Microchip-Tech-MICRF114T-I-OT
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MICRF114
Low-Power Integrated Sub-GHz Wireless RF Transmitter
General Features
• Fully
Integrated Low-Power Sub-GHz RF
Transmitter
• Single-Pin
Crystal Oscillator with Integrated
Programmable Load Capacitor
• Wide
Operating Voltage Range: 1.8V to 3.6V
• Industrial
T
e
mperature Range: -40°C to +85°C
• Low-Current
Consumption: 0.2 µA in Sleep mode,
11.7 mA in +10 dBm Transmit mode
• Fast
Turn-On and Turn-Off Times
• Small
Footprint 6-pin SOT-23 Package
RF/Analog Features
• Fully
Integrated VCO and PLL Loop Filter
• Single-Ended
RF Output with Easy Antenna
Matching
• Wide
Operating Frequency Range: 285 MHz to
445 MHz
Pin Diagram
• Transmit
Power Programmable in 1 dB steps from
-2 dBm to +13 dBm
• Data
Rate: Up to 115.2 kbps NRZ, 57.6 kbps
Manchester Encoded
• On-Off
Keying (OOK) Modulation with Power
Ramp-Up Control
6-pin SOT-23
• Complies
with US (FCC) and Canada (IC)
Standards
OSC
VSS
RFO
SCK
SDI
1
2
3
6
5
4
Digital Features
• Simple
and Flexible 2-pin Proprietary
Microcontroller (MCU) Interface
• Supports
Proprietary Remote Control Protocols
VDD
Applications
• Remote
Keyless Entry (RKE)
• Garage
Door Opener (GDO)
• Alarm
and Security Systems
• Command
and Control
• Wireless
Sensors
• Industrial
Sensing and Control
• Smart
Energy
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 1
MICRF114
Table of Contents
1.0 Hardware
Descriptio
n
.
……………………………………………………………………………………………………………………………………………… 3
2.0 Functional
Descriptio
n
.
…………………………………………………………………………………………………………………………………………….. 7
3.0 Typical
Performance Curves …………………………………………………………………………………………………………………………………….11
4.0 Application
Circuit………………………………………………………………………………………………………………………………………………….. 19
5.0 Electrical
Characteristic
s
.
……………………………………………………………………………………………………………………………………….. 23
6.0 Packaging
Information……………………………………………………………………………………………………………………………………………. 27
Appendix A:Revision History……………………………………………………………………………………………………………………………………………. 30
The Microchip Web Sit
e
.
…………………………………………………………………………………………………………………………………………………. 31
Customer Change Notification Service ……………………………………………………………………………………………………………………………… 31
Customer Suppor
t
.
…………………………………………………………………………………………………………………………………………………………. 31
Product Identification System…………………………………………………………………………………………………………………………………………… 32
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o
t
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u can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
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DS50002416A-page 2
Preliminary
2015 Microchip Technology Inc.
MICRF114
The MICRF114 is optimized for battery-powered
applications. It features low-current consumption and
can operate over a wide supply voltage range. Internal
circuits sensitive to supply voltage variations run from
the on-chip Low Dropout (LDO) regulator.
T
o
r
educe
pin count and system Bill of Materials (BOM), the LDO
regulator does not need an external capacitor for
stability, and the single-pin reference oscillator has a
integrated programmable crystal load capacitor. The
single-ended RF output enables easy matching to
monopole antennas with a minimal number of external
components.
1.0
1.1
HARDWARE DESCRIPTION
Overview
The MICRF114 is a simple, low-cost OOK transmitter
with programmable output power. It is primarily
intended for command and control applications such as
RKE and GDO. The transmitter is synthesizer based
for high-frequency accuracy. It operates on a single
frequency that is determined by the frequency of the
crystal connected to the built-in reference oscillator.
This frequency can be selected from a wide range. The
more popular transmit frequencies require readily
A 2-wire proprietary MCU interface is used to program
the parameters of the MICRF114 to select its operating
mode and to input the transmit data packet. A built-in
self-calibration circuit ensures consistent performance
over the operating frequency range and against
available crystal frequencies. For example,
a
433.92 MHz transmit frequency requires a 13.56 MHz
crystal. The RF performance of the transmitter is
compliant with FCC and IC regulations and with some
Japanese standards. European
T
e
lecommunications
Standards Institute (ETSI) requirements can be met at
low-radiated power.
temperature
variations.
Initial
calibration
is
automatically performed
during Power-on Reset
(POR). Recalibration can be initiated by the MCU that
controls the application when required.
1.2
Block Diagram
Figure 1-1
shows the MICRF114 block diagram.
FIGURE 1-1:
MICRF114 ARCHITECTURE BLOCK DIAGRAM
POWER MANAGEMENT
V
DD
V
SS
To Digital
Block
BIAS
REFERENCE
POR
LDO
PFD
Regulated
Supply
SYNTHESIZER
OSC
RFO
CP
VCO
PA
1/32
TX Data
DIGITAL BLOCK
SDI
Operating mode control
Self-Calibration
MCU Interface
Configuration register
SCK
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 3
MICRF114
1.3
Pin Descriptions
T
a
ble 1-1
describes the MICRF114 pins.
