Microchip-Tech-RN4870-V-RM140
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RN4870/71
Bluetooth
®
Low Energy Module
Features
• Qualified
for Bluetooth SIG v5.0 Core Specification
• Certified
to FCC, ISED, CE, KCC, NCC and SRRC
• On-Board
Bluetooth Low Energy (BLE) Stack
• ASCII
Command Interface API Over UART
• Scripting
Engine for Hostless Operation
• Compact
Form Factor – The RN4870/71 family
comes in four different sizes, from 6 mm x 8 mm
to 12 mm x 22 mm:
– RN4870:
12 mm x 22 mm
– RN4871:
9 mm x 11.5 mm
– RN4870U:
12 mm x 15 mm
– RN4871U:
6 mm x 8 mm
• Beacon
Private Service for Beacon Services
• UART
Transparent Service for Serial Data
Applications
• Remote
Configuration Over-the-Air
Operational
• Operating
Voltage: 1.9V to 3.6V (3.3V typical)
•
T
e
mperature
Range:
– -20°C
to +70°C (Normal)
– -40°C
to +85°C (Industrial)
• Supports
UART
• Up
to Three Pulse-Width Modulation (PWM)
Outputs (only for RN4870)
Antenna Options
• Chip
Antenna Range based on Open Air
Measurements and Phone Module Connection:
RF/Analog Features
– RN4870:
Up to 50m
– RN4871:
Up to 10m
• ISM
Band 2.402 to 2.480 GHz Operation
• Channels:
0-39
• External
Antenna Connection via RF Pad
(RN4870U/RN4871U)
• RX
Sensitivity: -90 dBm
• TX
Power: 0 dBm
• RSSI
Monitor
Applications
MAC/Baseband/Higher Layer Features
• Health/Medical
Devices
• Sports
Activity/Fitness Meters
• Beacon
Applications
• Secure
AES128 Encryption
• GA
P
,
G
ATT, SM, L2CAP and Integrated Public
Profiles
• Customer
Can Create up to Five Public and Four
Private Services
• Software
Configurable Role as Peripheral or
Central and Client or Server
• Internet
of Things (IoT) Sensor
T
a
g
• Remote
Control
• Wearable
Smart Devices and Accessories
• Smart
Energy/Smart Home
• Industrial
Control
2016-2023 Microchip Technology Inc.
DS50002489G-page 1
RN4870/71
Table of Contents
1.0 Device Overview ………………………………………………………………………………………………………………………………………………………… 3
2.0 Specification
s
.
………………………………………………………………………………………………………………………………………………………….. 11
3.0 Interface Pins …………………………………………………………………………………………………………………………………………………………… 13
4.0 Physical Dimensions and Attributes…………………………………………………………………………………………………………………………….. 15
5.0 Application Reference Circuit
s
.
…………………………………………………………………………………………………………………………………… 25
6.0 ASCII Command API ………………………………………………………………………………………………………………………………………………… 29
7.0 Supported Services…………………………………………………………………………………………………………………………………………………… 31
8.0 Antenna Characteristic
s
.
……………………………………………………………………………………………………………………………………………. 33
9.0 Timing Characteristics……………………………………………………………………………………………………………………………………………….. 35
10.0 Ordering Information ……………………………………………………………………………………………………………………………………………….. 37
11.0 Regulatory Approval………………………………………………………………………………………………………………………………………………… 39
Appendix A: Revision History……………………………………………………………………………………………………………………………………………
46
The Microchip Website …………………………………………………………………………………………………………………………………………………… 48
Customer Change Notification Service
…………………………………………………………………………………………………………………………….. 48
Customer Support …………………………………………………………………………………………………………………………………………………………. 48
Product Identification System ………………………………………………………………………………………………………………………………………….. 50
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products.
T
o
t
his end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
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Most Current Data Sheet
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o
btain the most up-to-date version of this data sheet, please register at our Worldwide Website at:
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o
u can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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DS50002489G-page 2
2016-2023 Microchip Technology Inc.
RN4870/71
T
a
ble 1-1
shows the various options for packaging and
features available in the RN4870/71 family.
T
a
ble 1-2
provides the description of the pin functions for all the
modules in the RN4870/71 family.
Figure 1-1
through
Figure 1-4
show the pinouts for the different modules.
1.0
1.1
DEVICE OVERVIEW
Overview
The RN4870/71 BLE module integrates Bluetooth 5.0
baseband controller, on-board Bluetooth stack, digital
and analog I/Os and RF power amplifier into one
solution.
