Microchip-Tech-APT80GA90B

Part #Microchip-Tech-APT80GA90B
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Microchip-Tech-APT80GA90B
APT80GA90B  
APT80GA90S  
900V  
High Speed PT IGBT  
POWER MOS 8

®

is a high speed Punch-Through switch-mode IGB
T
.
 
L
ow E

off

is achieved  
APT80GA90S  
through leading technology silicon design and lifetime control processes.
 
A reduced E

off  

–
D

3

PAK  
V

CE(ON)

tradeoff results in superior ef
fi
ciency compared to other IGBT technologies.
 
Low  
gate charge and a greatly reduced ratio of C

res

/C

ies

provide excellent noise immunity, short  
delay times and simple gate drive.
 
The intrinsic chip gate resistance and capacitance of the  
poly-silicone gate structure help control di/dt during switching, resulting in low EMI, even  
when switching at high frequency.  
APT80GA90B  
Single die IGBT  
FEATURES  
TYPICAL APPLICATIONS  
• Fast
 
switching with low EMI  
• Very
 
Low E

off

for maximum ef
fi
ciency  
• Ultra
 
low C

res

for improved noise immunity  
• Low
 
conduction loss  
• ZVS
 
phase shifted and other full bridge  
• Half
 
bridge  
• High
 
power PFC boost  
• Welding  
• Low
 
gate charge  
• UPS,
 
solar, and other inverters  
• High
 
frequency, high ef
fi
ciency industrial  
• Increased
 
intrinsic gate resistance for low EMI  
• RoHS
 
compliant  
Absolute Maximum Ratings  
Symbol Parameter  
Ratings  
Unit  
Collector Emitter Voltage  
900  
V
V

ces  

I

C1  

Continuous Collector Current @ T

C

= 25°C  
Continuous Collector Current @ T

C

= 100°C  
Pulsed Collector Current

1  

145  
80  
A
I

C2  

I

CM  

239  
V

GE  

Gate-Emitter Voltage

2  

±30  
V
P

D  

T
o
tal Power Dissipation @ T

C

= 25°C  
Switching Safe Operating Area @ T

J

= 150°C  
Operating and Storage Junction
T
e
mperature Range  
625  
W
SSOA  
T

J

, T

STG  

T

L  

239A @ 900V  
-55 to 150  
°C  
Lead
T
e
mperature for Soldering: 0.063″ from Case for 10 Seconds  
300  
Static Characteristics  
Symbol Parameter  
T =
 
25°C unless otherwise speci
fi
ed  
J
Test Conditions  
Min  
Typ  
Max  
Unit  
V

BR(CES)  

Collector-Emitter Breakdown Voltage  
V

GE

= 0V, I

C

= 1.0mA  
900  
T

J

= 25°C  
T

J

= 125°C  
2.5  
2.2  
4.5  
3.1  
V

GE

= 15
V
,  
I

C

= 47A  
V
V

CE(on)  

V

GE(th)  

I

CES  

Collector-Emitter On Voltage  
Gate Emitter Threshold Voltage  
Zero Gate Voltage Collector Current  
Gate-Emitter Leakage Current  
V

GE

=V

CE

, I

C

= 1mA  
3
6
T

J

= 25°C  
250  
V

CE

= 900V,  
μ
A  
V

GE

= 0V  
T

J

= 125°C  
1000  
±100  
I

GES  

V

GS

= ±30V  
nA  
Thermal and Mechanical Characteristics  
Symbol Characteristic  
Min  
Typ  
–
Max  
0.2  
–
Unit  
°C/W  
g
R

θ
JC  

W

T  

Junction to Case Thermal Resistance  
Package Weight  
–
–
5.9  
T
o
rque  
Mounting
T
o
rque (TO-247 Package), 4-40 or M3 screw  
in·lbf  
10  

APT80GA90B_S  
Dynamic Characteristics  
T =
 
25°C unless otherwise speci
fi
ed  
J
Symbol  
C

ies  

Parameter  
Test Conditions  
Capacitance  
Min  
Typ  
4560  
411  
62  
Max  
Unit  
Input Capacitance  
C

oes  

Output Capacitance  
Reverse Transfer Capacitance  
T
o
tal Gate Charge  
Gate-Emitter Charge  
V