TABLE 1-1:
Pin
MICRF114 PIN DESCRIPTIONS
Name
Type
Description
MCU interface serial clock input
1
2
3
4
5
6
SCK
SDI
Digital Input
Digital Input
Power
MCU interface serial configuration or TX data input
Positive supply voltage
VDD
RFO
VSS
OSC
Analog Output
Power
RF TX output
Ground reference
Analog Input
Reference crystal connection
1.4
Power Management
1.6
Device Control
The MICRF114 has a single power pin and a single
ground pin. The sensitive analog blocks run from an
internal LDO, which does not need an external
capacitor. A bias and reference circuit provides
reference voltage to the LDO and bias currents to all
analog blocks.
Data transmission start and stop are always initiated by
the MCU. Programmable transmit parameters are
stored in a single 16-bit register. The value in this
register is kept as long as the supply voltage is present.
The MCU can rewrite the register at the beginning of
each transmission. Immediately after POR or at the
beginning of a transmission, an internal state machine
turns on the various blocks of the MICRF114 with the
required sequence and timing and then performs an
automatic calibration of the device when required. The
MCU must wait for these operations to be completed
before sending the transmit data packet.
The digital block runs from the unregulated supply. This
enables communication with the MCU even when most
of the blocks (including the LDO) are turned off to save
power. Additionally, the MICRF114 retains its self-
calibration result and user-programmable parameters
in this low-power state.
T
o
g
et the highest possible
efficiency, the RF Power Amplifier (PA) block runs
directly from the unregulated supply.
An initial calibration is done after POR. The calibration
result is kept as long as the supply voltage is present.
Recalibration can be requested by the MCU when
required.
A POR circuit keeps the MICRF114 in a Reset state
until the supply voltage is sufficient for proper operation
of the digital block. The POR event resets the device
control state machine and the Configuration register to
their default state. A Reset is also triggered by
sufficiently large supply voltage glitches and brown-out.
1.7
Crystal Oscillator
The reference frequency source is a single-pin crystal
oscillator. The transmit frequency is 32 times the
reference. Thus, the relative accuracy of the crystal
oscillator directly determines the accuracy of the
transmit frequency. The most popular transmit
frequencies require standard and off-the-shelf low-cost
crystals. The oscillator operates at parallel resonance.
The load capacitor that the crystal requires is
integrated to minimize the BOM.
T
o
a
ccommodate
various crystal types and compensate for PCB parasitic
capacitances, the value of this load capacitor is
programmable by the MCU.
1.5
MCU Interface
A proprietary 2-wire serial interface consisting of a
clock line and a data line is utilized to control the
operation of the MICRF114 and to input the transmit
data packet. Special start and stop conditions on these
two lines indicate the beginning and end of
communication with the MCU. Except during these
Start and Stop bits, the MCU must
change the data
only when the clock is at logic low. Control and
Configuration bits are sent synchronously, and the
MICRF114 samples the data on the rising edge of the
clock. Transmit data is sent asynchronously with the
clock held low. During transmission, the serial data line
is connected directly to the RF modulator. The
assembly and timing of the data packet are the
responsibilities of the MCU.
The other function of the crystal oscillator is to provide
a relatively accurate clock frequency for the automatic
calibration circuit. As the crystal frequency is
determined by the transmit frequency and can vary
over a wide range, the clock is generated by dividing
the crystal frequency by a programmable number that
must be properly set
performance.
to achieve the expected
DS50002416A-page 4
Preliminary
2015 Microchip Technology Inc.
MICRF114
1.8
Frequency Synthesizer
The frequency synthesizer is a fully integrated PLL with
a fixed feedback division ratio. It operates on a single
frequency that is determined by the reference crystal.
The VCO within the PLL operates directly at the
transmit frequency to save power. The VCO also has a
wide tuning range to cover most of the popular
frequencies below 500 MHz.
1.9
Transmit Path
The main element of the transmit path is the RF Power
Amplifier (PA). Since typical applications use monopole
antennas, the output is single-ended. It must be biased
to V
DD
using an inductor. This configuration enables
high-voltage swing, thereby reducing the required
supply current for the specified output power. The
output power is programmable by the MCU in 1 dB
steps. This enables the current consumption and
transmit range to be optimized according to the
product requirements of the customers. Additionally,
compliance with the relevant regulations can be
ensured with different antenna gains.
To
e
ase design-in and keep the BOM as low as
possible, the output capacitance of the PA is
programmable by the MCU. As a result, the impedance
matching circuit between the RF output and the
antenna requires fewer elements and is easier to
optimize. A modulator circuit is used to control the
slope of the output power ramping on and off. This is to
prevent steep supply current transients which may
result in a spectrum splatter.
