Microchip-Tech-APTGT300DU60G

Part #Microchip-Tech-APTGT300DU60G
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Microchip-Tech-APTGT300DU60G
APTGT300DU60G  
V

CES

= 600V  
I

C

= 300A @ Tc = 80°C  
Dual common source  
Trench + Field Stop IGBT3  
Power Module  
Application  
AC Switches  
Switched Mode Power Supplies  
Uninterruptible Power Supplies  
C1  
C2  
Q1  
Q2  
G1  
E1  
G2  
E2  
Features  
Trench + Field Stop IGBT3 Technology  
–
–
–
–
–
–
–
Low voltage drop  
Low tail current  
Switching frequency up to 20 kHz  
Soft recovery
 
parallel diodes  
Low diode VF  
E
Low leakage current  
RBSOA and SCSOA rated  
Kelvin emitter for easy drive  
Very low stray inductance  
–
–
Symmetrical design  
M5 power connectors  
High level of integration  
Benefits  
Stable temperature behavior  
Very rugged  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Easy paralleling due to positive TC of VCEsat  
Low profile  
RoHS Compliant  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
V

CES  

Collector – Emitter Breakdown Voltage  
600  
430  
300  
500  
±20  
1150  
V
T

C

= 25°C  
T

C

= 80°C  
T

C

= 25°C  
I

C  

Continuous Collector Current  
A
I

CM  

V

GE  

P

D  

Pulsed Collector Current  
Gate – Emitter Voltage  
Maximum Power Dissipation  
V
W
T

C

= 25°C  
T

j

= 150°C  
RBSOA Reverse
 
Bias Safe Operating Area  
600A @ 550V  
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note  
1 – 6  

APTGT300DU60G  
All ratings @ T

j

= 25°C unless otherwise specified  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max
 
Unit  
I

CES  

Zero Gate Voltage Collector Current  
V

GE

= 0V, V

CE

= 600V  
350  
1.8  
µA  
T

j

= 25°C  
T

j

= 150°C  
1.4  
1.5  
5.8  
V

GE

=15V  
I

C

= 300A  
V

CE(sat)

Collector Emitter Saturation Voltage  
V

GE(th)

Gate Threshold Voltage  
V
V

GE

= V

CE

, I

C

= 1.5 mA  
V

GE

= 20V, V

CE

= 0V  
5.0  
6.5  
500  
V
nA  
I

GES  

Gate – Emitter Leakage Current  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max
 
Unit  
C

ies  

C

oes  

C

res  

T

d(on)  

T

r  

Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Rise Time  
V

GE

= 0V  
24  
V

CE

= 25V  
f = 1MHz  
nF  
1.5  
0.75  
115  
45  
Inductive Switching (25°C)  
V
V

GE

= ±15V  

Bus

= 300V  
ns  
T

d(off)

Turn-off Delay Time  
200  
55  
I

C

= 300A  
R

G

= 1.8
 
Inductive Switching (150°C)  
V

GE

= ±15V  
T

f  

T

d(on)  

T

r  

Fall Time  
Turn-on Delay Time  
Rise Time  
120  
50  
V

Bus

= 300V  
ns  
I

C

= 300A  
T

d(off)

Turn-off Delay Time  
250  
R

G

= 1.8
  
T

f  

Fall Time  
70  
1.5  
T

j

= 25°C  
T

j

= 150°C  
T

j

= 25°C  
T

j

= 150°C  
V

GE

= ±15V  
E

on  

Turn on Energy  
mJ  
mJ  
2.7  
V

Bus

= 300V  
I

C

= 300A  
R

G

= 1.8
  
8.55  
10.5  
E

off  

Turn off Energy  
Reverse diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max
 
Unit  
Maximum Peak Repetitive Reverse Voltage  
Maximum Reverse Leakage Current  
DC Forward Current  
V

RRM  

600  
V
T

j

= 25°C  
T

j

= 150°C  
Tc = 80°C  
T

j

= 25°C  
T

j

= 150°C  
150  
400  
I

RM  

V

R

=600V  
µA  
I

F  

300  
1.5  
1.4  
A
V
I

F

= 300A  
V

GE

= 0V  
1.9  
V

F  

Diode Forward Voltage  
T

j

= 25°C  
T

j

= 150°C  
T

j

= 25°C  
T

j

= 150°C  
T

j

= 25°C  
T

j

= 150°C  
130  
t

rr  

Q

rr  

E

r  

Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Energy  
ns  
µC  
mJ  
225  
13.5  
28.5  
3.5  
I

