Microchip-Tech-MICRF010YM

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MICRF010

QwikRadio Low-Power

UHF Receiver

General Description

The MICRF010 is a single chip, ASK/OOK (ON-OFF

Keyed) RF receiver IC recommended for new designs

replacing the MICRF007. It provides the same function with

sensitivity enhancement, typically 6dB better than the

MICRF007. Just

like all other members of the QwikRadio

family, the MICRF010 achieves low power operation, a

very high level of integration, and it is particularly easy to

use.

QwikRadio™

Features

•

High sensitivity (–104dBm)

•

300MHz to 440MHz frequency range

•

Data-rate up to 2.0kbps (Manchester encoding)

•

Low power consumption

–

2.9mA fully operational (315MHz)

0.15µA in shutdown

All post-detection data filtering is provided on the

MICRF010, so no external baseband filters are required. In

fact, the entire receiver circuit is made of very few external

components and with the 8-pin SOIC package makes it

ideal for small printed circuit board area applications.

290µA in polled mode (10:1 duty-cycle)

•

Shutdown input

•

Automatic tuning, no manual adjustment

•

Very low RF re-radiation at the antenna

•

Highly integrated with extremely low external part count

The MICRF010 works in fixed-mode (FIX) operation, which

functions as a conventional super-heterodyne receiver.

Fixed-mode provides better selectivity and sensitivity

performance in comparison with sweep mode used in other

Micrel receivers intended for lower cost applications.

Applications

•

Automotive remote keyless entry (RKE)

•

Long range RF identification

Data sheets and support documentation can be found on

Micrel’s web site at www.micrel.com.

•

Remote fan and light control

•

Garage door and gate openers

Ordering Information

Part Number

Operating Mode

Shutdown

Package

Standard

Pb-Free

MICRF010BM

MICRF010YM

Fixed

Yes

8-pin SOIC

Typical Application

17cm 22AWG MAGNET WIRE

433.92Mhz 1000 bps Manchester Encoded On-Off Keyed Receiver

QwikRadio is a registered trademark of Micrel, Inc. The QwikRadio Ics were developed under a partnership agreement with AIT of Orlando, Florida.

M9999-063005

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MICRF010

Pin Configuration

Standard 8-Pin SOIC (M)

Pin Description

Pin Number

Pin Name

Pin Function

VSS

ANT

VDD

CTH

Ground Return (input): ground return to the power supply. See “Applications Information” for bypass

capacitor details.

Antenna (Input):

See “Applications Information” for information on input impedance. For optimal

performance the antenna impedance should be matched to the antenna pin impedance.

Power Supply (Input): Positive Supply input for the RF IC. Connect a low ESL, low ESR decoupling

capacitor from this to VSS, with lead length kept as short as possible.

[Data Slicing] Threshold Capacitor (External Component):

Capacitor extracts the DC average value

from the demodulated waveform, which becomes the reference for the internal data slicing comparator.

See “Applications Information” for selection.

Digital Output (Output): CMOS level compatible data output signal.

SHUT

Shutdown (Input): Shutdown-mode logic-level control input.

Pull low to enable the receiver. This input

is pulled-up internally to VDD.

CAGC

AGC Capacitor (External Component):

Integrating capacitor for on-chip AGC (automatic gain control).

See “Applications Information” for capacitor selection.

REFOSC

Reference Oscillator (External Component or Input):

Timing reference for on-chip tuning and

alignment.

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Micrel

MICRF010

Absolute Maximum Ratings

(1)

Operating Ratings

(2)

Supply Voltage (V

DDRF

, V

DDBB

)…………………………….

Input/Output Voltage (V

I/O

) ……………. V

–0.3 to V

+0.3

Max Input Power …………………………………………..