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 5
MICRF114
NOTES:
DS50002416A-page 6
Preliminary
2015 Microchip Technology Inc.
MICRF114
FIGURE 2-1:
INITIALIZATION FLOWCHART
2.0
2.1
FUNCTIONAL DESCRIPTION
Initialization
RESET
After applying the supply voltage, the MICRF114 is
initialized by its built-in POR circuit. The POR is level
sensitive. It starts to generate a Reset pulse for the
internal logic when the rising supply voltage (V
DD
)
crosses a given threshold. The threshold level is
chosen so that the operation of the digital circuits is
already guaranteed at the beginning of the Reset
pulse.
N
V
DD
>V
TP
?
Y
wake-up
sequence A
Initialization first involves resetting all internal state
machines, setting the Configuration register to its
default value, and executing a calibration sequence to
guarantee proper operation of the frequency
synthesizer. Blocks needed for calibration are turned
on with the required sequence and timing. The result is
stored after calibration, and all blocks are turned off to
bring the MICRF114 into Sleep mode where it waits for
the MCU to initiate transmission. The calibration result
is kept as long as the supply voltage is present.
calibration
SLEEP
2.2
Operating Modes
The MICRF114 has two main operating modes:
• Sleep
mode
Figure 2-1
illustrates the simplified initialization
flowchart where the Reset due to V
DD
drops or brown-
out is not shown. Additionally, it is not shown that a
Reset condition in any state or during any sequence
immediately brings the MICRF114 into its Reset state.
• Transmit
mode
In Sleep mode, all the blocks (except the POR and the
digital block) are powered down and wait to be woken
up by the MCU. The current consumption is minimal
because there is no activity within the digital block.
After the wake-up sequence and the associated delay,
MICRF114 enters Transmit mode. In Transmit mode,
all blocks become active and an RF signal, modulated
by the data stream sent by the MCU, is transmitted.
Transmission can be terminated by the MCU without
any time-out delay when required and the MICRF114
immediately goes back to Sleep mode.
One of the advantages of the level-sensitive Reset is
that the generation and length of the Reset pulse
are
mostly independent of the slope of the rising V
DD
.
Another advantage is that it triggers a Brown-out Reset
(BOR) when V
DD
goes below the V
TP
threshold
voltage. Refer to
Figure 2-2
.
Abrupt drops of the V
DD
can disturb the operation of
digital circuits even if the V
DD
always stays above the
threshold level during such a transient. The POR block
also generates a Reset pulse after this kind of event if
the voltage drop exceeds the V
TG
threshold value.
Section 2.3 “Communication with the MCU”
shows
the main operating mode flowchart and the associated
activity on the MCU interface.
FIGURE 2-2:
V
DD
POR OPERATION
V
TG
V
TP
0
t
t
DP
t
DP
PORn
V
HI
V
LO
t
Note
: V
HI
follows V
DD
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 7
MICRF114
Control and Configuration bits are sent synchronously
after the Start bit. The two control bits, CAL and CF
G
,
must always be present. If CAL is high, recalibration is
performed before transmission. In this case, the wake-
up time from Sleep mode to Transmit mode is longer. If
CFG is high, the MCU must send 17 additional
Configuration bits. The first 16 bits updates the 16-bit
Transmit Parameter register within the MICRF114. The
Most Significant bit (MSb) is sent first. The last bit must
always be
‘
0
’.
Figure 2-3
shows the two methods of
starting transmission.
2.3
Communication with the MCU
The communication between the MCU and the
MICRF114 is one-directional and it is always initiated
by the MCU. It uses a proprietary protocol that supports
switching between the two operating modes, optional
request for recalibration, reprogramming of the
operating parameters (as needed), and transmit data
input. The logic is active-high.
The communications protocol requires both the lines of
Serial Clock (SCK) and Serial Data Input (SDI) to idle
high. However, this is not the state with the lowest
current consumption because the SCK input of the
MICRF114 has an internal pull-down resistor to avoid
unwanted clock transitions during the power-on
process. In Sleep mode, the clock line can be pulled
low to minimize the overall supply current.
The wake-up sequence from Sleep mode to Transmit
mode starts at the rising edge of the last clock pulse.
This is the second or 19th clock, depending on the CFG
bit setting.
FIGURE 2-3:
COMMUNICATION PROTOCOL
Transmit with quick-start using the default or previously loaded configuration setting
s
.
Recalibration (CAL=1) is not normally needed.
Sleep
Sleep
Wake-up
Transmit
t
W
K
+ cal * t
CL
Start
CFG
Asynchronous TX Data
Stop
CAL
(MCU Waits)
SDI
SCK
Transmit start with configuration settings updat
e
.
Recalibration is always needed in case of frequency setting chang
e
.
