Microchip-Tech-APTGLQ300A120G

Part #Microchip-Tech-APTGLQ300A120G
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Microchip-Tech-APTGLQ300A120G
APTGLQ300A120G  
Phase leg  
High speed Trench + Field Stop  
IGBT4 Power module  
V

CES

= 1200V  
I

C

= 300A @ Tc = 80°C  
Application  
•
•
•
•
Welding converters  
VBUS  
Switched Mode Power Supplies  
Uninterruptible Power Supplies  
Motor control  
Q1  
G1  
E1  
Features  
OUT  
•
High speed Trench + Field Stop IGBT 4  
–
–
–
Low voltage drop  
Low leakage current  
Low switching losses  
Q2  
G2  
•
•
•
Kelvin emitter for easy drive  
Very low stray inductance  
M5 power connectors  
E2  
0/VBUS  
Benefits  
•
Outstanding performance at high frequency  
operation  
•
•
•
•
•
•
Stable temperature behavior  
Very rugged  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Low profile  
RoHS compliant  
All ratings @ T

j

= 25°C unless otherwise specified  
Absolute maximum ratings
(Per IGBT)  
Symbol  
Parameter  
Collector – Emitter Voltage  
Max ratings  
1200  
500  
Unit  
V
V

CES  

T

C

= 25°C  
T

C

= 80°C  
T

C

= 25°C  
I

C  

Continuous Collector Current  
A
300  
960  
±20  
1500  
I

CM  

V

GE  

P

D  

Pulsed Collector Current  
Gate – Emitter Voltage  
Power Dissipation  
V
W
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
1 – 6  

APTGLQ300A120G  
Electrical Characteristics
(Per IGBT)  
Symbol Characteristic  
Test Conditions  
V

GE

= 0V, V

CE

= 1200V  
Min Typ Max
 
Unit  
I

CES  

Zero Gate Voltage Collector Current  
200  
1.78 2.05 2.42  
2.6  
µA  
T

j

= 25°C  
T

j

= 150°C  
V

GE

=15V  
I

C

= 300A  
V

CE(sat)

Collector Emitter Saturation Voltage  
V

GE(th)

Gate Threshold Voltage  
V
V

GE

= V

CE

, I

C

= 10.4 mA  
V

GE

= 20V, V

CE

= 0V  
5.3  
5.8  
6.3  
V
I

GES  

Gate – Emitter Leakage Current  
480  
nA  
Dynamic Characteristics
(Per IGBT)  
Symbol Characteristic  
Test Conditions  
V

GE

= 0V  
V

CE

= 25V  
f = 1MHz  
Min Typ Max Unit  
C

ies  

C

oes  

C

res  

Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
17.6  
1
0.9  
nF  
nC  
V

GE

= 15V, I

C

= 300A  
Q

G  

Gate charge  
1290  
V

CE

= 960V  
Inductive Switching (25°C)  
V

GE

= ±15V  
T

d(on)  

T

r  

Turn-on Delay Time  
Rise Time  
30  
57  
V

Bus

= 600V  
ns  
T

d(off)

Turn-off Delay Time  
290  
I

C

= 300A  
R

G

= 1.6
Ω
 
Inductive Switching (150°C)  
V

GE

= ±15V  
T

f  

T

d(on)  

T

r  

Fall Time  
16  
30  
Turn-on Delay Time  
Rise Time  
49  
V

Bus

= 600V  
ns  
T

d(off)

Turn-off Delay Time  
366  
48  
I

C

= 300A  
R

G

= 1.6
Ω  
T

f  

Fall Time  
V

GE

= ±15V  
E

on  

Turn on Energy  
T

j

= 150°C  
T

j

= 150°C  
26  
V

Bus

= 600V  
I

C

= 300A  
R

G

= 1.6
Ω  
mJ  
E

off  

R

G  

Turn off Energy  
16  
2.5  
Integrated gate resistor  
Short Circuit data  
Ω
A
V

GE

≤
15V ; V

Bus

= 600V  
t

p

≤
10µs ; T

j

= 150°C  
I

sc  

1000  
R

thJC  

Junction to Case Thermal Resistance  
0.1 °C/W  
Diode ratings and characteristics
(per diode)  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
V

RRM

Peak Repetitive Reverse Voltage  
1200  
400  
V
µA  
A
I

RM  

I

F  

Reverse Leakage Current  
DC Forward Current  
V

R

=1200V  
Tc =60°C  
240  
2.5  
3
I

F

= 240A  
I

F

= 480A  
3.5  
V

F  

t

rr  

Diode Forward Voltage  
Reverse Recovery Time  
V
T

j

= 125°C  
T

j

= 25°C  
I

F

= 240A  
1.8  
265  
ns  
I

F

= 240A  
V

R

= 800V  
di/dt = 800A/µs  
T

j

= 125°C  
T

j

= 25°C  
T

j

= 125°C  
350  
2.24  
11.6  
Q

rr  

Reverse Recovery Charge  
µC  
R

thJC  

Junction to Case Thermal Resistance  
0.17 °C/W  
2 – 6  

APTGLQ300A120G  
Thermal and package characteristics  
Symbol Characteristic  
V

ISOL

RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz  
Min  
4000  
-40  
-40  
-40  
-40  
3
Max  
Unit  
V
T