GE

= 0V, V

CE

= 25V  
f = 1MHz  
pF  
C

res  

Q

g

3  

Gate Charge  
200  
30  
Q

ge  

V

GE

= 15V  
nC  
A
72  
V

CE

= 450V  
Q

gc  

Gate- Collector Charge  
I

C

= 47A  
T

J

= 150°C, R

G

= 4.7
Ω

4

, V

GE

= 15V,  
L= 100uH, V

CE

= 900V  
Inductive Switching (25°C)  
V

CC

= 600V  
239  
SSOA  
Switching Safe Operating Area  
t

d(on)  

t

r  

t

d(off)  

t

f  

Turn-On Delay Time  
Current Rise Time  
18  
29  
ns  
μ
J  
ns  
μ
J  
Turn-Off Delay Time  
Current Fall Time  
149  
85  
V

GE

= 15V  
I

C

= 47A  
R

G

= 4.7
Ω

4  

E

on2  

Turn-On Switching Energy  
Turn-Off Switching Energy  
Turn-On Delay Time  
Current Rise Time  
1652  
1389  
18  
6
E

off  

T

J

= +25°C  
t

d(on  

t

r  

t

d(off)  

t

f  

Inductive Switching (125°C)  
31  
V

CC

= 600V  
Turn-Off Delay Time  
Current Fall Time  
192  
128  
2813  
2082  
V

GE

= 15V  
I

C

= 47A  
R

G

= 4.7
Ω

4  

E

on2  

Turn-On Switching Energy  
Turn-Off Switching Energy  
6
E

off  

T

J

= +125°C  
1
2
3
4
5
Repetitive Rating: Pulse width and case temperature limited by maximum junction temperature.  
Pulse test: Pulse Width < 380
μ
s
, duty cycle
 
< 2%.  
See Mil-Std-750 Method 3471.  
R

G

is external gate resistance, not including internal gate resistance or gate driver impedance.
 
(MIC4452)  
E

on2

is the clamped inductive turn on energy that includes a commutating diode reverse recovery current in the IGBT turn on energy loss. A combi device is used for the  
clamping diode.  
E

off

is the clamped inductive turn-off energy measured in accordance with JEDEC standard JESD24-1.  
Microsemi reserves the right to change, without notice, the speci
fi
cations and information contained herein.  
6

Typical Performance Curves  
APT80GA90B_S  
100  
350  
300  
250  
200  
150  
100  
50  
V
= 15V  
GE  
T

J

= 125°C  
T

J

= 150°C  
13V  
15V  
T

J

= 55°C  
10V  
80  
60  
40  
20  
T

J

= 25°C  
9V  
8V  
7V  
6V  
5V  
0
0
0
V
1
2
3
4
5
6
0
V
4
8
12 16 20 24  
28  
32  
, COLLECTOR-TO-EMITTER VOLTAGE (V)  
, COLLECTOR-TO-EMITTER VOLTAGE (V)  
CE  
CE  
FIGURE 1,
 
Output Characteristics
 
(T =
 
25°C)  
FIGURE 2,
 
Output Characteristics
 
(T =
 
25°C)  
J
J
16  
14  
12  
10  
250  
200  
150  
100  
50  
250
μ
s PULSE  
TEST<0.5 % DUTY  
CYCLE  
I
= 47A  
C
T
= 25°C  
J
V
= 180V  
CE  
V
= 450V  
CE  
8
V
= 720V  
CE  
6
4
2
0
T

J

= 125°C  
T

J

= 25°C  
T

J

= -55°C  
0
0
20 40 60
 
80 100 120
 
140 160 180
 
200  
GATE CHARGE (nC)  
0
2
4
6
8
10  
12 14  
V
, GATE-TO-EMITTER VOLTAGE (V)  
GE  
FIGURE 4,
 
Gate charge  
FIGURE 3,
 
Transfer Characteristics  
6
5
4
3
2
6
5
4
3
2
1
0
T

J

= 25°C.  
250
μ
s PULSE TEST  
<0.5 % DUTY CYCLE  
I
= 94A  
C
I
= 94A  
C
I
= 47A  
I
= 47A  
C
C
I
= 23.5A  
C
I
= 23.5A  
C
1
0
V