20dBm

Junction Temperature (T

)

……………………………… +150°C

Storage Temperature Range (T

)……….. –65°C to +150°C

Lead Temperature (soldering, 10 sec.)……………… +260°C

Supply Voltage (V

DDRF

, V

DDBB

) ……………+4.75V to +5.5V

Max Input Powe

……………………………………………… 0dBm

RF Frequency Range ……………………….300MHz to 440Hz

Data Duty-Cycle………………………………………. 20% to 80%

Reference Oscillator Input Range……….. 0.2V

to 1.5V

Ambient Temperature (T

)…………………… –40°C to +85°C

ESD Rating …………………………………………………….

Note 3

Electrical Characteristics

(4)

4.75V

≤

5.5V, V

= 0V; C

AGC

= 4.7µF, C

= 0.022µF; f

REFOSC

= 9.794MHz (equivalent to f

= 315MHz); data rate = 600 bps

(Manchester encoded). T

= 25°C,

bold

values indicate –40°C

≤

+85°C; current flow into device pins is positive, unless noted.

Symbol

Parameter

Condition

Min

Typ

2.9

Max

4.5

Units

Operating Current

continuous operation, f

= 315MHz

Polled with 10:1 duty cycle, f

= 315MHz

Continuous operation, f

= 433.92MHz

Polled with 10:1 duty cycle, f

= 433.92MHz

SHUT

= 0.8VDD

290

4.7

7.5

0.5

470

0.15

STBY

Standby Current

RF Section, IF Section

Receiver Sensitivity(4)

= 315MHz

Note 4

= 433.92MHz

Note 4

Note 5

–105

–103

0.86

0.6

dBm

IF Center Frequency

MHz

IF 3dB Bandwidth

Note 5

ANT pin, R

= 50

Ω

(6)

ATTACK

÷ t

DECAY

= +85°

Vrms

Spurious Reverse Isolation

AGC Attack to Decay Ratio

AGC Leakage Current

0.1

±100

Reference Oscillator

REFOSC

Reference Oscillator

Input Impedance

Note 7

Note 8

290

5.0

Ω

Reference Oscillator Source

Demodulator

CTH

CTH Source Impedance

Note 9

150

±100

2000

Ω

ZCTH(leak)

CTH Leakage Current

= +85°C

Note 5

Demodulator Filter Bandwidth

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MICRF010

Symbol

Parameter

Condition

Min

0.8

Typ

Max

0.2

Units

Digital/Control Section

Input High Voltage

SHUT

µA

Input Low Voltage

Output Current

SHUT

OUT

DO pin, push-pull

DO pin, I

OUT

= –30µA

Output High Voltage

0.9

Output Low Voltage

DO pin, I

OUT

= +30µA

DO pin, C

LOAD

= 15pF

0.1

µs

, t

Output Rise and Fall Time

Notes:

1. Exceeding

absolute maximum ratings may damage the device.

2. The

device is not guaranteed to function outside its operating ratings.

3. Devices

are ESD sensitive, use appropriate ESD precautions. The device meets Class 1 ESD test requirements, (human body model HBM), in

accordance with MIL-STD-883C, method 3015. Do not operate or store near strong electrostatic fields.

4. Sensitivity

is defined as the average signal level measured at the input necessary to achieve 10

-2

BER (bit error rate). The RF input is assumed to

be matched to 50

Ω

5. Parameter

scales linearly with reference oscillator frequency f

. For

any reference oscillator frequency other than 9.794MHz, compute new

parameter value as the ratio:

REFOSC

MHZ

parameter value at 9.79MHz

(

)

9.794MHz

6. Spurious

reverse isolation represents the spurious components, which appear on the RF input pin (ANT) measured into 50

Ω

with an input RF

matching network.

7. Series

resistance of the resonator (ceramic resonator or crystal) should be minimized to the extent possible. In cases where the resonator series

resistance is too great, the oscillator may oscillate at a diminished peak-to-peak level, or may fail to oscillate entirely. Micrel recommends that

series resistances for ceramic resonators and crystals not exceed 50

Ω

and 100

Ω

, respectively.

8. Crystal

load capacitor is 10pF. See Figure 5 in “REFOSC” section for reference oscillator operation.