TABLE 1-1:
RN4870/71 FAMILY
On-Board
Number of
Operating
Temperature Range
Part Number
(
1
)
Shielding
Dimensions
Antenna
Pins
RN4870-V/RMXXX
RN4870U-V/RMXXX
RN4871-V/RMXXX
RN4871U-V/RMXXX
RN4870-I/RMXXX
RN4871-I/RMXXX
Y
e
s
No
Yes
No
33
30
16
17
33
16
12 mm x 22 mm
12 mm x 15 mm
9 mm x 11.5 mm
6 mm x 8 mm
-20°C to +70°C
-20°C to +70°C
-20°C to +70°C
-20°C to +70°C
-40°C to +85°C
-40°C to +85°C
Y
e
s
No
Yes
No
Yes
Yes
Y
e
s
Y
e
s
12 mm x 22 mm
9 mm x 11.5 mm
Note 1:
The last three digits in P/N indicate the firmware version. At the time of publication, the latest firmware
version is 1.28. Ensure to check the product webpage for the latest part number and firmware version.
TABLE 1-2:
PIN DESCRIPTION
RN4870U RN4870 RN4871U RN4871
Name
Type
Description
—
—
1
1
2
—
—
12
11
10
—
—
13
14
—
GND
GND
Power Ground
reference.
Power Ground
reference.
Power Ground
reference.
3
GND
2
4
VBAT
BK_IN
Power Positive
supply input. Range: 1.9V ~ 3.6
V
.
—
—
Power Buck
power supply input,
Can be connected to the VBAT pin,
Connect to 10 µF low-ESR ceramic capacitor,
Voltage range: 1.9V to 3.6V.
3
4
5
6
5
6
7
8
—
—
—
—
—
—
—
—
P2_2
D I/O
GPIO,
PWM1 (only for RN4870),
Default: Input; pulled high.
VDD_IO Power
I/O positive supply. Do not connect.
Ensure VDD_IO and MCU I/O voltage are
compatible.
VDD_IO Power
I/O positive supply. Do not connect.
Ensure VDD_IO and MCU I/O voltage are
compatible.
ULPC_O Power
1.2V ULPC LDO output,
Used for diagnostic purposes,
Do not connect
to any pin or device,
For measurement, connect a bypass 1 µF
capacitor to ground.
7
8
9
—
—
—
—
P2_3
D I/O
GPIO,
PWM2 (only for RN4870),
Default: Input; pulled high.
10
BK_O
Power 1.55V
Buck power supply output for diagnostic
purpose.
Do not connect.
Legend:
Pin Type Abbreviations:
A = Analog
D = Digital
I/O = Input/Output
I/p = Input
O/p = Output
2016-2023 Microchip Technology Inc.
DS50002489G-page 3
RN4870/71
TABLE 1-2:
PIN DESCRIPTION (CONTINUED)
RN4870U RN4870 RN4871U RN4871
Name
Type
Description
—
—
13
6
P1_6
D
Configurable pin. Refer to
Section 1.2 “Module
Configuration”
for details. When connected to host
MCU, set the pin connected to pin P1_6 in either
high-impedance or drive pin low during firmware
start-up (approximately 22 msec).
—
9
—
11
14
15
5
P1_7
P2_7
D
Configurable pin. Refer to
Section 1.2 “Module
Configuration”
for details.
15
D O/p
UART_TX_IND output pin. Provides indication if
RN4870 is transmitting to host MCU over UAR
T
.
Pulled low before UART TX begins and pulled high
after UART TX is over.
10
12
—
—
P1_1
D I/O
GPIO; default: Input; pulled high,
A I/p
AD9,
Configured as the BLEDK_STATUS1_IND pin by
default.
11
12
13
13
14
15
2
3
8
3
4
P1_2
P1_3
P0_0
D I/O
GPIO; default: Input; pulled high,
A I/p
AD10; I
2
C SCL pin.
D I/O
GPIO; default: Input; pulled high,
AD11; I
2
C SDA pin.
11
D I/O
GPIO; default: Input; pulled high,
AD0,
Configured as the UART_CTS pin by default.
14
16
—
—
P1_0
D I/O
GPIO; default: Input; pulled high,
AD8,
Configured as the BLEDK_STATUS2_IND pin by
default.
15
16
17
18
6
9
P3_6
P2_0
D I/O
GPIO; default: Input; pulled high (only for RN4870),
Configured as the UART_RTS pin by default.
16
16
D I/p
System configuration input;
1
: Application mode
0
:
T
e
st mode/Flash update/EEPROM configuration
Default: Input; pulled high.
17
18
19
20
21
22
19
20
21
22
23
24
—
—
7
—
—
10
7
P2_4
NC
D I/O
GPIO; default: Input; pulled high.