Wake-up
Sleep
Start
CAL
CFG
0
16 Configuration (Config) bits
SDI
SCK
DS50002416A-page 8
Preliminary
2015 Microchip Technology Inc.
MICRF114
After the wake-up delay, the MICRF114 starts to
automatically transmit. Since the exact timing of this is
unknown by the MCU, keep the transmit data input low
until the maximum specified wake-up time passes.
Although the MICRF114 wakes up earlier, it transmits
‘
0
’, that is, no carrier. Transmit data is asynchronous
and directly modulates the RF carrier. The MCU takes
care of all timing and coding of the data in software.
This is feasible due to the typical low-data rates and is
necessary due to the great variety of proprietary
protocols. The flowchart in
Figure 2-4
shows the
MICRF114 states during a normal operation cycle.
2.4
Parameter Selection
All transmit parameters of the MICRF114 are stored in
a single 16-bit register. This is loaded with default
values at POR. The MCU can modify these values
before sending the transmit data. There are four
distinct parameter fields in the register as shown in
T
a
ble 2-1
.
T
o
k
eep the MCU interface simple, only the
complete register as a whole can be updated. Fields
that need to remain unchanged must be reloaded with
the same value. For example, the new register value is
retained in Sleep mode until the next POR event.
FIGURE 2-4:
TOP FLOWCHART
SLEEP
N
N
Start?
CAL =
1
?
Y
Y
Read
Calibration
Control Bits
N
Wake-up
Sequence B
CFG =
1
?
Y
Read
TRANSMIT
Config Bits
N
Stop?
Wake-up
Sequence A
Y
TABLE 2-1:
Bit Range
TRANSMIT PARAMETERS OF MICRF114
Default
Parameter
Field
Symbol
Setting
Value
<15:13>
<12:8>
<7:4>
Transmit Frequency
Crystal Load Capacitor
RF Transmit Power
F<2:0>
X<4:0>
P<3:0>
R<3:0>
f
TX
0x7
0x16
0xC
0x0
425-445 MHz
18 pF
C
XT
P
TX
C
TX
+10 dBm
0 pF
<3:0>
RF Output Tuning Capacitor
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 9
MICRF114
Select the transmit frequency parameter to ensure that
the actual operating frequency, which is determined by
the selected crystal, falls into the frequency range
defined by the parameter. Refer to
T
a
ble 2-2
.
2.5
Transmitting
The MICRF114 is normally in Sleep mode. The MCU
always initiates entry into Transmit mode by sending a
Start bit, the compulsory Control bits, and the optional
Configuration bits to the MICRF114, which starts its
wake-up sequence. After the wake-up delay, it
transmits the data present on its SDI pin. The MCU
holds the SDI pin low for the maximum specified wake-
up time. If calibration is requested, the maximum
specified calibration time must be added to the wake-
up time.
TABLE 2-2:
FREQUENCY RANGE
f
TX
range (MHz)
F<2:0>
Min
285
305
325
345
365
385
405
425
Max
305
325
345
365
385
405
425
445
0
1
2
3
4
5
6
7
Transmit parameters are not usually changed on the
fly, and recalibration is not necessary. Therefore, the
MCU can use the quick-start transmit sequence as
described in
Section 2.3 “Communication with the
MCU”
. However, except in the rare case that all default
parameter settings are acceptable for the application,
the first transmission after a POR event must include
sending the required Configuration bits. Recalibration
is always needed when the transmit frequency is in a
band that is different from the default value.
Equation 2-1
through
Equation 2-1
show that the rest
of the programmable parameters can be calculated
from the Control bit fields.
The MICRF114 stays in Transmit mode until the MCU
sends a Stop bit and then reverts to Sleep mode
without any time-out delay.
EQUATION 2-1:
CRYSTAL LOAD
CAPACITOR
Crystal Load Capacitor:
C
XT
= 7 pF + X <4:0> * 0.5 pF
EQUATION 2-2:
RF TRANSMIT POWER
RF Transmit Power:
P
TX
= -2 dBm + P <3:0> dBm
EQUATION 2-3:
RF OUTPUT TUNING
CAPACITOR
RF Output Tuning Capacitor:
C
TX
= 0 pF + R <3:0> * 0.2 pF
The operating frequency, the crystal load capacitor,
and the RF output tuning capacitor settings depend on
the selection of external components and, to a lesser
extent, PCB layout. If these parameters are different
from the default values, it must be set only once during
the first transmission after a POR event.
DS50002416A-page 10
Preliminary
2015 Microchip Technology Inc.
MICRF114
Harmonic filtering is omitted. The measured power
levels are calculated back to the RFO pin of the
MICRF114, taking into account the losses of the
characterization setup. Component values that are
valid for the two frequencies are listed in
T
a
ble 3-1
.
3.0
3.1
TYPICAL PERFORMANCE
CURVES
Characterization Setup
The MICRF114 is characterized at the two most
popular frequencies, 315 MHz and 433.92 MHz, over
the whole operating temperature and supply voltage
range. The results shown in
Section 3.2
“315 MHz
Results”
and
Section 3.3 “433 MHz results”
are the
average values taken from three devices, each coming
from a typical wafer lot. The RF output of the
MICRF114 is matched to 50
ohms to facilitate
connection to a spectrum analyzer. Refer to
Figure 3-1
.
