Microchip-Tech-APTM100UM65DAG

Part #Microchip-Tech-APTM100UM65DAG
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Microchip-Tech-APTM100UM65DAG
APTM100UM65DAG  
V

DSS

= 1000V  
R

DSon

= 65m
Ω
typ @ Tj = 25°C  
I

D

= 145A @ Tc = 25°C  
Single switch  
with Series diode  
MOSFET Power Module  
Application  
Zero Current Switching resonant mode  
Features  
Power MOS 7

®

MOSFETs  
–
–
–
–
–
Low R

DSon  

Low input and Miller capacitance  
Low gate charge  
Avalanche energy rated  
Very rugged  
Kelvin source for easy drive  
Very low stray inductance  
–
–
Symmetrical design  
M5 power connectors  
High level of integration  
AlN substrate for improved thermal performance  
Benefits  
Outstanding performance at high frequency  
operation  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Low profile  
RoHS Compliant  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
1000  
145  
Unit  
V
V

DSS  

Drain – Source Breakdown Voltage  
T

c

= 25°C  
T

c

= 80°C  
I

D  

Continuous Drain Current  
A
110  
I

DM  

V

GS  

R

DSon  

Pulsed Drain current  
Gate – Source Voltage  
Drain – Source ON Resistance  
580  
±30  
78  
V
m
 
W
P

D  

I

AR  

E

AR  

E

AS  

Maximum Power Dissipation  
T

c

= 25°C  
3250  
30  
50  
Avalanche current (repetitive and non repetitive)  
Repetitive Avalanche Energy  
Single Pulse Avalanche Energy  
A
mJ  
3200  
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note  
1 – 7  

APTM100UM65DAG  
All ratings @ T

j

= 25°C unless otherwise specified  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max
 
Unit  
T

j

= 25°C  
V

GS

= 0V,V

DS

= 1000V  
V

GS

= 0V,V

DS

= 800V  
400  
µA  
mA  
I

DSS  

Zero Gate Voltage Drain Current  
T

j

= 125°C  
2
78  
5
R

DS(on)

Drain – Source on Resistance  
V

GS(th)

Gate Threshold Voltage  
I

GSS  

V

GS

= 10V, I

D

= 72.5A  
V

GS

= V

DS

, I

D

= 20mA  
V

GS

= ±30 V, V

DS

= 0V  
65  
m
  
V
3
Gate – Source Leakage Current  
±400 nA  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max
 
Unit  
C

iss  

C

oss  

C

rss  

Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
28.5  
5.08  
0.9  
V

GS

= 0V  
V

DS

= 25V  
nF  
f = 1MHz  
Q

g  

Q

gs  

Q

gd  

Total gate Charge  
1068  
136  
V

GS

= 10V  
Gate – Source Charge  
Gate – Drain Charge  
V

Bus

= 500V  
nC  
I

D

= 145A  
692  
T

d(on)  

T

r  

Turn-on Delay Time  
Rise Time  
18  
14  
V

GS

= 15V  
V

Bus

= 500V  
ns  
I

D

= 145A  
R

G

= 0.75
  
T

d(off)

Turn-off Delay Time  
140  
55  
T

f  

Fall Time  
Inductive switching @ 25°C  
V

GS

= 15V, V

Bus

= 670V  
I

D

= 145A, R

G

= 0.75
Ω
 
E

on  

E

off  

E

on  

E

off  

Turn-on Switching Energy  
Turn-off Switching Energy  
Turn-on Switching Energy  
Turn-off Switching Energy  
4.8  
2.9  
8
mJ  
mJ  
Inductive switching @ 125°C  
V

GS

= 15V, V

Bus

= 670V  
3.9  
I

D

= 145A, R

G

= 0.75
Ω  
Series diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max
 
Unit  
Maximum Peak Repetitive Reverse Voltage  
Maximum Reverse Leakage Current  
DC Forward Current  
V

RRM  

1000  
V
T

j

= 25°C  
750  
I

RM  

V

R

=1000V  
µA  
T

j

= 125°C  
Tc = 80°C  
1000  
I

F  

240  
A
V
I

F

= 240A  
I

F

= 480A  
I

F

= 240A  
2
2.2  
1.7  
2.5  
V

F  

Diode Forward Voltage  
T

j

= 125°C  
T

j

= 25°C  
T

j

= 125°C  
T

j

= 25°C  
T

j

= 125°C  
280  
350  
t

rr  

Reverse Recovery Time  
Reverse Recovery Charge  
ns  
I

F

= 240A  
V

R

= 667V  
di/dt = 800A/µs  
3.04  
14.4  
Q

rr  

µC  
2 – 7  

APTM100UM65DAG  
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
Transistor  
Series diode  
0.038  
0.23  
R

thJC  

Junction to Case Thermal Resistance  
°C/W  
V
V

ISOL

RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz  
4000  
-40  
-40  
-40  
3
T

J  

T

STG  

T

C  

Operating junction temperature range  
Storage Temperature Range  
Operating Case Temperature  
150  
125  
100  
5
3.5  
300  
°C  
To Heatsink  
For teminals  
M6  
M5  
Torque Mounting
 
torque  
Wt Package
 
Weight  
N.m  
g
2
SP6 Package outline
(dimensions in mm)  
3 – 7  

APTM100UM65DAG  
Typical Performance Curve  
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.04  
0.035  
0.03  
0.025  
0.02  
0.015  
0.01  
0.005  
0
0.9  
0.7  
0.5  
0.3  
Single Pulse  
0.1  
0.05  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
Low Voltage Output Characteristics  
Transfert Characteristics  
360  
320  
280  
240  
200  
160  
120  
80  
480  
400  
320  
240  
160  
80  
V