—
No connection.
RST_N
D I/p
Module Reset; active-low; Internally pulled high.
5
UART_RX D
I/p UART
data input.
UART_TX D
O/p UART
data output.
4
8
—
—
P3_1
P3_2
P3_3
P3_4
D I/O
GPIO; default: Input; pulled high,
Configured as RSSI_IND pin by default;
SPI NCS Bus.
23
24
25
25
26
27
—
—
—
—
—
—
D I/p
GPIO; default: Input; pulled high,
Configured as the LINK_DROP pin by default;
SPI MISO pin.
D I/p
GPIO; default: Input; pulled high,
Configured as the UART RX indication pin by default;
SPI MOSI pin.
D I/p
GPIO; default: Input; pulled high,
Configured as the PAIRING_KEY pin by default;
SPI SCLK pin.
Legend:
Pin Type Abbreviations:
A = Analog
D = Digital
I/O = Input/Output
I/p = Input
O/p = Output
DS50002489G-page 4
2016-2023 Microchip Technology Inc.
RN4870/71
TABLE 1-2:
PIN DESCRIPTION (CONTINUED)
RN4870U RN4870 RN4871U RN4871
Name
Type
Description
26
27
28
28
29
30
—
—
9
—
—
12
P3_5
D I/O
GPIO; default: Input; pulled high,
A I/p
LED1; provides indication whether the module is
on/off.
P0_7
P0_2
D I/O
GPIO; default: Input; pulled high,
Configured to the LOW_BATTERY_INDICATOR pin
by default.
D I/O
AD2,
LED0: Provides indication whether the module is in
On/Off mode.
29
—
30
31
32
—
17
—
1
2
GND
GND
Power Ground
reference.
Power Ground
reference.
—
—
BT_RF
A I/O
External antenna connection (50 Ohms). Only for
RN4870U and RN4871U. No connection for RN4871.
—
33
—
—
GND
Power Ground
reference.
Legend:
Pin Type Abbreviations:
A = Analog
D = Digital
I/O = Input/Output
I/p = Input
O/p = Output
FIGURE 1-1:
PIN DIAGRAM – RN4870U
Top View
Bottom View
GND
VBAT
1
1
2
30 BT_RF
30
TP-3 VCC_RF
TP-1 VCC_PA
TP-3
P2_2
GND
3
4
5
6
7
8
9
29
28
27
26
25
24
TP-1
VDD_IO
VDD_IO
P0_2/LED
P0_7
ULPC_O
P2_3
P3_5
P3_4
BK_O
P3_3
P2_7/TX_IND
23 P3_2
TP-2
TP-2 CLDO_O
P1_1
10
P1_2 11
P1_3 12
P3_1
22
21
UART_TX
UART_RX
20
2016-2023 Microchip Technology Inc.
DS50002489G-page 5
RN4870/71
FIGURE 1-2:
PIN DIAGRAM – RN4870
Top View
Bottom View
1
2
GND
GND
GND
33
33
1
32 GND
GND
VBAT
3
4
5
6
7
8
9
TP-3 VCC_RF
TP-1 VCC_PA
TP-3
P2_2
31 GND
TP-1
VDD_IO
VDD_IO
ULPC_O
P2_3
30 P0_2/LED
29 P0_7
28 P3_5
27 P3_4
BK_O 10
26
P3_3
P2_7/TX_IND 11
P1_1 12
25 P3_2
TP-2
TP-2 CLDO_O
24 P3_1
13
P1_2
23 UART_TX
22 UART_RX
P1_3 14
FIGURE 1-3:
PIN DIAGRAM – RN4871U
Bottom View
Top View
1
UART_RX 5
17
17 GND
TP-1
TP-2 TP-4
TP-1 CLDO_O
P3_6
6
RST_N 7
P0_0 8
P2_0
16
TP-4 ULPC_O
TP-5 BK_O
VCC_RF TP-2
VCC_PA TP-3
15 P2_7
14 P1_7
TP-5
9
P0_2
TP-3
DS50002489G-page 6
2016-2023 Microchip Technology Inc.
RN4870/71
FIGURE 1-4:
PIN DIAGRAM – RN4871
7RSꢉ9LHZ
%RWWRPꢉ9LHZ
1&
ꢃ
16
ꢃꢄ 3ꢇBꢋ
ꢃꢁ 3ꢇBꢅ
ꢃꢀ 9%$7
ꢃꢂ *1′
ꢃꢇ 3ꢋBꢇ
TP-3
TP-2
TP-4
TP-5
73ꢊꢂꢉ9&&B3$
73ꢊꢇꢉ9&&B5)
73ꢊꢀꢉ8/3&B2
*1′ ꢇ
3ꢃBꢇ ꢂ
3ꢃBꢂ ꢀ
3ꢃBꢅ ꢁ
%.B2ꢉ73ꢊꢃ
TP-1
&/’2B2ꢉ73ꢊꢁ
2016-2023 Microchip Technology Inc.