TABLE 3-1:
Component
COMPONENT VALUES
Frequency
315 MHz
433 MHz
L1
L2
C1
C2
360 nH
39 nH
6.8 pF
9.1 pF
330 nH
22 nH
5.6 pF
5.6 pF
FIGURE 3-1:
MATCHING CIRCUIT
SCHEMATIC
Current consumption is measured with a 50% duty-
cycle OOK modulation at 115.2 kbps data rate. Output
power is measured in unmodulated, Continuous Wave
(CW) mode. The reference spur level and the phase
noise are also measured in CW mode at +10 dBm
(nominal) output power setting. The phase noise is
measured at 1 MHz offset from the carrier.
VDD
L1
L2
C2
C1
RFO
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 11
MICRF114
3.2
315 MHz Results
Figure 3-2
through
Figure 3-7
show the average values measured at 315 MHz.
FIGURE 3-2:
CURRENT CONSUMPTION, 0 dBm POWER SETTING
FIGURE 3-3:
OUTPUT POWER, 0 dBm POWER SETTING
DS50002416A-page 12
Preliminary
2015 Microchip Technology Inc.
MICRF114
FIGURE 3-4:
CURRENT CONSUMPTION, +10 dBm POWER SETTING
FIGURE 3-5:
OUTPUT POWER, +10 dBm POWER SETTING
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 13
MICRF114
FIGURE 3-6:
REFERENCE SPUR LEVEL
FIGURE 3-7:
PHASE NOISE
DS50002416A-page 14
Preliminary
2015 Microchip Technology Inc.
MICRF114
3.3
433 MHz results
Figure 3-8
through
Figure 3-13
show the average values measured at 433 MHz.
FIGURE 3-8:
CURRENT CONSUMPTION, 0 dBm POWER SETTING
FIGURE 3-9:
OUTPUT POWER, 0 dBm POWER SETTING
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 15
MICRF114
FIGURE 3-10:
CURRENT CONSUMPTION, +10 dBm POWER SETTING
FIGURE 3-11:
OUTPUT POWER, +10 dBm POWER SETTING
DS50002416A-page 16
Preliminary
2015 Microchip Technology Inc.
MICRF114
FIGURE 3-12:
REFERENCE SPUR LEVEL
FIGURE 3-13:
PHASE NOISE
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 17
MICRF114
NOTES:
DS50002416A-page 18
Preliminary
2015 Microchip Technology Inc.
MICRF114
T
a
ble 4-1
shows the values of the frequency-
dependent components for the two most popular
frequencies. Except for L1, it is recommended to use
0402 SMD
components in the matching and filter
network.
4.0
4.1
APPLICATION CIRCUIT
50-ohm Matching Example
Figure 4-1
shows the RF section of the MICRF114
application circuit. The VSS pin potential is the ground
reference for the whole circuit. The supply voltage
(1.8V to 3.6V) is connected to the VDD pin. Capacitors
C5 and C6 provide supply bypass (filtering). In every
application, the MICRF114 has to be controlled by an
MCU via the proprietary serial interface (SDI and SCK
pins). The quartz crystal (X1) connected to the OSC pin
determines the operating frequency which is 32 times
the crystal resonance frequency.
TABLE 4-1:
COMPONENT VALUES
Frequency
Component
315 MHz
433 MHz
X1
L2
9.84375 MHz
39 nH
13.56 MHz
22 nH
C1
C2
C3
L3
9.1 pF
6.8 pF
5.6 pF
8.2 pF
18 nH
9.1 pF
The matching network (L1, L2, C1, and C2) provides
optimum power transfer from the MICRF114 to the
antenna. The filter stage (L3, C3, and C4) removes the
unwanted harmonics. The required harmonic
suppression depends on the operating frequency,
antenna characteristics, and regional regulations. This
means the order of the filter (the number of
components) may be different in an actual application
with an integrated antenna.
12 pF
27 nH
C4
12 pF
8.2 pF
FIGURE 4-1:
SCHEMATIC DIAGRAM
Supply
C5
C6
4.7 nF
470 pF
L1
Matching
Filtering
220 nH
L3
C3
L2
C2
VDD
SDI
RFO
50 ohm
RF Output
C1
C4
VSS
OSC
From MCU
SCK
X1
Note:
This is a suggested schematic diagram only. Component values for C1 to C4 and L2 to L3 vary according
to operating frequency, antenna characteristics, and regional regulations. Certain components can be
removed.
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 19
MICRF114
Measurement results are shown in
Figure 4-2
through
Figure 4-7
. Note that the regulations limit the radiated
field strength at a given distance. The maximum usable
power setting at a given frequency and geographic
region can be determined only if the antenna gain is
known. The level of the fundamental carrier signal and
all possible out-of-band signals – harmonics, spurs,
and integrated phase noise – must be taken into
account. The filter network can be simplified at low-
radiated power.
