Microchip-Tech-APT9F100B
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APT9F100B
APT9F100S
1000V, 9A, 1.6
Ω
Max, t
≤
200ns
rr
N-Channel FREDFET
POWER MOS 8
®
is a high speed, high voltage N-channel switch-mode power
MOSFE
T
.
T
his
‘FREDFET’ version has a drain-source (body) diode that has been opti-
mized for high reliability in ZVS phase shifted bridge and other circuits through reduced
D
3
PAK
t ,
soft recovery, and high recovery dv/dt capability.
Low gate charge, high gain, and a
rr
greatly reduced ratio of C
/C result
in excellent noise immunity and low switching
rss iss
APT9F100B
APT9F100S
loss. The
intrinsic gate resistance and capacitance of the poly-silicon gate structure
help control di/dt during switching, resulting in low EMI and reliable paralleling, even
when switching at very high frequency.
Single die FREDFET
FEATURES
TYPICAL APPLICATIONS
• ZVS
phase shifted and other full bridge
• Fast
switching with low EMI
• Half
bridge
• Low
t for
high reliability
rr
• PFC
and other boost converter
• Buck
converter
• Ultra
low C
rss
for improved noise immunity
• Low
gate charge
• Single
and two switch forward
• Flyback
• Avalanche
energy rated
• RoHS
compliant
Absolute Maximum Ratings
Symbol Parameter
Unit
Ratings
Continuous Drain Current @ T
C
= 25°C
9
5
I
D
Continuous Drain Current @ T
C
= 100°C
A
Pulsed Drain Current
1
I
DM
V
GS
E
AS
I
AR
37
±30
574
5
V
mJ
A
Gate-Source Voltage
Single Pulse Avalanche Energy
2
Avalanche Current, Repetitive or Non-Repetitive
Thermal and Mechanical Characteristics
Symbol Characteristic
Min
Typ
Max
337
Unit
P
D
T
o
tal Power Dissipation @ T
C
= 25°C
W
R
θ
JC
0.37
Junction to Case Thermal Resistance
°C/W
°C
R
θ
CS
0.15
Case to Sink Thermal Resistance, Flat, Greased Surface
T
J
,T
STG
-55
150
300
Operating and Storage Junction
T
e
mperature Range
T
L
Soldering
T
e
mperature for 10 Seconds (1.6mm from case)
oz
g
0.22
6.2
W
T
Package Weight
in·lbf
N·m
10
T
o
rque
Mounting
T
o
rque ( TO-247 Package), 6-32 or M3 screw
1.1
Static Characteristics
T =
25°C unless otherwise speci
fi
ed
J
APT9F100B_S
Parameter
Test Conditions
Min
Typ
Max
Unit
V
Symbol
V
BR(DSS)
V
= 0V
,
I =
250
μ
A
Drain-Source Breakdown Voltage
Breakdown Voltage
T
e
mperature Coef
fi
cient
Drain-Source On Resistance
3
Gate-Source Threshold Voltage
Threshold Voltage
T
e
mperature Coef
fi
cient
1000
GS
D
∆
V
BR(DSS)
/
∆
T
J
Reference to 25°C, I
= 250
μ
A
D
V/°C
Ω
1.15
1.28
4
V
= 10V
,
I =
5A
D
R
DS(on)
V
GS(th)
1.6
5
GS
V
2.5
V
= V
DS
,
I =
1mA
D
GS
∆
V
GS(th)
/
∆
T
J
mV/°C
-10
V
= 1000V
= 0V
T =
25°C
J
250
1000
±100
DS
I
DSS
I
GSS
Zero Gate Voltage Drain Current
Gate-Source Leakage Current
μ
A
V
T =
125°C
J
GS
V
= ±30V
nA
GS
Dynamic Characteristics
T =
25°C unless otherwise speci
fi
ed
J
Symbol
Parameter
Test Conditions
Min
Typ
10.0
2606
35
Max
Unit
g
fs
V
= 50V
,
I =
5A
S
Forward Transconductance
Input Capacitance
DS
D
C
iss
C
rss
C
oss
V
= 0V
,
V =
25V
DS
GS
Reverse Transfer Capacitance
Output Capacitance
f = 1MHz
219
pF
4
C
o(cr)
Effective Output Capacitance, Charge Related
Effective Output Capacitance, Energy Related
85
46
V
= 0V
,
V =
0V to 670V
DS
GS
V
5
C
o(er)
Q
g
Q
gs
Q
gd
t
d(on)
T
o
tal Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Current Rise Time
Turn-Off Delay Time
Current Fall Time
80
14
36
25
27
84
24
= 0 to 10V
,
I =
5A,
GS
D
nC
ns
V
= 500V
DS
Resistive Switching
V =
670V
,
I =
5A
DD
t
r
t
d(off)
t
f
D
R
= 10
Ω
6
,
V
= 15V
GG
G
Source-Drain Diode Characteristics
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
Continuous Source Current
(Body Diode)
MOSFET symbol
showing the
integral reverse p-n
junction diode
(body diode)
I
S
9
A
Pulsed Source Current
(Body Diode)
1
I
SM
V
SD
t
rr
37
I
= 5A
,
T =
25°C, V
= 0V
Diode Forward Voltage
1.