DS50002489G-page 7
RN4870/71
T
a
ble 1-5
shows the status of the module as indicated
by the Status 1 and Status 2 indication pins.
T
a
ble 1-6
shows the details of test pads that are present on the
bottom side of the module, used for diagnostic
purposes during testing.
Figure 1-5
shows all the key
elements of the module.
1.2
Module Configuration
The GPIO pins of the RN4870 and RN4871 modules
can be configured for different functions using the
ASCII command interface.
T
a
ble 1-3
shows the various
pins in the RN4870/71 module that are available for
configuration and their default configuration settings.
T
a
ble 1-4
provides details on each available function.
TABLE 1-3:
Pin Name
P0_7
CONFIGURABLE PINS AND DEFAULT FUNCTIONS IN THE RN4870 AND RN4871
Available in
Default Function
RN4870
RN4871
x
x
—
—
—
—
—
—
—
—
—
—
x
Low Battery Indication
Status 2
P1_0
P1_1
P2_2
P2_4
P3_1
P3_2
P3_3
P3_4
P3_5
P1_2
P1_3
P1_6
P1_7
x
Status 1
x
None
x
None
x
RSSI Indication
Link Drop
UART RX Indication
Pairing Key
None
x
x
x
x
x
None
x
x
None
—
—
x
UART RX Indication
None
x
TABLE 1-4:
CONFIGURABLE FUNCTIONS AND DESCRIPTIONS
Function Name
Description
Low Battery Indication
Pin output goes low when the V
DD
is below a specified level.
T
o
s
et the threshold
level, change the EEPROM settings.
Status 1
Use this indication pin along with the Status 2 pin to indicate the current status of
the module. Refer to
T
a
ble 1-5
for details of the status indication.
Status 2
Use this indication pin along with the Status 1 pin to indicate the current status of
the module. Refer to
T
a
ble 1-5
for details of the status indication.
RSSI Indication
Use this indication pin to indicate the quality of the link based on the RSSI level.
If the RSSI level is lower than the specified threshold value, then the RSSI
indication pin goes low. Set the threshold for the RSSI link quality in EEPROM.
Link Drop
When the RN4870/71 is connected to a remote device, the host MCU can use
the Link Drop pin to force the module to disconnect the link and enter Shutdown
state. The pin needs to be pulled low for at least 10 ms.
UART RX Indication
Use this pin to enable communication with the UART when the module is in Low-
Power mode. When
not
in Low-Power mode, the module runs on a 16 MHz
clock. If Low-Power mode is enabled on the module by using the command,
SO,1
, the module runs on a 32 kHz clock, thus reducing power consumption.
However, in Low-Power mode, the host MCU
cannot
communicate with the
module via the UART since the UART is
not
operational. If the user intends to
provide data or commands via UART in the Low-Power mode, then the UART
RX Indication pin must be pulled low and the user needs to wait for at least five
milliseconds before sending the data. Pulling the UART RX Indication pin low
allows the module to operate the 16 MHz clock and to enable UAR
T
.
DS50002489G-page 8
2016-2023 Microchip Technology Inc.
RN4870/71
TABLE 1-4:
CONFIGURABLE FUNCTIONS AND DESCRIPTIONS (CONTINUED)
Function Name
Description
Pairing Key
When the RN4870/71 is connected to a remote device, the host MCU can use
the Pairing Key pin to force the module to disconnect the link and go back to
Standby state. The pin must be pulled down for at least 160 ms.
RF Active Indication
Use this indication pin to indicate that the module is currently performing an
active transmission and receiving BLE data.