9. Parameter

scales inversely with reference oscillator frequency f

. For

any reference oscillator frequency other than 9.794MHz, compute new

parameter value as the ratio:

9.794MHz

parameter value at 9.794MHz

(

)

REFOSC

MHZ

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MICRF010

Typical Characteristics

Supply Current

vs. Frequency

Supply Current

vs. Temperature

4.0

3.5

3.0

2.5

2.0

6.0

f = 315 MHZ

= 5V

= 25

= 5V

4.5

3.0

1.5

Fix Mode

Continuous Operation

Fix Mode,

Continuous Operation

-40 -20

20 40 60 80

100

250 300 350 400 450 500

TEMPERATURE (

FREQUENCY (MHz)

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MICRF010

Functional Diagram

Figure 1. MICRF010 Block Diagram

Application Information and Function

Description

“MICRF010 Block Diagram” above shows the IC

partitioned into three

sections: 1) UHF Downconverter, 2)

OOK Demodulator, 3) Reference and Control. Also shown

in the figure are two external capacitors (C

, C

AGC

) and

Design Steps:

The following steps are the basic design steps for using the

MICRF010 receiver:

1. Select

the reference oscillator

2. Select

the demodulator filter bandwidth

3. Select

the C

capacitor

one timing element, which is usually a crystal. With the

exception of a supply decoupling capacitor and antenna

impedance matching network, these are the only external

components needed by the MICRF010 to assemble a

complete UHF receiver.

4. Select

the C

capacitor

AGC

Step 1: Selecting The Reference Oscillator

All timing and tuning operations on the MICRF010 are

derived from the internal Colpitts reference oscillator.

Timing and tuning is controlled through the REFOSC pin in

one of three ways:

For optimal performance it is highly recommended that the

MICRF010 is impedance-matched to the antenna. The

matching network will add an additional two or three

components.

1. Connect

a crystal.

The “SHUT” input is the only control input of the IC.

It is

used in polling operation for decreasing DC current

consumption. This input is CMOS compatible and it is

internally pulled-up.

2. Drive

this pin with an external timing signal.

The specific reference frequency required is related to the

system transmit frequency.

The IF Bandpass Filter Roll-off response of the IF Filter is

5th order, and the demodulator data filter has a 2nd order

response.

Crystal Selection

The smaller the crystal, the longer it takes for the oscillator

to start from a shutdown operation. If shorter start-up time

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MICRF010

is desired, use crystals with lower ESR, which normally are

bigger in size, like the HC49 package. “Application Hints

35” provides additional information and recommended

sources for crystals. If using an externally applied signal, it

should be AC-coupled and limited to the operating range of

Slicing level time constant values vary somewhat with

decoder type, data pattern, and data rate, but typically

values range from 5ms to 50ms. This issue is covered in

more detail in “Application Note 22.” Optimization of the

value of C

is required to maximize range.

0.2V

to 1.5V

Selecting Capacitor C

Selecting Reference Oscillator Frequency f

The first step in the process is selection of a data-slicing-

level time constant. This selection is strongly dependent

upon system issues including system decode response

time and data code structure (that is, existence of data

preamble, etc.) This issue is also covered in more detail in

“Application Note 22.”

As with any super-heterodyne receiver, the difference

between the internal LO (local oscillator) frequency f

and

the incoming transmit frequency f

, should equal the IF

center frequency.

Equation 1 may be used to compute the

appropriate f

for a given f

The effective resistance of R

is listed in the electrical

characteristics table as 150k

Ω

at 315MHz, this value

scales inversely with frequency. R

value at other

frequencies is given by equation (4), where f

is in MHz:

⎛

⎞

0.86

⎜

⎟

⎠

315

⎝

(1)

Frequencies f

and f

are in MHz.

Note that two values

of f

exist for any given f

, distinguished as “high-side

mixing” and “low-side mixing.” High-side mixing results in

an image frequency above the frequency of interest and

low-side mixing results in a frequency below. There is

generally no preference of one over the other.

9.7941

150

Ω

(4)

can be calculated using equation (5) with the

knowledge of R

and

τ.

