Microchip-Tech-APTGT300A120D3G

Part #Microchip-Tech-APTGT300A120D3G
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Microchip-Tech-APTGT300A120D3G
APTGT300A120D3G  
Phase leg  
Trench + Field Stop IGBT3  
Power Module  
V

CES

= 1200V  
I

C

= 300A @ Tc = 80°C  
Application  
Welding converters  
3
Q1  
Switched Mode Power Supplies  
Uninterruptible Power Supplies  
Motor control  
4
5
Features  
1
Q2  
Trench + Field Stop IGBT
3
T
echnology  
6
–
–
–
–
–
–
–
Low voltage drop  
Low tail current  
Switching frequency up to 20 kHz  
Soft recovery
 
parallel diodes  
Low diode VF  
7
2
Low leakage current  
RBSOA and SCSOA rated  
Kelvin emitter for easy drive  
High level of integration  
M6 power connectors  
Benefits  
Stable temperature behavior  
Very rugged  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Easy paralleling due to positive T

C

of V

CEsat  

RoHS Compliant  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
V

CES  

Collector – Emitter Breakdown Voltage  
1200  
440  
300  
600  
±20  
1450  
V
T

C

= 25°C  
T

C

= 80°C  
T

C

= 25°C  
I

C  

Continuous Collector Current  
A
I

CM  

V

GE  

P

D  

Pulsed Collector Current  
Gate – Emitter Voltage  
Maximum Power Dissipation  
V
W
T

C

= 25°C  
RBSOA Reverse
 
Bias Safe Operating Area  
T

j

= 125°C
 
600A @ 1100V  
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
1 – 6  

APTGT300A120D3G  
All ratings @ T

j

= 25°C unless otherwise specified  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max
 
Unit  
I

CES  

Zero Gate Voltage Collector Current  
V

GE

= 0V, V

CE

= 1200V  
500  
2.1  
µA  
T

j

= 25°C  
1.7  
2.0  
5.8  
V

GE

= 15V  
V

CE(sat)

Collector Emitter saturation Voltage  
V

GE(th)

Gate Threshold Voltage  
V
I

C

= 300A  
T

j

= 125°C  
V

GE

= V

CE

, I

C

= 12mA  
V

GE

= 20V, V

CE

= 0V  
5.0  
6.5  
400  
V
nA  
I

GES  

Gate – Emitter Leakage Current  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max
 
Unit  
C

ies  

C

res  

Input Capacitance  
Reverse Transfer Capacitance  
V

GE

= 0V ; V

CE

= 25V  
f = 1MHz  

GE

=±15V, I

C

=300A  
21  
1
nF  
V
Q

G  

Gate charge  
2.8  
µC  
V

CE

=600V  
Inductive Switching (25°C)  
V

GE

= ±15V  
T

d(on)  

T

r  

Turn-on Delay Time  
Rise Time  
250  
90  
ns  
V

Bus

= 600V  
T

d(off)

Turn-off Delay Time  
550  
I

C

= 300A  
R

G

= 2.2
 
Inductive Switching (125°C)  
T

f  

T

d(on)  

T

r  

Fall Time  
130  
300  
100  
650  
180  
Turn-on Delay Time  
Rise Time  
V

GE

= ±15V  
ns  
V

Bus

= 600V  
I

C

= 300A  
R

G

= 2.2
  
T

d(off)

Turn-off Delay Time  
T

f  

Fall Time  
V

GE

= ±15V  
V

Bus

= 600V  
I

C

= 300A  
E

on  

Turn on Energy  
T

j

= 125°C  
T

j

= 125°C  
25  
44  
mJ  
A
E

off  

I

sc  

Turn off Energy  
Short Circuit data  
R

G

= 2.2
  
V

GE

≤
15V ; V

Bus

= 900V  
1200  
t

p

≤
10µs ; T

j

= 125°C  
Reverse diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max
 
Unit  
Maximum Peak Repetitive Reverse Voltage  
Maximum Reverse Leakage Current  
DC Forward Current  
V

RRM  

I

RRM  

I

F  

1200  
V
µA  
A
T

j

= 25°C  
750  
1000  
V

R

=1200V  
T

j

= 125°C  
Tc = 80°C  
T

j

= 25°C  
T

j

= 125°C  
T

j

= 25°C  
300  
1.6  
1.6  
I

F

= 300A  
V

GE

= 0V  
2.1  
V

F  

Diode Forward Voltage  
V
170  
t

rr  

Reverse Recovery Time  
ns  
T

j

= 125°C  
T

j

= 25°C  
T

j

= 125°C  
T

j

= 25°C  
T

j

= 125°C  
280  
28  
56  
12  
22  
I

F

= 300A  
V

R

= 600V  
di/dt =3500A/µs  
Q

rr  

E

rr  

Reverse Recovery Charge  
Reverse Recovery Energy  
µC  
mJ  
2 – 6  

APTGT300A120D3G  
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
IGBT  
Diode  
0.085  
0.16  
R

thJC  

Junction to Case Thermal Resistance  
°C/W  
V
RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz  
Operating junction temperature range  
Storage Temperature Range  
V

