Microchip-Tech-APT8014L2LLG

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Microchip-Tech-APT8014L2LLG
APT8014L2LL  
800V 52A 0.140
Ω  
R
POWER MOS 7
 
MOSFET  
TO-264  
Max  
Power MOS 7

®

is a new generation of low loss, high voltage, N-Channel  
enhancement mode power MOSFETS.
 
Both conduction and switching  
losses are addressed with Power MOS 7

®

by significantly lowering R

DS(ON)  

and Q

g

. Power
 
MOS 7

®

combines lower conduction and switching losses  
along with exceptionally fast switching speeds inherent with APT’s  
patented metal gate structure.  
D
S
• Lower Input Capacitance  
• Lower Miller Capacitance  
• Lower Gate Charge, Qg  
• Increased Power Dissipation  
• Easier To Drive  
G
• Popular TO-264 Max Package  
MAXIMUM RATINGS  
Symbol Parameter  
All Ratings:
 
T =
 
25°C unless otherwise specified.  
C
APT8014L2LL  
UNIT  
V

DSS  

I

D  

Drain-Source Voltage  
800  
52  
Volts  
Continuous Drain Current @ T

C

= 25°C  
Amps  
Volts  
1
I

D
M  

Pulsed Drain Current  
208  
V

GS  

V

GSM  

Gate-Source Voltage Continuous  
Gate-Source Voltage Transient  
Total Power Dissipation @ T

C

= 25°C  
Linear Derating Factor  
±30  
±40  
Watts  
W/°C  
893  
P

D  

7.14  
-55 to 150  
300  
T

J

,T

STG  

T

L  

Operating and Storage Junction Temperature Range  
°C  
Amps  
mJ  
Lead Temperature: 0.063″ from Case for 10 Sec.  
1
I

AR  

Avalanche Current  
(Repetitive and Non-Repetitive)  
52  
1
E

AR  

E

AS  

Repetitive Avalanche Energy  
Single Pulse Avalanche Energy  
50  
4
3200  
STATIC ELECTRICAL CHARACTERISTICS  
Symbol Characteristic
 
/ Test Conditions  
MIN  
TYP  
MAX  
UNIT  
Volts  
Ohms  
BV

DSS  

R

DS(on)  

Drain-Source Breakdown Voltage
 
(V

GS

= 0V, I

D

= 250µA)  
800  
2
Drain-Source On-State Resistance  
(V

GS

= 10V, 26A)  
0.140  
100  
500  
±100  
5
Zero Gate Voltage Drain Current
 
(V

DS

= 800V, V

GS

= 0V)  
Zero Gate Voltage Drain Current
 
(V

DS

= 640V, V

GS

= 0V, T

C

= 125°C)  
Gate-Source Leakage Current
 
(V

GS

= ±30V, V

DS

= 0V)  
Gate Threshold Voltage
 
(V

DS

= V

GS

, I

D

= 5mA)  
I

DSS  

µA  
I

GSS  

nA  
V

GS(th)  

Volts  
3
CAUTION:
These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  

DYNAMIC CHARACTERISTICS  
Symbol Characteristic  
APT8014L2LL  
Tes
t
C
onditions  
MIN  
TYP  
MAX  
UNIT  
C

iss  

C

oss  

C

rss  

Q

g  

Input Capacitance  
7238  
1402  
248  
285  
30  
V
= 0V  
GS  
Output Capacitance  
V
= 25V  
DS  
pF  
f = 1 MHz  
Reverse Transfer Capacitance  
3
Total Gate Charge  
V
= 10V  
GS  
V
= 400V  
Q

gs  

Q

gd  

t

d(on)  

t

r  

DD  
Gate-Source Charge  
Gate-Drain (“Mille
r
“
) Charge  
Turn-on Delay Time  
Rise Time  
nC  
I
= 52A @ 25°C  
D
170  
20  
RESISTIV
E
S
WITCHING  
V
= 15V  
GS  
19  
V
= 400V  
DD  
ns  
µ
J  
I
= 52A @ 25°C  
D
t

d(off)  