After choosing one of the two acceptable values of f

, use

Equation 2 to compute the reference oscillator frequency

(5)

(2)

64.5

Recommended

is 5x the bit-rate.

Frequency f

is in MHz. Connect a crystal of frequency f

to REFOSC on the MICRF010. Four-decimal-place

accuracy on the frequency is generally adequate. The

following table identifies f

for some common transmit

A standard ±20% X7R ceramic capacitor for C

generally sufficient. Refer to “Application Hint 42” for C

frequencies.

and C

AGC

selection examples.

Reference Oscillator

Step 3: Selecting C

AGC

Capacitor

Transmit Frequency (f

)

Frequency (f

)

The signal path has AGC (automatic gain control) to

increase input dynamic range. The attack time constant of

the AGC is set externally by the value of the CAGC

capacitor connected to the CAGC pin of the device. To

maximize system range, it is important to keep the AGC

control voltage ripple low, preferably under 10mV

once

the control voltage attains its quiescent value. For this

reason, capacitor values of at least 0.47µF are

recommended.

315.0 MHz

390.0 MHz

418.0 MHz

433.92 MHz

9.7941 MHz

12.1260 MHz

12.9966 MHz

13.4916 MHz

Table 1. Recommended Reference Oscillator Values For

Typical Transmit Frequencies (high-side mixing)

Step 2: Selecting C

Capacitor

The AGC control voltage is carefully managed on-chip to

allow duty-cycle operation of the MICRF010. When the

device is placed into shutdown mode (SHUT pin is pulled

high), the AGC capacitor floats to retain the voltage. When

operation is resumed, only the voltage drop, due to

capacitor leakage, must be replenished. A relatively low-

leakage capacitor such as a ceramic type is recommended

Extraction of the DC value of the demodulated signal for

purposes of logic-level data slicing is accomplished using

the external threshold capacitor C

and the on-chip

switched capacitor “resistor” RSC, as shown in the block

diagram.

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MICRF010

when the devices are used in duty-cycled operation.

(that is, the attack time constant is 10 times of the decay

time constant). Generally the design value of 1:10 is

adequate for the vast majority of applications. If adjustment

is required, adding a resistor in parallel of the C

AGC

capacitor may vary the ratio. The value of the resistor must

be determined on a case-by-case basis.

To further enhance duty-cycled operation, the AGC push

and pull currents are boosted for approximately 10ms

immediately after the device is taken out of shutdown. This

compensates for AGC capacitor voltage drop and reduces

the time to restore the correct AGC voltage. The current is

boosted by a factor of 45.

Selecting CAGC Capacitor in Continuous Mode

A CAGC capacitor in the range of 0.47µF to 4.7µF is

typically recommended. Caution! If the capacitor is too

large, the AGC may react too slowly to incoming signals.

AGC settling time, from a completely discharged (zero-volt)

state is given approximately by Equation 6:

∆

1.33

AGC

−

0.44

where:

_{AGC
is in µF, and
∆
t is in seconds.}

(6)

Selecting CAGC Capacitor in Duty-Cycle Mode

Voltage droop across the CAGC capacitor during shutdown

should be replenished as quickly as possible after the IC is

enabled. As mentioned above, the MICRF010 boosts the

push-pull current by a factor of 45 immediately after start-

up. This fixed time period is based on the reference

oscillator frequency f

. The time is 10.9ms for f

12.00MHz, and varies inversely with f

. The value of CAGC

capacitor and the duration of the shutdown time period

should be selected such that the droop can be replenished

within this 10ms period.

Polarity of the droop is unknown, meaning the AGC voltage

could droop up or down. The worst-case from a recovery

standpoint is downward droop, since the AGC pull-up

current is 1/10th magnitude of the pull-down current. The

downward droop is replenished according to the Equation

∆

(7)

AGC

where:

I = AGC pull-up current for the initial 10ms (67.5µA)

_{AGC
= AGC capacitor value}

∆

t = drop recovery time

∆

V = drop voltage

For example, if user desires

∆

t = 10ms and chooses a

4.7µF CAGC, the allowable droop is about 144mV. Using

the same equation with 200nA, the worst-case pin leakage,

and assuming 1µA of capacitor leakage in the same

direction, the maximum allowable

∆

t (shutdown time) is

about 0.56s for droop recovery in 10ms.