GE

= 15V.  
250
μ
s PULSE TEST  
<0.5 % DUTY CYCLE  
6
8
10  
12  
14  
16  
0
25  
50  
75  
100  
125  
150  
V
, GATE-TO-EMITTER VOLTAGE (V)  
T , Junction
T
e
mperature (°C)  
GE  
J
FIGURE 5,
 
On State Voltage vs Gate-to-Emitter Voltage  
FIGURE 6,
 
On State Voltage vs Junction Temperature  
1.15  
150  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
0.80  
0.75  
0.70  
125  
100  
75  
50  
25  
0
-50 -25  
0
25 50
 
75 100
 
125 150  
25  
50  
75  
100  
125  
150  
T , JUNCTION TEMPERATURE  
T ,
 
Case
T
e
mperature (°C)  
J
C
FIGURE 7,
 
Threshold Voltage vs Junction Temperature  
FIGURE 8,
 
DC Collector Current vs Case Temperature  

Typical Performance Curves  
APT80GA90B_S  
24  
300  
250  
200  
150  
100  
50  
V

CE

= 600V  
T

J

= 25°C
,
or 125°C  
22  
R

G

= 4.7
ꢀ
 
L = 100
μ
H  
20  
18  
16  
14  
12  
10  
V

GE

=15V,T

J

=125°C  
V

GE

=15V,T

J

=25°C  
V

CE

=
600V  
R

G

=
4.7
ꢀ  
L = 100
μ
H  
0
0
20  
40  
60  
80  
100  
0
20  
40  
60  
80  
100  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
CE  
CE  
FIGURE 9, Turn-On Delay Time vs Collector Current  
FIGURE 10, Turn-Off Delay Time vs Collector Current  
100  
80  
60  
40  
20  
0
200  
R

G

=
4.7
ꢀ
, L
=
100
μ
H, V

CE

=
600V  
175  
T

J

=
125°C, V

GE

=
15V  
150  
125  
100  
75  
T

J

=
25°C, V

GE

=
15V  
50  
T

J

=
25 or 125°C,V

GE

=
15V  
25  
R

G

=
4.7
ꢀ
, L
=
100
μ
H, V

CE

=
600V  
0
0
20  
40  
60  
80  
100  
0
20  
40  
60  
80  
100  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
CE  
CE  
FIGURE 12, Current Fall Time vs Collector Current  
FIGURE 11, Current Rise Time vs Collector Current  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
6000  
5000  
4000  
3000  
2000  
1000  
V
V
=
=
600V  
+15V  
V
V
=
=
600V  
+15V  
CE  
GE  
CE  
GE  
R
=4.7
ꢀ  
R
= 4.7
ꢀ  
G
G
T

J

=
125°C  
T

J

=
125°C  
T

J

=
25°C  
T

J

=
25°C  
0
0
0
20  
40  
60  
80  
100  
0
20  
40  
60  
80  
100  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
CE  
CE  
FIGURE 13, Turn-On Energy Loss vs Collector Current  
FIGURE 14, Turn-Off Energy Loss vs Collector Current  
12000  
10000  
8000  
6000  
4000  
2000  
7000  
E

on2

94A  
V
V
T
=
=
600V  
+15V  
V
V
=
=
600V  
+15V  
CE  
GE  
CE  
GE  
E

on2,

94A  
= 125°C  
R
= 4.7
ꢀ  
6000  
5000  
4000  
3000  
2000  
1000  
J
G
E

off,

94A  
E

off,

94A  
E

on2,

47A  
E

on2,

47A  
E

off,

47A  
E

off,

47A  
E

on2,

23.5A  
E

on2,

23.5A  
E

off,

23.5A  
E

off,

23.5A  
0
0
0
10  
G
20  
30  
40  
50  
0
25  
50  
75  
100  
125  
R ,
 
GATE RESISTANCE (OHMS)  
T , JUNCTION TEMPERATURE (°C)  
J
FIGURE 15, Switching Energy Losses vs Gate Resistance  
FIGURE 16, Switching Energy Losses vs Junction Temperature  