69  
Turn-off Delay Time  
R
= 0.6
Ω  
G
t

f  

Fall Time  
15  
INDUCTIV
E
S
WITCHIN
G
@
2
5°C  
6
E

on  

E

off  

E

on  

E

off  

Turn-on Switching Energy  
1091  
1135  
1662  
1383  
V
= 533V,
 
V =
 
15V  
GS  
DD  
I
= 52A,
 
R =
 
1.7
Ω  
Turn-off Switching Energy  
D
G
INDUCTIV
E
S
WITCHIN
G
@
1
25°C  
6
Turn-on Switching Energy  
V
= 533V, V
 
= 15V  
GS  
DD  
I
= 52A,
 
R =
 
1.7
Ω  
Turn-off Switching Energy  
D
G
SOURCE-DRAI
N
D
IOD
E
R
ATING
S
A
N
D
C
HARACTERISTICS  
Symbol  
I

S  

MIN  
TYP  
MAX  
Characteristic / Test Conditions  
UNIT  
52  
208  
1.3  
Continuous Source Current
 
(Body Diode)  
Amps  
I

SM  

1
Pulsed Source Current  
(Body Diode)  
2
V

SD  

t

rr  

Diode Forward Voltage
 
(V

GS

= 0V, I

S

= -I

D

52A
)  
Volts  
ns  
Reverse Recovery Time
 
(I

S

= -I

D

52A
, dl

S

/dt = 100A/µs)  
Reverse Recovery Charge
 
(I

S

= -I

D

52A
, dl

S

/dt = 100A/µs)  
930  
29  
Q

rr  

µC  
dv  
/
dv  
5
V/ns  
Peak Diode Recovery  
/
dt  
10  
dt  
THERMA
L
C
HARACTERISTICS  
Symbol Characteristic  
MIN  
TYP  
MAX  
0.14  
40  
UNIT  
R

θ
JC  

R

θ
JA  

Junction to Case  
°C/W  
Junction to Ambient  
1 Repetitive
 
Rating: Pulse width limited by maximum junction  
temperature  
4 Starting
 
T =
 
+25°C, L = 2.37mH, R
 
= 25
Ω
, Peak I
 
= 52A  
j
G
L
dv  
5
/
numbers reflect the limitations of the test circuit rather than the  
di  
dt  
2 Pulse
 
Test: Pulse width < 380 µs, Duty Cycle < 2%  
3 See
 
MIL-STD-750 Method 3471  
device itself.  
I
≤
–
I
52A  
/
≤
700A/µs  
V

R

≤
800V
T
≤
150
°
C  
J
dt  
S
D
6
Eon includes diode reverse recovery.
 
See figures 18, 20.  
AP
T
R
eserve
s
t
h
e
r
igh
t
t
o
c
hange
,
w
ithou
t
n
otice
,
t
h
e
s
pecification
s
a
n
d
i
nformatio
n
c
ontaine
d
h
erein.  
0.16  
0.14  
0.9  
0.12  
0.7  
0.10  
0.08  
0.5  
Note:  
t
0.06  
1
0.3  
t
2
0.04  
t
1
Duty Factor
 
D =  
/
t
2
Peak T
 
= P  
x Z
 
+ T  
0.02  
0
0.1  
J
DM  
θ
JC C  
0.05  
SINGL
E
P
ULSE  
10

-5  

10

-4  

10

-3  

RECTANGULA
R
P
ULS
E
D
URATIO
N
(
SECONDS)  
FIGUR
E
1
,
M
AXIMU
M
E
FFECTIV
E
T
RANSIEN
T
T
HERMA
L
I
MPEDANCE
,
J
UNCTION-TO-CAS
E
v
s
P
ULS
E
D
URATION  
10