TABLE 1-5:
STATUS INDICATION PINS
Status 1
Status 2
State
High
High
Low
Low
High
Low
Low
High
Power-on
Standby state
Connection established
Data session open (Transparent UART)
TABLE 1-6:
RN4870U
TEST POINTS ON THE BOTTOM SIDE
RN4870
RN4871U
RN4871
Symbol
Description
TP-1
TP-2
TP-3
—
TP-1
TP-2
TP-3
—
TP-3
TP-1
TP-2
TP-4
TP-5
TP-3
TP-5
TP-2
TP-4
TP-1
VCC_PA
1.55V RF PA LDO
CLDO_O 1.2V
CLDO Output
VCC_RF
ULPC_O
BK_O
1.2V RF LDO Output
1.2V ULPC LDO Output
1.55V Buck Reg Output
—
—
FIGURE 1-5:
BLOCK DIAGRAM OF THE RN4870/71
RN4870/RN4871
Antenna
SPI
Host
Controller
(Ext. MCU)
Matching
UART
BT_RF
8051 (16 MHz)
®
Bluetooth
BLE
2
I C
Baseband
32 KB ROM
and RF
32 MHz
Crystal
IOT
Peripheral
Device
PWM
24 KB SRAM
Flash 256 KB
ADC-12b
DMA, WD
T
,
NMI, IRQ
Event
Counter
PMU/MM
Peripherals
Band Gap
AES 128
MCU
T
e
mp.
Sensor
LDOs
512B
Ret-RAM
32 kHz
ROSC
POR
RTC
VBAT
BAT
DC-DC
Detect
Converter
GPIO PORT
0 ~ 3
LDO
*
Always On (AON)
*GPIO Pad on Module
MCU/GPIO/LED
2016-2023 Microchip Technology Inc.
DS50002489G-page 9
RN4870/71
NOTES:
DS50002489G-page 10
2016-2023 Microchip Technology Inc.
RN4870/71
2.0
SPECIFICATIONS
T
a
ble 2-1
provides the general specifications for the
module.
T
a
ble 2-2
,
T
a
ble 2-3
and
T
a
ble 2-4
provide the
electrical characteristics and the current consumption
of the module.
TABLE 2-1:
GENERAL SPECIFICATIONS
Specification
Description
Standard Compliance
Bluetooth
®
5.0
Frequency Band
2.402 to 2.480 GHz
GFSK
Modulation Method
Maximum Data Rate (Transparent UART)
10 kbps (iOS
®
9)
Antenna
Ceramic
Interface
UAR
T
,
A
IO, PIO
1.9V to 3.6V
-90 dBm
Operating Range
Sensitivity
RF TX Power
0 dBm
Operating
T
e
mperature Range for RN4870-I and RN4871-I Modules
Operating
T
e
mperature Range for RN4870-V and RN4871-V Modules
Storage
T
e
mperature Range
-40°C to +85°C
-20°C to +70°C
-40°C to +125°C
10% to 90%
10% to 90%
2
Operating Relative Humidity Range
Storage Relative Humidity Range
Moisture Sensitivity Level
TABLE 2-2:
ELECTRICAL CHARACTERISTICS
Parameter
Min.
Typ.
Max.
Units
Supply Voltage (V
DD
)
I/O Voltage Levels
1.9
—
3.6
V
V
IL
Input Logic Levels Low
V
IH
Input Logic Levels High
V
OL
Output Logic Levels Low
V
OH
Output Logic Levels High
Reset
V
SS
0.7 V
DD
V
SS
—
—
—
—
0.3 V
DD
V
DD
V
V
V
V
0.2 V
DD
V
DD
0.8 V
DD
Reset Low Duration
63
—
—
ns
Input and Tri-State Current with
Pull-up Resistance
34
29
48
47
74
86
k
k
Pull-Down Resistance
2016-2023 Microchip Technology Inc.
DS50002489G-page 11
RN4870/71
(
1
)
TABLE 2-3:
CURRENT CONSUMPTION
Parameter
Min.
Typ.
Max.
Units
Supply Current
TX Mode Peak Current at V
DD
= 3V, TX = 0 dBm, Buck Mode
RX Mode Peak Current at V
DD
= 3V, Buck Mode
Low-Power Mode Current
(
2
)
—
—
—
1
10 at +25°C
13 at +75°C/+85°C
10 at +25°C
13 at +75°C/+85°C
mA
mA
µA
60 at +25°C
—
—
Shutdown Low-Power Mode
2.9
µA
Note 1:
The current measurements are characterized across a sample of the RN4870/71 module at room
temperature (+25°C), unless otherwise noted.
2:
For more details on Low-Power mode, refer to the
“RN4870/71 Bluetooth
®
Low Energy Module User’s
Guide”
(DS50002466).
TABLE 2-4:
CURRENT CONSUMPTION DURING APPLICATION MODE
Interval
Test Mode
Average Current Consumption
(ms)
20
50
1.061 mA
505 µA
298 µA
113 µA
89 µA
Advertising
(
1
,
2
,
3
)
100
500
1000
18.75
50
2.23 mA
2.13 mA
2.10 mA
83 µA
Connected
(
1
,
2
,
4
)
100
500
1000
80 µA
Note 1:
These measurements are done at an operating temperature of +25°C at 3.3V and are characterized
across a sample of the RN4870/71 module.