Typical Performance Curves  
APT80GA90B_S  
1000  
100  
10  
10000  
C

ies  

1000  
100  
10  
C

oes  

1
C

res  

0.1  
0
200  
400  
600  
800  
1
CE  
10  
100  
1000  
V
, COLLECTOR-TO-EMITTER VOLTAGE  
V
, COLLECTOR-TO-EMITTER VOLTAGE (VOLTS)  
CE  
FIGURE 18,
 
Minimum Switching Safe Operating Area  
FIGURE 17,
 
Capacitance vs Collector-To-Emitter Voltage  
0.25  
0.20  
D = 0.9  
0.15  
0.10  
0.05  
0
0.7  
0.5  
Note:  
t
1
0.3  
t
2
t
1
t
/
2
Duty Factor D =  
0.1  
Peak T
 
= P  
x Z  
+ T  
θJC C  
J
DM  
SINGLE PULSE  
0.05  
10

-4  

10

-2  

10

-5  

10

-3  

0.1  
1
RECTANGULAR PULSE DURATION (SECONDS)  
Figure 19, Maximum Effective Transient Thermal Impedance, Junction-To-Case vs Pulse Duration  

APT80GA90B_S  
10%  
Gate Voltage  
T
= 125°C  
J
t

d(on)  

APT30DQ100  
90%  
Collector Current  
Collector Voltage  
t

r  

V

CE  

V

CC  

I

C  

10%  
5%  
5%  
Switching Energy  
A
D.U.T.  
Figure 20, Inductive Switching Test Circuit  
Figure 21, Turn-on Switching Waveforms and De
fi
nitions  
T
= 125°C  
J
90%  
t

d(off)  

Gate Voltage  
Collector Voltage  
t

f  

10%  
0
Collector Current  
Switching Energy  
Figure 22, Turn-off Switching Waveforms and De
fi
nitions  
D

3

PAK Package Outline  
TO-247 (B) Package Outline  
e1 SAC:
 
Tin, Silver, Copper  
e3 100%
 
Sn Plated  
4.98 (.196)  
5.08 (.200)  
1.47 (.058)  
1.57 (.062)  
4.69 (.185)  
15.95 (.628)  
16.05(.632)  
13.41 (.528)  
13.51(.532)  
5.31 (.209)  
15.49 (.610)  
16.26 (.640)  
1.04 (.041)  
1.15(.045)  
1.49 (.059)  
2.49 (.098)  
5.38 (.212)  
6.20 (.244)  
6.15 (.242) BSC  
Revised  
8/29/97  
11.51 (.453)  
11.61 (.457)  
13.79 (.543)  
13.99(.551)  
20.80 (.819)  
21.46 (.845)  
3.50 (.138)  
3.81 (.150)  
0.46 (.018)  
0.56 (.022)  
{3 Plcs}  
1.27 (.050)  
1.40 (.055)  
0.020 (.001)  
0.178 (.007)  
2.67 (.105)  
2.84 (.112)  
2.87 (.113)  
3.12 (.123)  
3.81 (.150)  
4.50 (.177) Max.  
1.98 (.078)  
2.08 (.082)  
4.06 (.160)  
(Base of Lead)  
1.65 (.065)  
2.13 (.084)  
1.22 (.048)  
1.32 (.052)  
0.40 (.016)  
1.016 (.040)  
19.81 (.780)  
20.32 (.800)  
Heat Sink (Drain)  
and Leads  
are Plated  
5.45 (.215) BSC  
{2 Plcs.  
1.01 (.040)  
1.40 (.055)  
Gate  
Collector  
}
Emitter  
Emitter  
Collector  
Gate  
2.21 (.087)  
2.59 (.102)  
5.45 (.215) BSC  
2-Plcs.  
Dimensions in Millimeters (Inches)  
Dimensions in Millimeters (Inches)