4.2
Measurement Results
The important parameters for regulatory standard com-
pliance are measured on PICtail™ boards for the two
most popular operating frequencies using the fre-
quency-dependent components listed in
T
a
ble 4-1
. The
MICRF114 operates in CW mode. Harmonics and
spurs are measured at +10 dBm output power setting.
Matching network, cable, and connector losses are not
compensated to ensure that the actual power readings
on the spectrum analyzer are slightly less.
FIGURE 4-2:
HARMONIC LEVELS AT 315 MHZ
FIGURE 4-3:
SPURIOUS LEVELS AT 315 MHZ
DS50002416A-page 20
Preliminary
2015 Microchip Technology Inc.
MICRF114
FIGURE 4-4:
PHASE NOISE AT 315 MHZ
FIGURE 4-5:
HARMONIC LEVELS AT 433 MHZ
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 21
MICRF114
FIGURE 4-6:
SPURIOUS LEVELS AT 433 MHZ
FIGURE 4-7:
PHASE NOISE AT 433 MHZ
DS50002416A-page 22
Preliminary
2015 Microchip Technology Inc.
MICRF114
5.0
ELECTRICAL CHARACTERISTICS
In
T
a
ble 5-1
and
T
a
ble 5-2
, all voltages are referenced to the potential on the VSS pin.
TABLE 5-1:
Symbol
ABSOLUTE MAXIMUM RATINGS
Parameter
Min
Typ
Max
Unit
Conditions/Notes
V
DD
V
IN
Supply Voltage
-0.3
-0.3
-0.3
—
—
—
—
—
—
—
—
4.0
V
DD
+0.3
9
V
V
On VDD pin
Voltage on any pin
Voltage on RFO pin
Electrostatic Discharge
Current into any pin
Storage
T
e
mperature
Lead
T
e
mperature
Except VDD and RFO pins
V
RF
V
ESD
I
IN
V
RF peak values
2000
25
V
Any pin combinations, HBM
-25
-55
—
mA
°C
°C
—
T
ST
T
LD
+125
+260
—
Soldering, for max 10s
TABLE 5-2:
Symbol
RECOMMENDED OPERATING CONDITIONS
Parameter
Min
Typ
Max
Unit
Conditions/Notes
V
DD
V
IN
Supply Voltage
1.8
0.0
0.2
-40
2.7
—
3.6
V
DD
7.2
V
V
On VDD pin
Voltage on any pin
Except VDD and RFO pins
RF peak values
Ambient
V
RF
T
OP
Voltage on RFO pin
Operating
T
e
mperature
—
V
+27
+85
°C
Typical parameter values in
T
a
ble 5-3
through
T
a
ble 5-6
are valid at typical V
DD
and
T
OP
except where indicated
otherwise.
TABLE 5-3:
Symbol
DC CHARACTERISTICS
Parameter
Min
Typ
Max
Unit
Conditions/Notes
Sleep mode
Transmit mode
(1)
—
0.2
11.7
1.2
0.8
—
—
µA
mA
V
I
DD
Supply Current
—
—
V
TP
V
TG
V
IL
POR Level Threshold
POR Glitch Threshold
Digital in Low Level
Digital in High Level
Input Pull Down
—
—
V
DD
< V
TP
needed for POR
—
—
—
0.35 x V
DD
—
V
Larger glitch generates POR
V
—
V
IH
0.65 x V
DD
—
—
V
—
R
PD
134
—
k
On SCK pin
Note 1:
OOK transmission with +10 dBm power and 50% duty cycle.
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 23
MICRF114
TABLE 5-4:
Symbol
AC CHARACTERISTICS
Parameter
Min
Typ
Max
Unit
Conditions/Notes
f
TX
Transmit Frequency
Output Capacitance
285
0
—
445
3
MHz
pF
32 times the crystal frequency
Selectable with 0.2 pF steps
Maximum setting
(1)
C
TX
—
—
-2
—
—
—
—
—
—
0
+13
—
dBm
dBm
dB
P
TX
Output Power
—
+13
—
Typical control range
1
Power control step
P
SP
Spurious Emission
Phase Noise
—
-45
-76
-92
—
dBc
Excluding harmonics
—
dBc/Hz 100
kHz from carrier
dBc/Hz 1
MHz from carrier
L
OUT
—
7.5-j50.9
At 315 MHz
Z
OUT
RF Output Impedance
(2)
6.0-j32.2
—
At 433 MHz
—
—
60
—
—
—
115.2
57.6
—
kbps
kbps
dB
NRZ
DR
Modulation Data Rate
Modulation Depth
0
Manchester encoded
h
MOD
—
0.1
7
—
SR
VDD
V
DD
Slew Rate
—
V/ms
pF
For proper POR operation
Selectable with 0.5 pF steps
—
C
XT
R
XT
Crystal Load Capacitor
Crystal Loss Resistance
22.5
80
—
Note 1:
Valid with optimum matching circuit at
T
OP
= 27°C and V
DD
= 2.7V to 3.3V
2:
The RF output impedance varies with the operating frequency, the output power setting P
TX
(which is not
necessarily equal to the actual output power) and the output tuning capacitance setting C
TX
. The values
given: P
TX
= +10 dBm and C
TX
= 0 p
F
.