2
200
345
V
SD
J
GS
T =
25°C
J
172
286
.67
1.5
8
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
Peak Recovery dv/dt
ns
T =
125°C
J
3
I
= 5A
T =
25°C
J
SD
Q
rr
μ
C
A
di
SD
/
dt = 100A/
μ
s
= 100V
T =
125°C
J
V
T =
25°C
J
DD
I
rrm
T =
125°C
J
11
I
≤
5A, di/dt
≤
1000A/
μ
s, V
= 500V,
SD
DD
dv/dt
V/ns
25
T =
125°C
J
1
2
3
Repetitive Rating: Pulse width and case temperature limited by maximum junction temperature.
Starting at T
J
= 25°C, L = 53mH, R
G
= 25
Ω
, I
AS
= 4A.
Pulse test: Pulse Width < 380
μ
s, duty cycle
< 2%.
4
5
C
o(cr)
is de
fi
ned as a
fi
xed capacitance with the same stored charge as C
OSS
with V
DS
= 67% of V
(BR)DSS
.
C
o(er)
is de
fi
ned as a
fi
xed capacitance with the same stored energy as C
OSS
with V
DS
= 67% of V
(BR)DSS
.
T
o
c
alculate C
o(er)
for any value of
V
DS
less than V
(BR)DSS,
use this equation:
C
o(er)
= -3.43E-8/V
DS
^2 + 1.44E-8/V
DS
+ 5.38E-11.
6
R
G
is external gate resistance, not including internal gate resistance or gate driver impedance.
(MIC4452)
Microsemi reserves the right to change, without notice, the speci
fi
cations and information contained herein.
APT9F100B_S
10
8
30
25
20
15
10
V
= 10V
T
= 125°C
GS
J
V
GS
= 6, 7, 8 & 9V
T
J
= -55°C
6
T
J
= 25°C
5V
4
2
0
5
0
T
J
= 125°C
T
J
= 150°C
4.5V
0
V
5
10
15
20
25
30
0
0
0
5
10
15
20
25
30
, DRAIN-TO-SOURCE VOLTAGE (V)
V
, DRAIN-TO-SOURCE VOLTAGE (V)
DS(ON)
DS
Figure 1,
Output Characteristics
Figure 2,
Output Characteristics
3.0
2.5
2.0
1.5
1.0
40
35
30
25
20
15
10
5
NORMALIZED TO
V
DS
> I
D(ON)
x R
DS(ON)
MAX.