-2  

10

-1  

1.0  

Typical Performance Curves  
APT8014L2LL  
140  
120  
100  
80  
8V  
7V  
V
=15 & 10V  
GS  
RC MODEL  
6.5V  
Junction  
temp. ( ”C)  
0.0509  
0.0522F  
0.988F  
6V  
Power  
(Watts)  
60  
5.5V  
0.0894  
40  
Case temperature  
5V  
20  
0
0
5
10  
15  
20  
25  
30  
V
,
D
RAIN-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
DS  
FIGUR
E
2
, TRANSIENT THERMAL IMPEDANCE MODEL  
FIGUR
E
3
,
L
OW VOLTAGE OUTPU
T
C
HARACTERISTICS  
140  
1.40  
V
> I
 
(ON) x  
R
(ON)MAX.  
DS  
NORMALIZED TO  
DS  
D
250µSEC. PULSE TEST  
@ <0.5 % DUTY CYCLE  
V
= 10V  
@
26A  
GS  
120  
100  
80  
60  
40  
20  
0
1.30  
1.20  
1.10  
1.00  
V
=10V  
T
= -55°C  
GS  
J
T
J
= +25°C  
V
=20V  
80  
GS  
0.90  
0.80  
T
= +125°C  
J
0
1
2
3
4
5
6
7
8
0
20  
40  
60  
100  
120  
V
,
G
ATE-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
I
,
D
RAI
N
C
URREN
T
(
AMPERES)  
GS  
D
FIGUR
E
4
, TRANSFE
R
C
HARACTERISTICS  
FIGUR
E
5
,
R
(
ON
)
v
s
D
RAI
N
C
URRENT  
DS  
1.15  
1.10  
1.05  
1.00  
60  
50  
40  
30  
20  
0.95  
0.90  
10  
0
25  
50  
75  
100  
125  
150  
-50 -25  
0
25  
50  
75 100
 
125 150  
T
,
C
AS
E
T
EMPERATUR
E
(
°C)  
T
,
J
UNCTIO
N
T
EMPERATUR
E
(
°C)  
C
J
FIGUR
E
6
,
M
AXIMU
M
D
RAI
N
C
URREN
T
v
s
C
AS
E
T
EMPERATURE  
FIGUR
E
7
,
B
REAKDOW
N
V
OLTAG
E
v
s
T
EMPERATURE  
1.2  
2.5  
I
= 26A  
= 10V  
D
V
GS  
1.1  
1.0  
0.9  
0.8  
2.0  
1.5  
1.0  
0.5  
0.0  
0.7  
0.6  
-50 -25  
0
25 50  
75 100
 
125 150  
-50 -25  
0
25  
50  
75 100 125 150  
T
,
J
UNCTIO
N
T
EMPERATUR
E
(
°C)  
T
,
C
AS
E
T
EMPERATUR
E
(
°C)  
J
C
FIGUR
E
8
,
O
N-RESISTANC
E
v
s
.
T
EMPERATURE  
FIGUR
E
9
,
T
HRESHOL
D
V
OLTAG
E
v
s
T
EMPERATURE  

APT8014L2LL  
208  
20,000  
10,000  
OPERATIO
N
H
ERE  
LIMITE
D
B
Y
R
(
ON)  
DS  
100  
50  
C
iss  
100µS  
C
oss  
1,000  
10  
5
1mS  
10mS  
T
=+25°C  
C
C
rss  
T =+150°C  
J
SINGL
E
P
ULSE  
10  
1
100  
1
100  
800  
0
10  
20  
30  
40  
50  
V
,
D
RAIN-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
V
,
D
RAIN-TO-SOURC
E
V
OLTAG
E
(
VOLTS)  
DS  
DS  
FIGUR
E
1
0
,
M
AXIMU
M
S
AF
E
O
PERATIN
G
A
REA  
FIGUR
E
1
1, CAPACITANC
E
v
s
D
RAIN-TO-SOURC
E
V
OLTAGE  
200  
16  
I
= 52A  
D
100  
12  
V
=
1
60V  
T =+150°C  
J
DS  
T =+25°C  
J
V
=
4
00V  
DS  
V
=
6
40V  
8
DS  
10  
4
0
1
0
50 100
 