The ratio of decay-to-attack time-constant is fixed at 1:10

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MICRF010

protection diodes at all input and output pins are not

shown.

The Demodulator Filter Bandwidth

There is no external control to set the demodulator

bandwidth. The maximum bandwidth is 2000 hertz at 315

MHz. Maximum

bandwidth scales linearly with operating

frequency. To

minimize data pulse stretching, one must

calculate the “demodulator BW required” to be certain that

it does not exceed demodulator filter bandwidth of

MICRF010 at operating frequency.

For “demodulator BW

required” calculation, one needs to identify the shortest

pulse within the data profile and use equation 8 below:

CTH Pin

VDD

PHI2B

TG2

PHI1B

TG1

Demodulator

gn al

CTH

~1.6V

PHI2

PHI1

VSS

0.65

Demodulator BW Required

(8)

Figure 2. CTH Pin

shortest pulse – width

Figure 2 illustrates the CTH pin interface circuit. The CTH

pin is driven from a N-Channel MOSFET source-follower

with approximately 10µA of bias. Internal control signals

PHI1/PHI2 are related in a manner such that the

impedance across the transmission gates looks like a

“resistance” of approximately 150k

Ω

. The DC potential at

the CTH pin is approximately 1.6V

Refer to the “Electrical Characteristics” for the exact filter

bandwidth at a chosen frequency.

Power Supply Bypass Capacitors

Supply bypass capacitors are strongly recommended. One

example is to use 0.1uF ceramic capacitor in parallel with

100pF ceramic capacitor for VDD.

CAGC Pin

VDD

Data Squelching

During quiet periods (no signal), the data output (DO pin)

transitions randomly with noise. Most decoders can

discriminate between this random noise and actual data.

For some systems, random transition due to noise during

quiet period is a problem. There are three possible

approaches to reduce this output noise:

Co m

–

meo

1. Analog

squelch to raise the demodulator threshold.

160

2. Digital

squelch to disable the output when data is not

present.

3. Output

filter to filter the (high frequency) noise

glitches on the data output pin.

Figure 3. CAGC Pin

The simplest solution is to perform analog squelch by

inducing a small offset, or squelch voltage, on the CTH pin

so that noise does not trigger the internal comparator,

Usually 20mV to 30mV on CTH pin is sufficient.

This may

be achieved by connecting a several-meg-ohm resistor

from the CTH pin to either VSSBB or VDDBB, depending

upon the desired offset polarity. Since MICRF010’s

receiver AGC noise at the internal comparator input is

always the same (set by the AGC), the squelch-offset

requirement does not change as the local noise strength

changes from installation to installation. Introducing

squelch will reduce sensitivity and range. One should

introduce minimal offset to sufficiently quiet the output.

Typical squelch resistor values range from 10M

Ω

to 6.8M

Ω

for low to high squelch strength.

Figure 3 illustrates the CAGC pin interface circuit. The

AGC control voltage is developed as an integrated current

into a capacitor CAGC. The attack current is nominally

1.5µA, while the decay current is a 10 times scaling of this,

approximately 15µA. Signal gain of the RF/IF strip inside

the IC diminishes as the voltage on CAGC decreases. By

simply adding a capacitor to CAGC pin, the attack/decay

time constant ratio is fixed at 10:1. Modification of the

attack/decay ratio is possible by adding resistance from the

CAGC pin to either VDDBB or VSSBB, as desired.

Both the push and pull current sources are disabled during

shutdown, which maintains the voltage across CAGC, and

improves recovery time in duty-cycled applications. To

further improve duty-cycle recovery, both push and pull

currents are increased by 45 times for approximately 10ms

after release of the SHUT pin. This allows rapid recovery of

any voltage droop on CAGC while in shutdown.