TABLE 5-5:
Symbol
TIMING CHARACTERISTICS
Parameter
Min
Typ
Max
Unit
Conditions/Notes
t
DP
t
WK
t
CL
POR Delay Time
Wake-up Time
Calibration Time
—
—
—
—
—
—
20
3
ms
ms
ms
—
Without calibration
—
2
DS50002416A-page 24
Preliminary
2015 Microchip Technology Inc.
MICRF114
TABLE 5-6:
Symbol
MCU INTERFACE TIMING
Parameter
Min
Typ
Max
Unit
Conditions/Notes
(1)
t
CHI
t
CLO
t
CS
t
CH
t
DHI
t
DS
t
DH
t
FI
Clock High Time
Clock Low Time
30
30
15
15
100
15
15
—
—
—
—
—
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
V
SCK
> V
IH
(1)
V
SCK
< V
IL
Clock Setup Time
Clock Hold Time
Data High Time
—
Before and after start or stop edge
—
—
Between stop and start edges
Data Setup Time
Data Hold Time
—
—
—
—
Input Signal Fall Time
Input Signal Rise Time
500
500
Between V
IL
and V
IH
t
RI
—
Note 1:
For the definition of V
IL
and V
IH
see
T
a
ble 5-3
.
FIGURE 5-1:
MCU INTERFACE TIMING
SDI
t
DHI
SCK
t
DS
t
DH
t
CHI
t
CLO
t
CH
t
CH
t
CS
t
CS
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 25
MICRF114
NOTES:
DS50002416A-page 26
Preliminary
2015 Microchip Technology Inc.
MICRF114
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
Example
6-Lead SOT-23
F1145
03XYZ
Legend:
XX…X Customer-specific
information
Y
Y
e
ar code (last digit of calendar year)
YY
WW
NNN
Y
e
ar code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e
3
Note
: In
the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 27
MICRF114
6.2
Package Details
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)ꢕ*+
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DS50002416A-page 28
Preliminary
2015 Microchip Technology Inc.
MICRF114
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 29
MICRF114
APPENDIX A:
REVISION HISTORY
Revision A (September 2015)
This is the initial released version of the document.
DS50002416A-page 30
Preliminary
2015 Microchip Technology Inc.
MICRF114
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
www.microchip.com
. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Distributor
or Representative
• Local
Sales Office
• Field
Application Engineer (FAE)
•
T
e
chnical
Support
•
Product Support
– Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
•
General Technical Support
– Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
•
Business of Microchip
– Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
www.microchip.com
. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 31
MICRF114
PRODUCT IDENTIFICATION SYSTEM
To
o
rder or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office.
[X]
(1)
PART NO.
Device
X
/XX
–
Example:
MICRF114T-I/O
T
: T
a
pe
and Reel,
Tape and Reel
Option
Temperature Package
Range
Industrial temperature,
6LD SOT-23 package
Device:
MICRF114: Low-Power
Integrated Sub-GHz Wireless RF
Transmitter
Tape and Reel
Option:
T
=
T
a
pe
and Reel
Note 1:
T
a
pe and Reel identifier only appears in the
catalog part number description. This
Temperature
Range:
I
= -40
C to +85
C(Industrial)
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the
T
a
pe and Reel option.
Package:
OT
=
6-Lead Plastic
Small Outline Transistor Package
(SOT-23)
DS50002416A-page 32
Preliminary
2015 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALIT
Y
,
P
ERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE
.
Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, K
EE
L
OQ
, K
EE
L
OQ
logo, Kleer,
LANCheck, MediaLB, MOS
T
,
M
OST logo, MPLAB,
OptoLyzer, PIC, PICSTAR
T
,
P
IC
32
logo, Right
T
o
uch, SpyNIC,
SS
T
,
S
ST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip
T
e
chnology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and m
T
o
uch are
registered trademarks of Microchip
T
e
chnology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKI
T
,
c
hipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICS
P
,
I
nter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MP
F
,
M
PLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, Right
T
o
uch logo, REAL ICE, SQI, Serial Quad I/O,
T
o
tal Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip
T
e
chnology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip
T
e
chnology Incorporated
in the U.S.A.
Silicon Storage
T
e
chnology is a registered trademark of
Microchip
T
e
chnology Inc. in other countries.