J  

T

JOP  

T

STG  

T

C  

Operating junction temperature range  
Recommended junction temperature under switching conditions  
Storage Temperature Range  
175  
T

J

max -25  
125  
°C  
Operating Case Temperature  
125  
5
3.5  
To heatsink  
For terminals  
M6  
M5  
N.m  
g
Torque Mounting
 
torque  
2
Wt  
Package Weight  
300  
Package outline
(dimensions in mm)  
3 – 6  

APTGLQ300A120G  
Typical Performance Curve  
Output Characteristics (V

G
E

=15V)  
Output Characteristics  
600  
600  
500  
400  
300  
200  
100  
0
T

J

= 150°C  
500  
V

GE

=20V  
T

J

=25°C  
V

GE

=13V  
V

GE

=15V  
400  
300  
200  
T

J

=150°C  
V

GE

=9V  
100  
0
0
1
2
3
4
5
6
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
V

CE

(V)  
V

CE

(V)  
E
n
ergy losses vs Collecto
r
C
urrent  
Transfer
t
C
har
a
cteristics  
600  
500  
400  
300  
200  
100  
0
84  
72  
60  
48  
36  
24  
12  
0
V

CE

= 600V  
V

GE

= 15V  

G

= 1.6
Ω
 
T

J

= 150°C  
Eon  
R
T

J

=150°C  
Eof f  
T

J

=25°C  
0
100 200 300 400 500 600  
5
6
7
8
9
10 11 12  
I

C

(A)  
V

GE

(V)  
S
w
i
tchin
g
E
n
ergyLosses vs Gate
R
e
sistance  
40  
V

CE

= 600V  
V

GE

=15V  
I

C

= 300A  
32  
24  
16  
8
Eon  
T

J

= 150°C  
Eof f  
1.5  
2.5  
3.5  
4.5  
Gate R
e
sista
n
ce (ohms)  
m
a
xi
m
u
m E
f
fective Transien
t
T
hermal Impedan
c
e, Junction to Case vs Pulse Duration  
0.12  
0.1  
IGBT  
D = 0.9  
0.08  
0.06  
0.04  
0.02  
0
0.7  
0.5  
0.3  
0.1  
Single
P
u
lse  
0.01  
0.05  
0.00001  
0.0001  
0.001  
0.1  
1
10  
rectang
u
la
r
P
ulse
D
u
ratio
n
(
S
e
c
o
n
d
s)  
4 – 6  

APTGLQ300A120G  
Diode For
w
a
rd Characteristic  
Operatin
g
F
r
e
q
u
ency vs Collector Current  
210  
480  
V

CE

=600V  
D=50%  
R

G

=1.6
Ω
 
T

J

=150°C  
T

C

=75°C  
180  
150  
120  
90  
400  
ZVS  
320  
T

J

=125°C  
ZCS  
240  
160  
60  
T

J

=25°C  
80  
30  
ha
r
d  
s
w
i
tching  
0
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5  
0
80  
160  
240  
I

C

(A)  
320  
400  
V

F

(V)  
m
a
xi
m
u
m E
f
fective Transien
t
T
hermal Impedan
c
e, Junction to Case vs Pulse Duration  
0.2  
0.16  
0.12  
0.08  
0.04  
0
D = 0.9  
Diode  
0.7  
0.5  
0.3  
0.1  
0.05  
Single Pulse  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
R
e
c
tangular Pulse Duration
 
(Seconds)  
5 – 6  

APTGLQ300A120G  
DISCLAIMER  
The information contained in the document (unless it is publicly available on the Web without access restrictions) is  
PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,  
transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the  
recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement  
will also apply.
 
This document and the information contained herein may not be modified, by any person other than  
authorized personnel of Microsemi.
 
No license under any patent, copyright, trade secret or other intellectual
 
property  
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,  
inducement, estoppels or
 
otherwise. Any
 
license under such intellectual property rights must be approved by  
Microsemi in writing signed by an officer of Microsemi.  
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime  
without any notice.
 
This product has been subject to limited testing and should not be used in conjunction with life-  
support or other mission-critical equipment or applications.
 
Microsemi assumes no liability whatsoever, and Microsemi  
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or  
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other  
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or  
user must conduct and complete all performance and other testing of this product as well as any user or customers final  
application. User or customer shall not rely on any data and performance specifications or parameters provided by  
Microsemi. It
 
is the customer’s and user’s responsibility to independently determine suitability of any Microsemi  
product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all  
faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims  
any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product  
Life Support Application  
Seller’s Products are not designed, intended, or authorized for use as components in systems intended for space,  
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other  
application in which the failure of the Seller’s Product could create a situation where personal injury, death or property  
damage or loss may occur (collectively “Life Support Applications”).  
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive  
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,  
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and  
expenses, and attorneys’ fees and costs arising, directly or directly, out of any claims of personal injury, death, damage  
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations  
that Seller was negligent regarding the design or manufacture of the goods.  
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with  
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the  
new proposed specific part.  
6 – 6