< 2%.
4
5
C
o(cr)
is de
fi
ned as a
fi
xed capacitance with the same stored charge as C
OSS
with V
DS
= 67% of V
(BR)DSS
.
C
o(er)
is de
fi
ned as a
fi
xed capacitance with the same stored energy as C
OSS
with V
DS
= 67% of V
(BR)DSS
.
T
o
c
alculate C
o(cr)
for any value of
V
DS
less than V
(BR)DSS,
use this equation:
C
o(er)
= -2.47E-7/V
DS
^2 + 4.36E-8/V
DS
+ 8.44E-11.
6
R
G
is external gate resistance, not including internal gate resistance or gate driver impedance.
(MIC4452)
Microsemi reserves the right to change, without notice, the speci
fi
cations and information contained herein.
APT31M100B2_L
35
30
25
20
15
10
100
90
80
70
60
50
40
30
20
V
= 10V
T
= 125°C
GS
J
V
GS
= 6, 7, 8 & 9V
T
J
= -55°C
T
J
= 25°C
5V
T
J
= 125°C
T
J
= 150°C
5
0
4.5V
10
0
0
5
10
15
20
25
30
0
0
0
5
10
15
20
25
30
V
, DRAIN-TO-SOURCE VOLTAGE (V)
V
, DRAIN-TO-SOURCE VOLTAGE (V)
DS(ON)
DS
Figure 1,
Output Characteristics
Figure 2,
Output Characteristics
120
100
80
3.0
2.5
2.0
1.5
1.0
NORMALIZED TO
= 10V
16A
V
DS
> I
D(ON)
x R
DS(ON)
MAX.
250
μ
SEC. PULSE TEST
V
@
GS
@ <0.5 % DUTY CYCLE
T
J
= -55°C
60
T
J
= 25°C
40
T
J
= 125°C
20
0
0.5
0
-55 -25
0
25 50 75
100 125 150
1
2
3
4
5
6
7
8
T , JUNCTION
TEMPERATURE (°C)
V
, GATE-TO-SOURCE VOLTAGE (V)
J
GS
Figure 3,
R
vs Junction Temperature
Figure 4,
Transfer Characteristics
DS(ON)
20,000
10,000
45
40
35
30
25
20
15
10
C
iss
T
J
= -55°C
T
J
= 25°C
T
J
= 125°C
1000
C
oss
100
10
C
rss
5
0
0
4
8
12
16
20
200
, DRAIN-TO-SOURCE VOLTAGE (V)
DS
400
600
800
1000
I ,
DRAIN CURRENT (A)
V
D
Figure 5,
Gain vs Drain Current
Figure 6, Capacitance vs Drain-to-Source Voltage
120
16
14
12
10
8
I
= 16A
D
100
80
60
40
20
0
V
DS
=
200V
V
DS
=
500V
T
J
= 25°C
6
V
DS
=
800V
T
J
= 150°C
4
2
0
0
50 100
150 200 250 300 350 400
0
0.3
0.6
0.9
1.2
1.5
Q ,
TOTAL GATE CHARGE (nC)
V
SD
, SOURCE-TO-DRAIN VOLTAGE (V)
g
Figure 7, Gate Charge vs Gate-to-Source Voltage
Figure 8, Reverse Drain Current vs Source-to-Drain Voltage
APT31M100B2_L
200
100
200
100
I
I
DM
DM
10
1
10
1
13
μ
s
100
μ
s
13
μ
s
100
μ
s
ds(on)
R
1ms
10ms
1ms
10ms
T
=
150°C
J
R
T
C
=
25°C
ds(on)
Scaling for Different Case & Junction
T
e
mperatures:
100ms
DC line
T
=
125°C
100ms
DC line
J
I
D
=
I
D(T =
25
°
C)
*(
T
–
T
C
)/125
T
C
=
75°C
J
C
0.1
0.1
1
10
100
1200
1
10
100
1200
V
, DRAIN-TO-SOURCE VOLTAGE (V)
V
, DRAIN-TO-SOURCE VOLTAGE (V)
DS
DS
Figure 9, Forward Safe Operating Area
Figure 10, Maximum Forward Safe Operating Area
0.14
0.12
0.10
0.08
0.06
0.04
D = 0.9
0.7
Note:
0.5
0.3
t
1
t
2
t
= Pulse Duration
t
1
SINGLE PULSE
1
t
/
2
+ T
Duty Factor D =
0.02
0
0.1
Peak T
= P
x Z
J
DM
θJC C
0.05
10
-5
10
-4
10
-3
10
-2
10
-1
1.0
RECTANGULAR PULSE DURATION (seconds)
Figure 11. Maximum Effective Transient Thermal Impedance Junction-to-Case vs Pulse Duration
T-MAX™ (B2) Package Outline
TO-264 (L) Package Outline
e3 100%
Sn Plated
4.69 (.185)
5.31 (.209)
4.60 (.181)
15.49 (.610)
16.26 (.640)
5.21 (.205)
19.51 (.768)
20.50 (.807)
1.49 (.059)
2.49 (.098)
1.80 (.071)
2.01 (.079)
3.10 (.122)
3.48 (.137)
5.38 (.212)
6.20 (.244)
5.79 (.228)
6.20 (.244)
20.80 (.819)
21.46 (.845)
25.48 (1.003)
26.49 (1.043)
2.87 (.113)
3.12 (.123)
4.50 (.177) Max.
2.29 (.090)
2.69 (.106)
2.29 (.090)
2.69 (.106)
1.65 (.065)
2.13 (.084)
0.40 (.016)
1.016(.040)
19.81 (.780)
20.32 (.800)
19.81 (.780)
21.39 (.842)
Gate
Drai n
Source
Gate
Drai n
Source
1.01 (.040)
1.40 (.055)
0.48 (.019)
0.84 (.033)
2.59 (.102)
3.00 (.118)
0.76 (.030)
1.30 (.051)
2.21 (.087)
2.59 (.102)
2.79 (.110)
5.45 (.215) BSC
2-Plcs.
3.18 (.125)
5.45 (.215) BSC
2-Plcs.
These dimensions are equal to the TO-247 without the mounting hole.
Dimensions in Millimeters (Inches)
Dimensions in Millimeters (Inches)