ISOL  

T

J  

T

STG  

T

C  

4000  
-40  
-40  
-40  
3
150  
125  
125  
5
5
350  
°C  
Operating Case Temperature  
For terminals  
To Heatsink  
M6  
M6  
Torque Mounting
 
torque  
Wt Package
 
Weight  
N.m  
g
3
D3 Package outline
(dimensions in mm)  
3 – 6  

APTGT300A120D3G  
Typical Performance Curve  
Output Characteristics (V

GE

=15V)  
Output Characteristics  
600  
600  
500  
400  
300  
200  
100  
0
T

J

= 125°C  
500  
400  
300  
200  
100  
0
V

GE

=17V  
V

GE

=13V  
V

GE

=15V  
V

GE

=9V  
T

J

=25°C  
T

J

=125°C  
0
1
2
3
4
0
1
2

CE

(V)  
3
4
V

CE

(V)  
V
Energy losses vs Collector Current  
Transfert Characteristics  
600  
500  
400  
300  
200  
100  
0
100  
V

CE

= 600V  

GE

= 15V  

G

= 2.2
Ω
 
T

J

= 125°C  
Eoff  
V
80  
60  
40  
20  
0
T

J

=25°C  
R
Eon  
Err  
T

J

=125°C  
Eon  
0
100 200 300 400 500 600  
5
6
7
8
9
10  
11  
12  
I

C

(A)  
V

GE

(V)  
Switching Energy Losses vs Gate Resistance  
Reverse Bias Safe Operating Area  
150  
700  
V

CE

= 600V  

GE

=15V  

C

= 300A  
Eon  
600  
500  
400  
300  
200  
100  
0
125  
100  
75  
50  
25  
0
V
I
T

J

= 125°C  
Eoff  
V

GE

=15V  
T

J

=125°C  
R

G

=2.2
Ω  
Err  
0
300  
600  
900  

CE

(V)  
1200  
1500  
0
4
8
12  
16  
20  
V
Gate Resistance (ohms)  
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.1  
0.08  
0.06  
0.04  
0.02  
0
IGBT  
0.9  
0.7  
0.5  
0.3  
0.1  
Single Pulse  
0.05  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
4 – 6  

APTGT300A120D3G  
Operating Frequency vs Collector Current  
Forward Characteristic of diode  
50  
40  
30  
20  
10  
0
600  
V

CE

=600V  
D=50%  
R

G

=2.2
Ω
 
T

J

=25°C  
500  
400  
300  
200  
100  
0
T

J

=125°C  
T

C

=75°C  
ZVS  
ZCS  
Hard  
switching  
T

J

=125°C  
0
100  
200  
I

C

(A)  
300  
400  
500  
0
0.4  
0.8  
1.2  

F

(V)  
1.6  
2
2.4  
V
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.18  
0.16  
0.14  
0.12  
0.1  
0.9  
0.7  
Diode  
0.5  
0.3  
0.08  
0.06  
0.04  
0.02  
0
0.1  
Single Pulse  
0.05  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
5 – 6  

APTGT300A120D3G  
DISCLAIMER  
The information contained in the document (unless it is publicly available on the Web without access restrictions) is  
PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,  
transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the  
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will also apply.
 
This document and the information contained herein may not be modified, by any person other than  
authorized personnel of Microsemi.
 
No license under any patent, copyright, trade secret or other intellectual
 
property  
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,  
inducement, estoppels or
 
otherwise. Any
 
license under such intellectual property rights must be approved by  
Microsemi in writing signed by an officer of Microsemi.  
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime  
without any notice.
 
This product has been subject to limited testing and should not be used in conjunction with life-  
support or other mission-critical equipment or applications.
 
Microsemi assumes no liability whatsoever, and Microsemi  
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or  
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other  
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or  
user must conduct and complete all performance and other testing of this product as well as any user or customers final  
application. User or customer shall not rely on any data and performance specifications or parameters provided by  
Microsemi. It
 
is the customer’s and user’s responsibility to independently determine suitability of any Microsemi  
product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all  
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any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product  
is subject to other terms and conditions which can be located on the web at

Life Support Application  
Seller’s Products are not designed, intended, or authorized for use as components in systems intended for space,  
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other  
application in which the failure of the Seller’s Product could create a situation where personal injury, death or property  
damage or loss may occur (collectively “Life Support Applications”).  
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive  
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,  
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and  
expenses, and attorneys’ fees and costs arising, directly or directly, out of any claims of personal injury, death, damage  
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations  
that Seller was negligent regarding the design or manufacture of the goods.  
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with  
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the  
new proposed specific part.  
6 – 6