GestIC is a registered trademark of Microchip
T
e
chnology
Germany II GmbH & Co. K
G
, a
s
ubsidiary of Microchip
T
e
chnology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip
T
e
chnology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63277-792-8
QUALITY
ꢀ
MANAGEMENT
ꢀꢀ
SYSTEM
ꢀ
CERTIFIED
ꢀ
BY
ꢀ
DNV
ꢀ
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
T
e
mpe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
®
MCUs and dsPIC
®
DSCs, K
EE
L
OQ
®
code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
==
ISO/TS
ꢀ
16949
ꢀ
==
ꢀ
2015 Microchip Technology Inc.
Preliminary
DS50002416A-page 33
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
T
e
l: 480-792-7200
Fax: 480-792-7277
T
e
chnical Support:
Asia Pacific Office
China – Xiamen
T
e
l: 86-592-2388138
Fax: 86-592-2388130
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T
e
l: 43-7242-2244-39
Fax: 43-7242-2244-393
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o
wer 6, The Gateway
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T
e
l: 86-756-3210040
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e
l: 45-4450-2828
Fax: 45-4485-2829
Hong Kong
T
e
l: 852-2943-5100
Fax: 852-2401-3431
India – Bangalore
T
e
l: 91-80-3090-4444
Fax: 91-80-3090-4123
France – Paris
T
e
l: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Australia – Sydney
T
e
l: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
India – New Delhi
T
e
l: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany – Dusseldorf
T
e
l: 49-2129-3766400
Atlanta
Duluth, GA
T
e
l: 678-957-9614
Fax: 678-957-1455
China – Beijing
T
e
l: 86-10-8569-7000
Fax: 86-10-8528-2104
Germany – Karlsruhe
T
e
l: 49-721-625370
India – Pune
T
e
l: 91-20-3019-1500
China – Chengdu
T
e
l: 86-28-8665-5511
Fax: 86-28-8665-7889
Germany – Munich
T
e
l: 49-89-627-144-0
Fax: 49-89-627-144-44
Austin, TX
T
e
l: 512-257-3370
Japan – Osaka
T
e
l: 81-6-6152-7160
Fax: 81-6-6152-9310
Boston
China – Chongqing
T
e
l: 86-23-8980-9588
Fax: 86-23-8980-9500
Italy – Milan
T
e
l: 39-0331-742611
Fax: 39-0331-466781
Westborough, MA
T
e
l: 774-760-0087
Fax: 774-760-0088
Japan – Tokyo
T
e
l: 81-3-6880- 3770
Fax: 81-3-6880-3771
China – Dongguan
T
e
l: 86-769-8702-9880
Italy – Venice
T
e
l: 39-049-7625286
Chicago
Itasca, IL
T
e
l: 630-285-0071
Fax: 630-285-0075
Korea – Daegu
T
e
l: 82-53-744-4301
Fax: 82-53-744-4302
China – Hangzhou
T
e
l: 86-571-8792-8115
Fax: 86-571-8792-8116
Netherlands – Drunen
T
e
l: 31-416-690399
Fax: 31-416-690340
Korea – Seoul
Cleveland
T
e
l: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China – Hong Kong SAR
T
e
l: 852-2943-5100
Fax: 852-2401-3431
Poland – Warsaw
T
e
l: 48-22-3325737
Independence, OH
T
e
l: 216-447-0464
Fax: 216-447-0643
Spain – Madrid
T
e
l: 34-91-708-08-90
Fax: 34-91-708-08-91
China – Nanjing
T
e
l: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia – Kuala Lumpur
T
e
l: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
T
e
l: 972-818-7423
Fax: 972-818-2924
Sweden – Stockholm
T
e
l: 46-8-5090-4654
China – Qingdao
T
e
l: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia – Penang
T
e
l: 60-4-227-8870
Fax: 60-4-227-4068
Detroit
Novi, MI
UK – Wokingham
T
e
l: 44-118-921-5800
China – Shanghai
T
e
l: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines – Manila
T
e
l: 63-2-634-9065
Fax: 63-2-634-9069
T
e
l: 248-848-4000
Fax: 44-118-921-5820
Houston, TX
T
e
l: 281-894-5983
China – Shenyang
T
e
l: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
T
e
l: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
T
e
l: 317-773-8323
Fax: 317-773-5453
China – Shenzhen
T
e
l: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan – Hsin Chu
T
e
l: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
Mission Viejo, CA
T
e
l: 949-462-9523
Fax: 949-462-9608
China – Wuhan
T
e
l: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan – Kaohsiung
T
e
l: 886-7-213-7828
Taiwan – Taipei
T
e
l: 886-2-2508-8600
Fax: 886-2-2508-0102
New York, NY
T
e
l: 631-435-6000
China – Xian
T
e
l: 86-29-8833-7252
Fax: 86-29-8833-7256
San Jose, CA
T
e
l: 408-735-9110
Thailand – Bangkok
T
e
l: 66-2-694-1351
Fax: 66-2-694-1350
Canada – Toronto
T
e
l: 905-673-0699
Fax: 905-673-6509
07/14/15
DS50002416A-page 34
2015 Microchip Technology Inc.