2:
Measurements taken with Version 1.18 firmware loaded onto the module.
3:
The advertising packet data payload is approximately 15 bytes in length.
4:
The amount of data being transmitted between two peer devices can affect the average current measured.
The average current measurements are done with only the necessary Bluetooth
®
packets being
exchanged to keep the connection active at the stated interval.
DS50002489G-page 12
2016-2023 Microchip Technology Inc.
RN4870/71
Figure 3-1
also shows the basic UART connections to
the host MCU.
3.0
INTERFACE PINS
Figure 3-1
shows the power scheme using a 3.3V
low-dropout regulator to the RN487X and a host MCU.
This scheme ensures that the same voltage is used for
both the module and the MCU.
Figure 3-2
shows the recommended connections for
running the RN4870/71 on a coin cell battery.
FIGURE 3-1:
POWER SCHEME
RN4870/71/70U
Reset IC
Note 1:
Ensure VDD_IO and MCU V
DD
voltages are compatible.
2:
Control and Indication ports are configurable.
3:
T
o
i
mplement low-power operation, enable the UART_RX_IND
pin and connect to ground.
System Configurator
RN4871U
Reset IC
Reset
Note 1:
Ensure VDD_IO and MCU V
DD
voltages are compatible.
2:
Control and Indication ports are configurable.
3:
10 µF (X5R) and 330 Ohm resistor are required for RN487X.
4:
BK_IN connects to VBAT for RN4871U.
System Configurator
5:
T
o
i
mplement low-power operation, enable the UART_RX_IND
pin and connect to ground.
2016-2023 Microchip Technology Inc.
DS50002489G-page 13
RN4870/71
FIGURE 3-2:
RN4870/71 COIN CELL POWER SCHEME
RN4870/71
Reset IC
Reset
Note 1:
Application includes ADC, PWM (RN4870) and I
2
C bus interface.
2:
BK_IN connection is needed only for RN4871U.
3:
T
o
i
mplement low-power operation, enable the UART_RX_IND pin and connect to ground.
The Configuration pins on the RN4870 can also be
configured through a Windows
®
based User Interface
(UI) configuration tool, BLEDK3.
DS50002489G-page 14
2016-2023 Microchip Technology Inc.
RN4870/71
areas under the antenna must
not
contain any top,
inner layer or bottom copper, as shown in
Figure 4-3
. A
low-impedance ground plane ensures the best radio
performance (best range, lowest noise).
Figure 4-3
also shows a minimum ground plane area to the left
and right side of the module for best antenna
performance. The ground plane can be extended
beyond the minimum recommended as required for
host PCB EMC noise reduction. For best range
performance, keep all external metal at least 30 mm
away from the ceramic chip antenna.
4.0
4.1
PHYSICAL DIMENSIONS AND
ATTRIBUTES
RN4870 Module
Figure 4-1
shows the physical dimensions of the RN4870
module.
Figure 4-2
illustrates the recommended PCB
layout and
Figure 4-3
shows the recommended
mounting details.
Ensure that there is
no
top copper layer near the test
pin area, indicated by the shaded
keep out areas
, as
shown in
Figure 4-2
. When laying out the host PCB, the
FIGURE 4-1:
RN4870 MODULE DIMENSIONS
2016-2023 Microchip Technology Inc.
DS50002489G-page 15
RN4870/71
FIGURE 4-2:
RN4870 RECOMMENDED PCB FOOTPRINT
FIGURE 4-3:
RECOMMENDED MOUNTING DETAILS
DS50002489G-page 16
2016-2023 Microchip Technology Inc.
RN4870/71
external antenna, such as a PCB trace antenna, a com-
ponent (chip) antenna or through a host PCB 50 Ohm
microstrip trace. This trace can be extended to include
passive parts for antenna attenuation padding,
impedance matching or to provide test posts. It is recom-
mended that the microstrip trace be as short as possible
for minimum loss and best impedance matching. If the
microstrip trace is longer, a 50 Ohm impedance is
recommended.
4.2
RN4870U Module
Figure 4-4
shows the physical dimensions of the
RN4870U module.
Figure 4-5
illustrates the
recommended PCB layout and
Figure 4-6
shows the
recommended mounting details.
A low-impedance ground plane ensures the best radio
performance (best range, lowest noise). Pin 30 (BT_RF)
is a 50 Ohm connection that can be connected to an
FIGURE 4-4:
RN4870U MODULE DIMENSIONS
2016-2023 Microchip Technology Inc.