I/O Pin Interface Circuitry

Interface circuitry for the various I/O pins of the MICRF010

are diagrammed in Figures 2 through 8. The ESD

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MICRF010

DO Pin

SHUT Pin

The output stage for the digital output (DO) is shown in

Figure 4. The output is a 45µA push and 45µA pull

switched-current stage. This output stage is capable of

driving CMOS loads. An external buffer-driver is

recommended for driving high capacitance loads.

VDD

to Interna

Circuits

VSS

SHUT

Co m p a-

VSS

Figure 6. SHUT Pin

Control input circuitry is shown in Figure 6. The standard

input is a logic inverter constructed with minimum geometry

MOSFETs (Q2, Q3). P-Channel MOSFET Q1 is a large

channel length device, which functions essentially as a

“weak” pull-up to VDDBB. Typical pull-up current is 5µA,

leading to an impedance to the VDD supply of typically

Ω

VSS

Figure 4. DO Pin

REFOSC Pin

The REFOSC input circuit is shown in Figure 5. Input

impedance is quite high (290k

Ω

). This is a Colpitts

oscillator, with internal 10pF capacitors.

Externally applied signals should be AC-coupled,

amplitude limited to approximately 0.5V

. The nominal

DC bias voltage on this pin is 1.4V

VDD

Active

Bias

200k

REFOSC

250

10pF

30uA

VSS

Figure 5. REFOSC Pin

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MICRF010

Frequency

(Mhz)

S11

Mag, angle

Z11, ohms

C3, pF

L2, nH

Additional Applications Information

In addition to the basic operation of the MICRF010, the

following enhancements can be made. In particular, it is

strongly recommended that the antenna impedance is

matched to the input of the IC.

300

305

310

315

320

325

330

335

340

345

350

355

360

365

370

375

380

385

390

395

400

405

410

415

420

425

430

435

440

0.944,-36.65

0.940,-37.499

0.942,-37.579

0.945, -37.66

0.943,-38.237

0.942, -38.814

0.94, -39.39

14.45-j150

14.84-j145

14.28-j145

13.48-j145

13.58-j143

13.43-j140

13.5-j138

2.2

Antenna Impedance Matching

1.8

0.938, -39.967

0.937, -40.544

0.935, -41.12

0.933, -41.697

0.931, -42.274

0.93, 42.85

13.59-j136

13.44-j134

13.51-j132

13.57-j130

13.62-j123

13.48-j126

13.52-j124

13.57-j122

13.42-j120

13.46-j118

13.49-j117

13.35-j115

13.6-j114

2.2

0.928, -43.427

0.926, -44.004

0.925, -44.581

0.923, -45.157

0.921, -45.734

0.92, -46.311

0.917, -46.729

0.914, -47.148

0.912, -47.566

0.909, -47.985

0.907, -48.403

0.906, -48.797

0.909, -49.152

0.911, -49.507

0.911, -49.925

0.904, -50.571

1.8

2.2

Figure 7. Antenna Pin Input Impedance

1.8

Figure 7 and Table 2 presents the antenna pin input

impedance. The

Antenna pin can be matched to 50

Ω

with

a high pass circuit as shown in Figure 8. That is, a shunt

inductor from the ANT Pin to ground and a series capacitor

from ANT Pin to the antenna.

13.89-j113

14.00-j112

14.25-j110

14.34-j109

14.28-j108

13.63-j107

13.15-j107

12.94-j106

13.66-j104

1.8

2.2

1.8

Table 2

Figure 8. Antenna with Matching Network to ANT Pin

Inductor values may be different from Table 2, depending

on PCB material, PCB thickness, ground configuration, and

how long the traces are in the layout. Values shown were

characterized for a 0.031 inch thickness, FR4 board, solid

ground plane on bottom layer, and very short traces.

MuRata and Coilcraft wire-wound 0603 or 0805 surface

mount inductors were tested, however, any wire-wound

inductor with high SRF (self-resonance frequency) should

do the job.