250
μ
SEC. PULSE TEST
V
= 10V
@
5A
GS
@ <0.5 % DUTY CYCLE
T
J
= -55°C
T
J
= 25°C
T
J
= 125°C
0.5
0
0
-55 -25
0
25 50 75
100 125 150
T , JUNCTION
TEMPERATURE (°C)
1
2
3
4
5
6
7
8
V
, GATE-TO-SOURCE VOLTAGE (V)
J
GS
Figure 3,
R
vs Junction Temperature
Figure 4,
Transfer Characteristics
DS(ON)
14
12
10
8
4,000
1,000
C
iss
T
J
= -55°C
T
J
= 25°C
100
T
J
= 125°C
C
oss
6
4
C
rss
10
1
2
0
0
1
2
3
4
5
6
200
400
600
800
1000
I ,
DRAIN CURRENT (A)
V
DS
, DRAIN-TO-SOURCE VOLTAGE (V)
D
Figure 5,
Gain vs Drain Current
Figure 6, Capacitance vs Drain-to-Source Voltage
16
14
12
10
8
40
I
= 5A
D
35
30
V
DS
=
200V
V
DS
=
500V
25
T
J
= 25°C
20
T
J
= 150°C
15
6
V
DS
=
800V
4
10
2
5
0
0
0
20
40
60
80
100
120
0
0.3
, SOURCE-TO-DRAIN VOLTAGE (V)
SD
0.6
0.9
1.2
1.5
Q ,
TOTAL GATE CHARGE (nC)
V
g
Figure 7, Gate Charge vs Gate-to-Source Voltage
Figure 8, Reverse Drain Current vs Source-to-Drain Voltage
APT9F100B_S
60
10
60
10
I
I
DM
DM
R
ds(on)
13
μ
s
100
μ
s
13
μ
s
100
μ
s
1ms
10ms
1ms
1
1
R
T
=
150°C
ds(on)
100ms
DC line
J
10ms
T
C
=
25°C
Scaling for Different Case & Junction
T
e
mperatures:
100ms
T
=
125°C
J
DC line
I
D
=
I
D(T =
25
°
C)
*(
T
–
T
C
)/125
T
C
=
75°C
J
C
0.1
0.1
1
10
100
1000
1
10
, DRAIN-TO-SOURCE VOLTAGE (V)
DS
100
1000
V
, DRAIN-TO-SOURCE VOLTAGE (V)
V
DS
Figure 9, Forward Safe Operating Area
Figure 10, Maximum Forward Safe Operating Area
0.40
0.35
0.30
0.25
0.20
0.15
0.10
D = 0.9
0.7
0.5
0.3
Note:
t
1
t
2
t
= Pulse Duration
t
1
SINGLE PULSE
1
t
/
2
+ T
Duty Factor D =
0.1
Peak T
= P
x Z
0.05
0
J
DM
θJC C
0.05
10
-5
10
-4
10
-3
10
-2
10
-1
1.0
RECTANGULAR PULSE DURATION (seconds)
Figure 11. Maximum Effective Transient Thermal Impedance Junction-to-Case vs Pulse Duration
3
D PAK
Package Outline
TO-247 (B) Package Outline
e3 100%
Sn Plated
e1 SAC:
Tin, Silver, Copper
4.98 (.196)
5.08 (.200)
1.47 (.058)
1.57 (.062)
4.69 (.185)
15.95 (.628)
13.41 (.528)
13.51(.532)
5.31 (.209)
15.49 (.610)
16.26 (.640)
16.05(.632)
1.04 (.041)
1.49 (.059)
2.49 (.098)
1.15(.045)
5.38 (.212)
6.20 (.244)
6.15 (.242) BSC
Revised
8/29/97
11.51 (.453)
11.61 (.457)
13.79 (.543)
13.99(.551)
20.80 (.819)
21.46 (.845)
3.50 (.138)
3.81 (.150)
0.46 (.018)
0.56 (.022)
{3 Plcs}
1.27 (.050)
1.40 (.055)
0.020 (.001)
0.178 (.007)
2.67 (.105)
2.84 (.112)
2.87 (.113)
3.12 (.123)
3.81 (.150)
4.50 (.177) Max.
1.98 (.078)
2.08 (.082)
4.06 (.160)
(Base of Lead)
1.65 (.065)
2.13 (.084)
1.22 (.048)
1.32 (.052)
0.40 (.016)
1.016(.040)
19.81 (.780)
20.32 (.800)
Heat Sink (Drain)
and Leads
are Plated
5.45 (.215) BSC
{2 Plcs.
1.01 (.040)
1.40 (.055)
Gate
Drai n
Source
}
Source
Drai n
Gate
2.21 (.087)
2.59 (.102)
5.45 (.215) BSC
2-Plcs.
Dimensions in Millimeters (Inches)
Dimensions in Millimeters (Inches)