F

= 300A  
V

R

= 300V  
di/dt =3100A/µs  
7.1  
2 – 6  

APTGT300DU60G  
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
IGBT  
Diode  
0.13  
0.21  
R

thJC  

Junction to Case Thermal Resistance  
°C/W  
V
RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz  
Operating junction temperature range  
Storage Temperature Range  
V

ISOL  

T

J  

T

STG  

T

C  

4000  
-40  
-40  
-40  
3
175  
125  
100  
5
3.5  
300  
°C  
Operating Case Temperature  
To heatsink  
For terminals  
M6  
M5  
Torque Mounting
 
torque  
Wt Package
 
Weight  
N.m  
g
2
SP6 Package outline
(dimensions in mm)  
3 – 6  

APTGT300DU60G  
Typical Performance Curve  
Output Characteristics (V

GE

=15V)  
T

J

=25°C  
T

J

=125°C  
Output Characteristics  
600  
500  
400  
300  
200  
100  
0
600  
500  
400  
300  
200  
100  
0
T

J

= 150°C  
V

GE

=13V  
V

GE

=19V  
V

GE

=15V  
T

J

=150°C  
V

GE

=9V  
T

J

=25°C  
1.5  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
0
0.5  
1
2
2.5  
V

CE

(V)  
V

CE

(V)  
Energy losses vs Collector Current  
Transfert Characteristics  
600  
500  
400  
300  
200  
100  
0
20  
V

CE

= 300V  
Eoff  
T

J

=25°C  
17.5  
15  
V

GE

= 15V  
R

G

= 1.8
Ω
 
T

J

= 150°C  
Er  
12.5  
10  
T

J

=125°C  
7.5  
5
T

J

=150°C  
T

J

=25°C  
2.5  
0
Eon  
0
100 200 300 400 500 600  

C

(A)  
5
6
7
8
9
10  
11  
I
V

GE

(V)  
Switching Energy Losses vs Gate Resistance  
Reverse Bias Safe Operating Area  
20  
700  
600  
500  
400  
300  
200  
100  
0
V

CE

= 300V  
Eoff  
V

GE

=15V  
I

C

= 300A  

J

= 150°C  
15  
10  
5
Eon  
T
V

GE

=15V  
T

J

=150°C  
R

G

=1.8
Ω  
Er  
Eon  
4
0
0
2
6
8
10  
12  
0
100 200 300 400 500 600 700  
V

CE

(V)  
Gate Resistance (ohms)  
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.9  
0.14  
0.12  
0.1  
IGBT  
0.7  
0.08  
0.06  
0.04  
0.02  
0
0.5  
0.3  
0.1  
Single Pulse  
0.05  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
Rectangular Pulse Duration in Seconds  
4 – 6  

APTGT300DU60G  
Operating Frequency vs Collector Current  
Forward Characteristic of diode  
600  
500  
400  
300  
200  
100  
0
120  
100  
80  
60  
40  
20  
0
V

CE

=300V  
D=50%  
R

G

=1.8
Ω
 
T

J

=150°C  
T

c

=85°C  
ZVS  
ZCS  
T

J

=125°C  
T

J

=150°C  
Hard  
switching  
T

J

=25°C  
0
0.4  
0.8  
1.2  

F

(V)  
1.6  
2
0
100  
200  
300  

C

(A)  
400  
500  
V
I
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.25  
0.2  
0.15  
0.1  
0.05  
0
Diode  
0.9  
0.7  
0.5  
0.3  
0.1  
Single Pulse  
0.05  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
Rectangular Pulse Duration in Seconds  
5 – 6  

APTGT300DU60G  
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The information contained in the document (unless it is publicly available on the Web without access restrictions) is  
PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,  
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authorized personnel of Microsemi.
 
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property  
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,  
inducement, estoppels or
 
otherwise. Any
 
license under such intellectual property rights must be approved by  
Microsemi in writing signed by an officer of Microsemi.  
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime  
without any notice.
 
This product has been subject to limited testing and should not be used in conjunction with life-  
support or other mission-critical equipment or applications.
 
Microsemi assumes no liability whatsoever, and Microsemi  
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or  
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other  
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user must conduct and complete all performance and other testing of this product as well as any user or customers final  
application. User or customer shall not rely on any data and performance specifications or parameters provided by  
Microsemi. It
 
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new proposed specific part.  
6 – 6