Shutdown Function

Duty-cycled operation of the MICRF010 (often referred to

as polling) is achieved by turning the MICRF010 on and off

via the SHUT pin. The shutdown function is controlled by a

logic state applied to the SHUT pin. When VSHUT is high,

the device goes into low-power standby mode. This pin is

pulled high internally, and it must be externally pulled low

to enable the receiver.

M9999-063005

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June 2005

Micrel

MICRF010

Application Example: 433.92Mhz, 1000 bps Manchester Encoded On-Off Keyed Receiver

17cm 22 AWG MAGNET WIRE

Bill of Materials

Item Qty Reference

Value

Description

Manufacturer

Part#

CAPACITORS

C8B

5.6pF

100pF

4.7pF

0.47uF

100nF

4.7uF

5.6pF Capacitor, 0603, 50VDC, ±5%

100pF Capacitor, 0603, 50VDC, ±5%

4.7pF Capacitor, 0603, 50VDC, ±5%

MuRata

GRM1885C1H5R6DZ01B

GRM1885C1H101JA01B

GRM1885C1H4R7CZ01B

0.47uF Capacitor, 0603, 25VDC, ±10%

100nF Capacitor, 0603, 25VDC, ±10%

4.7uF Capacitor, 0805, 10VDC, +80-20%

CONNECTORS

MuRata

GRM188R61A474KA61B

GRM188R71E104KA01B

GRM21BF51A475ZA01B

C5,C10

4 Pin Header

ANTENNA 17cm

22 AWG magnet wire

Major League Electronics

TSHS-148-S-06-A-GT

Consolidated

INDUCTORS

30nH Inductor, 0603, ±5%

24nH Inductor, 0603, ±5%

L6,L7,L9

30nH

24nH

Coilcraft

ACT

0603CS-30NXJB

0603CS-24NXJB

ZCB-0603

ZCB-0603 Ferrite

bead, >600 Ohm @ 100MHz

Ferrite bead, >600 Ohm @ 100MHz

ACT

ZCB-0603

RESISTORS

R5, R6

100K

VISHAY

CRCW06031003F

SEMICONDUCTORS

MICRF010BM 300-440MHz

UHF Receiver

13.4916MHz 10pF,

no built-in capacitor

MICREL

Abracon

MICRF010BM

ABl-13.4916MHz-10

M9999-063005

(408) 955-1690

June 2005

Micrel

MICRF010

PCB Layout Information

The MICRF010 evaluation board was designed and

characterized using two sided 31 mils thick FR4 material

with 1 ounce copper clad. If another type of printed circuit

board material were to be substituted, impedance matching

and characterization data stated in this document may not

be valid. The gerber files for this board can be downloaded

from the Micrel website at www.micrel.com.

All Units for PCB shown are in mils.

PCB Component Side Layout

PCB Silk Screen

PCB Solder Side Layout

M9999-063005

(408) 955-1690

June 2005

Micrel

MICRF010

Package Information

0.026 (0.65)

MAX

)

PIN 1

0.157 (3.99)

0.150 (3.81)

DIMENSIONS:

INCHES (MM)

0.020 (0.51)

0.013 (0.33)

0.050 (1.27)

TYP

0.0098 (0.249)

0.0040 (0.102)

0.010 (0.25)

0.007 (0.18)

0–8

0.197 (5.0)

0.189 (4.8)

0.050 (1.27)

0.016 (0.40)

SEATING

PLANE

0.064 (1.63)

0.045 (1.14)

0.244 (6.20)

0.228 (5.79)

8-Lead SOIC (M)

MICREL, INC.

2180 Fortune DRIVE

SAN JOSE, CA

95131 USA

TEL +1 (408) 944-0800

FAX +1 (408) 474-1000

WEB http:/www.micrel.com

The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.

Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.

Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can

reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the

body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or

sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any

damages resulting from such use or sale.

M9999-063005

(408) 955-1690

June 2005

Microchip-Tech-MICRF010YM

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