DS

> I

D

(on)xR

DS

(on)MAX  
V

GS

=15, 10V  
250µs pulse test @ < 0.5 duty cycle  
7V  
6.5V  
6V  
T

J

=25°C  
5.5V  
5V  
T

J

=125°C  
40  
T

J

=-55°C  
0
0
0
5
10  
15  
20  
25  
30  
0
1
2
3
4
5
6
7
8
V

DS

, Drain to Source Voltage (V)  
V

GS

, Gate to Source Voltage (V)  
DC Drain Current vs Case Temperature  
R

DS(on)

vs Drain Current  
1.4  
1.3  
1.2  
1.1  
1
160  
120  
80  
40  
0
Normalized to  

GS

=10V @ 72.5A  
V
V

GS

=10V  
V

GS

=20V  
0.9  
0.8  
0
80  
160  
240  
320  
25  
50  
75  
100  
125  
150  
I

D

, Drain Current (A)  
T

C

, Case Temperature (°C)  
4 – 7  

APTM100UM65DAG  
Breakdown Voltage vs Temperature  
ON resistance vs Temperature  
2.5  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
V

GS

=10V  
I

D

=72.5A  
2.0  
1.5  
1.0  
0.5  
0.0  
-50 -25  
0
25 50 75
 
100 125 150  
-50 -25  
0
25 50 75
 
100 125 150  
T

J

, Junction Temperature (°C)  
T

J

, Junction Temperature (°C)  
Threshold Voltage vs Temperature  
Maximum Safe Operating Area  
1000  
100  
10  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
100µs  
limited by R

DS

on  
1ms  
10ms  
Single pulse  
T

J

=150°C  
T

C

=25°C  
1
-50 -25  
0
25 50 75
 
100 125 150  
1
10  
100  
1000  
V

DS

, Drain to Source Voltage (V)  
T

C

, Case Temperature (°C)  
Capacitance vs Drain to Source Voltage  
100000  
Gate Charge vs Gate to Source Voltage  
14  
12  
10  
8
V

DS

=200V  
V

DS

=500V  
I

D

=145A  
T

J

=25°C  
Ciss  
10000  
1000  
100  
Coss  
V

DS

=800V  
6
Crss  
4
2
0
0
300  
600  
900  
1200 1500  
0
10  
20  
30  
40  
50  
V

DS

, Drain to Source Voltage (V)  
Gate Charge (nC)  
5 – 7  

APTM100UM65DAG  
Delay Times vs Current  
Rise and Fall times vs Current  
100  
160  
120  
80  
40  
0
V

DS

=670V  
t

d(off)  

t

f  

R

G

=0.75
Ω
 
80  
T

J

=125°C  
L=100µH  
60  
V

DS

=670V  
R

G

=0.75
Ω  
T

J

=125°C  
L=100µH  
40  
t

r  

t

d(on)  

20  
0
50  
94  
138  
182  
226  
270  
50  
94  
138  
182  
226  
270  
I

D

, Drain Current (A)  
I

D

, Drain Current (A)  
Switching Energy vs Gate Resistance  
Switching Energy vs Current  
26  
22  
18  
14  
10  
6
16  
14  
12  
10  
8
V

DS

=670V  
V

DS

=670V  
I

D

=145A  
E

off  

T

J

=125°C  
E

on  

R

G

=0.75
Ω  
T

J

=125°C  
L=100µH  
L=100µH  
E

off  

E

on  

6
4
2
E

off  

0
2
50  
94  
138  
182  
226  
270  
0
1
2
3
4
5
6
7
8
I

D

, Drain Current (A)  
Gate Resistance (Ohms)  
Operating Frequency vs Drain Current  
Source to Drain Diode Forward Voltage  
300  
1000  
250  
200  
150  
100  
50  
ZCS  
T

J

=150°C  
100  
10  
1
T

J

=25°C  
V

DS

=670V  
D=50%  
R

G

=0.75
Ω  
T

J

=125°C  
Hard  
T

C

=75°C  
switching  
0
0.2 0.4 0.6 0.8  
1
1.2 1.4 1.6 1.8  
15  
35  
55  
75  
95  
115 135  
I

D

, Drain Current (A)  
V

SD

, Source to Drain Voltage (V)  
6 – 7  

APTM100UM65DAG  
DISCLAIMER  
The information contained in the document (unless it is publicly available on the Web without access restrictions) is  
PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,  
transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the  
recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement  
will also apply.
 
This document and the information contained herein may not be modified, by any person other than  
authorized personnel of Microsemi.
 
No license under any patent, copyright, trade secret or other intellectual
 
property  
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,  
inducement, estoppels or
 
otherwise. Any
 
license under such intellectual property rights must be approved by  
Microsemi in writing signed by an officer of Microsemi.  
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime  
without any notice.
 
This product has been subject to limited testing and should not be used in conjunction with life-  
support or other mission-critical equipment or applications.
 
Microsemi assumes no liability whatsoever, and Microsemi  
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or  
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other  
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or  
user must conduct and complete all performance and other testing of this product as well as any user or customers final  
application. User or customer shall not rely on any data and performance specifications or parameters provided by  
Microsemi. It
 
is the customer’s and user’s responsibility to independently determine suitability of any Microsemi  
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faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims  
any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product  
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Seller’s Products are not designed, intended, or authorized for use as components in systems intended for space,  
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application in which the failure of the Seller’s Product could create a situation where personal injury, death or property  
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Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive  
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,  
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Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with  
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the  
new proposed specific part.  
7 – 7