150 200 250 300 350 400  
Q
,
T
OTA
L
G
AT
E
C
HARG
E
(
nC)  
0.3  
V
0.5  
0.7  
0.9  
1.1  
1.3  
1.5  
,
S
OURCE-TO-DRAI
N
V
OLTAG
E
(
VOLTS)  
g
SD  
FIGUR
E
1
2
,
G
AT
E
C
HARGE
S
v
s
G
ATE-TO-SOURC
E
V
OLTAGE  
FIGUR
E
1
3, SOURCE-DRAI
N
D
IOD
E
F
ORWAR
D
V
OLTAGE  
160  
140  
V
= 533V  
DD  
= 3
Ω  
t
d(off)  
R
T
140  
120  
G
120  
100  
80  
60  
40  
20  
0
= 125°C  
J
L = 100µH  
t
f
V
= 533V  
DD  
= 3
Ω  
100  
80  
60  
40  
20  
0
R
T
G
= 125°C  
J
L = 100µH  
t
r
t
d(on)  
10  
20  
30  
40  
I
50  
(A)  
60  
70  
80  
10  
20  
30  
40  
I
50  
(A)  
60  
70  
80  
D
D
FIGURE 14,
 
DELAY TIMES vs CURRENT  
FIGURE 15, RISE
 
AND FALL TIMES vs CURRENT  
12000  
10000  
8000  
6000  
4000  
3000  
2500  
2000  
1500  
1000  
V
= 533V  
V
I
= 533V  
DD  
DD  
= 52A  
R
= 3
Ω  
G
D
E
off  
T
= 125°C  
T
= 125°C  
J
J
L = 100µH  
L = 100µH  
E

ON

includes  
E

ON

includes  
diode reverse recovery.  
diode reverse recovery.  
E
on  
E
on  
E
off  
500  
0
2000  
0
10  
20  
30  
40  
50  
(A)  
60  
70  
80  
0
5
10 15 20 25 30 35 40 45 50  
I
R
,
G
AT
E
R
ESISTANC
E
(
Ohms)  
D
G
FIGUR
E
1
6, SWITCHING ENERG
Y
v
s CURRENT  
FIGURE 17, SWITCHING
 
ENERGY VS. GATE RESISTANCE  

Typical Performance Curves  
APT8014L2LL  
10 %  
90%  
Gate Voltage  
Drain Voltage  
T
= 125 C  
T
= 125 C  
J
J
t
d(off)  
t
d(on)  
90%  
90%  
t
t
f
r
5 %  
10%  
0
5 %  
10 %  
Drain Current  
Switching Energy  
Switching Energy  
Figur
e
1
9
,
T
urn-of
f
S
witchin
g
W
aveform
s
a
n
d
D
efinitions  
Figur
e
1
8
,
T
urn-o
n
S
witchin
g
W
aveform
s
a
n
d
D
efinitions  
APT30DF60  
V

CE  

I

C  

V

DD  

G
D.U.T.  
Figure 20, Inductive Switching Test Circuit  
TO-26
4
M
AX

TM

(L2
)
P
ackag
e
O
utline  
4.60 (.181)  
5.21 (.205)  
19.51 (.768)  
20.50 (.807)  
1.80 (.071)  
2.01 (.079)  
5.79 (.228)  
6.20 (.244)  
25.48 (1.003)  
26.49 (1.043)  
2.29 (.090)  
2.69 (.106)  
2.29 (.090)  
2.69 (.106)  
19.81 (.780)  
21.39 (.842)  
Gate  
Drain  
Source  
0.48 (.019)  
0.84 (.033)  
2.59 (.102)  
3.00 (.118)  
0.76 (.030)  
1.30 (.051)  
2.79 (.110)  
3.18 (.125)  
5.45 (.215) BSC  
2-Plcs.  
Dimensions in Millimeters and (Inches)  
APT’
s
p
roduct
s
a
r
e
c
overe
d
b
y
o
n
e
o
r
m
or
e
o
f
U
.S.patent
s
4
,895,810 5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,05
8
a
n
d
f
oreig
n
p
atents. U
S
a
n
d
F
oreig
n
p
atent
s
p
ending. Al
l
R
ight
s
R
eserved.