DS50002489G-page 17
RN4870/71
FIGURE 4-5:
RN4870U RECOMMENDED PCB FOOTPRINT
FIGURE 4-6:
RN4870U RECOMMENDED PCB MOUNTING
DS50002489G-page 18
2016-2023 Microchip Technology Inc.
RN4870/71
inner layer or bottom copper, as shown in
Figure 4-9
. A
low-impedance ground plane ensures the best radio
performance (best range, lowest noise).
Figure 4-9
also shows a space area around the antenna section
for best antenna performance. The ground plane can
be extended beyond the minimum recommended as
required for host PCB EMC noise reduction. For best
range performance, keep all external metal at least
30 mm away from the ceramic chip antenna.
4.3
RN4871 Module
Figure 4-7
shows the physical dimensions of the RN4871
module.
Figure 4-8
illustrates the recommended PCB
layout and
Figure 4-9
shows the recommended
mounting details.
Ensure that there is
no
top copper layer near the test
pin area, indicated by the shaded
keep out areas
, as
shown in
Figure 4-8
. When laying out the host PCB, the
areas under the antenna must
not
contain any top,
FIGURE 4-7:
RN4871 MODULE DIMENSIONS
Bottom View
Top View
Side View
11.5
11.5
11.14
9.54
Shield
mounting hole
7.5
6.7
7.5
6.7
7.18
6.7
16
1
16
TP-3
TP-2
TP-4
TP-5
TP-3
TP-2
TP-4
TP-5
6.01
4.85
5.5
4.3
3.1
1.9
5.5
4.3
3.1
1.9
4.75
4.11
3.68
TP-1
TP-1
1.2
2.38
0.0
Shield
mounting
0.70
0.00
hole
0.0
0.0
Shield
mounting hole
Test Point Positions
Pad Positions
1.0
Dimensions are in millimeters
ꢀ
Tolerances:
0.7
0.5
0.7
PCB
7KLFNQHVV
: +/-0.06mm
Pad Detail
2016-2023 Microchip Technology Inc.
DS50002489G-page 19
RN4870/71
FIGURE 4-8:
RN4871 RECOMMENDED PCB FOOTPRINT
Top View
11.5
Keep Out Area
0.5
1.5
7.0
7.5
6.7
5.5
4.6
4.3
0.7
3.1
1.9
1.2
1.5
Keep Out Area
0.0
Dimensions are in millimeters
FIGURE 4-9:
RN4871 RECOMMENDED PCB MOUNTING SUGGESTION
DS50002489G-page 20
2016-2023 Microchip Technology Inc.
RN4870/71
A low-impedance ground plane ensures the best radio
performance (best range, lowest noise). Pin 1 (BT_RF)
is a 50 Ohm connection that can be connected to an
external antenna, such as a PCB trace antenna, a
component (chip) antenna or through a host PCB
50 Ohm microstrip trace. This trace can be extended to
include passive parts for antenna attenuation padding,
impedance matching or to provide test posts. It is
recommended that the microstrip trace to be as short
as possible for minimum loss and best impedance
matching. If the microstrip trace is longer, a 50 Ohm
impedance is recommended.
4.4
RN4871U Module
Figure 4-10
shows the physical dimensions of the
RN4871U module.
Figure 4-11
illustrates the recom-
mended PCB layout. It is highly recommended to lay
out the host PCB as suggested in
Figure 4-12
.
Figure 4-13
shows the recommended placement for
the module on the host PCB board. For optimal
transmission and reception sensitivity, place the
module at the edge of the board.
FIGURE 4-10:
RN4871U MODULE DIMENSIONS
Side View
Top View
Bottom View
2016-2023 Microchip Technology Inc.
DS50002489G-page 21
RN4870/71
FIGURE 4-11:
RN4871U RECOMMENDED PCB FOOTPRINT
FIGURE 4-12:
RN4871U RECOMMENDED PCB MOUNTING
DS50002489G-page 22
2016-2023 Microchip Technology Inc.
RN4870/71
FIGURE 4-13:
RECOMMENDATIONS FOR PLACEMENT OF THE MODULE ON HOST PCB BOARD
Best
Acceptable
Acceptable
Lowest
Performance
4.5
Soldering Recommendations
The RN4870/71 Bluetooth module is assembled using
standard lead-free reflow profile, IPC/JEDEC J-STD-020.
The module can be soldered to the host PCB using
standard leaded and lead-free solder reflow profiles.
To
a
void damaging the module, the following
recommendations are given:
• Microchip
T
e
chnology Application Note,
AN233
“Solder Reflow Recommendation”
(DS00233)
provides solder reflow recommendations
• Do
not
exceed Peak
T
e
mperature (T
P
) of 250°C
• Refer
to the solder paste data sheet for specific
reflow profile recommendations
• Use
no-clean flux solder paste
• Do
not
wash as moisture can be trapped under
the shield
• Use
only one flow; if the PCB requires multiple
flows, apply the module on the final flow
2016-2023 Microchip Technology Inc.
DS50002489G-page 23
RN4870/71
NOTES:
DS50002489G-page 24
2016-2023 Microchip Technology Inc.
RN4870/71
5.2
Reference Circuit
5.0
5.1
APPLICATION REFERENCE
CIRCUITS
Figure 5-2
through
Figure 5-5
show the reference
circuits for various modules under the RN4870/71 family.
In the circuits, the power input range is 1.9V ~ 3.6V. A
battery reverse protection circuit is recommended in
case a battery power input is used. Note that the
VDD_IO is the same as the power input. In case of an
LED connection, the power input must be greater than
3.0
V
.
F
or the RN4870U, an RF antenna matching circuit
must also be included, as shown in
Figure 5-3
.
External Configuration and
Programming
The RN4870/71 module can be configured and firm-
ware programmed using an external configuration and
programming tool.
Figure 5-1
shows the mandatory
connections required between the module and the
external programming header. It is recommended to
include these pin connections on the host PCB for
development. For accessing the various configuration
and indication pins, use
T
a
ble 1-2
,
T
a
ble 1-3
,
T
a
ble 1-4
and
T
a
ble 1-5
.
FIGURE 5-1:
EXTERNAL PROGRAMMING HEADER CONFIGURATIONS
RN4870/71
1
1
1
1
1
P2_0
VBAT
RXD
TXD
P2_0
VBAT
RXD
TXD
GND
GND
2016-2023 Microchip Technology Inc.
DS50002489G-page 25
RN4870/71
FIGURE 5-2:
RN4870 REFERENCE CIRCUIT
1
2
33
32
GND
GND
GND
GND
Reverse Voltage Protection
Power Input
Q1
GND
J1
1
VCC
C1
GND
STS2301
3
4
5
6
7
LED Option
GND
VBAT
P2_2
VDD_IO
VDD_IO
ULPC_O
P2_3
BK_O
P2_7/TX_IND
P1_1
VCC
LD1
2
P2_2
31
30
29
28
27
26
25
24
23
22
GND
P0_2
P0_7
P3_5
P3_4
P3_3
P3_2
P3_1
R1
U1
RN4870
P0_2
P0_7
P3_5
P3_4
P3_3
P3_2
P3_1
P0_2
330
8
9
P2_3
GND
GND
GND
10
ȝ
F
6
.3
V
X
5R
10
11
12
13
14
P2_7
P1_1
P1_2
P1_3
Configurable I/O
P0_0
P2_4
P2_7
P3_1
P3_2
P3_3
P3_4
P3_5
P3_6
UART_TX
UART_RX
UART Interface
P0_7
P1_0
P1_1
P1_2
P1_3
P2_2
P2_3
P1_2/SCL
P1_3/SDA
UART_TX
UART_RX
Configuration Interface
P2_0
J2
VCC
VCC
1
2
3
4
5
R2
UART_RX
UART_TX
4.7k
U2
VCC
RST
1
V
OUT
VDD
V
SS
MCP111-195
3
2
GND
FIGURE 5-3:
RN4870U REFERENCE CIRCUIT
ANT1
Antenna Matching
Reverse Voltage Protection
Power Input
L1
Q1
1
n
H
C3
C4
J1
1
VCC
C1
GND
STS2301
1
2
3
4
5
6
7
8
9
30
GND
VBAT
P2_2
VDD_IO
VDD_IO
ULPC_O
P2_3
BK_O
P2_7/TX_IND
P1_1
BT_RF
2
P2_2
29
28
27
26
25
24
23
22
21
20
GND
P0_2
P0_7
P3_5
P3_4
P3_3
P3_2
P3_1
U1
RN4870U
P0_2
P0_7
P3_5
P3_4
P3_3
P3_2
P3_1
UART_TX
UART_RX
GND
GND
P2_3
GND
GND
GND
10
ȝ
F
6
.3
V
X
5R
LED Option
VCC
P2_7
P1_1
P1_2
P1_3
LD1
10
11
12
R1
P0_2
P1_2/SCL
P1_3/SDA
UART_TX
UART_RX
330
Configuration Interface
P2_0
UART Interface
Configurable I/O
J2
VCC
P0_0
P2_4
P2_7
P3_1
P3_2
P3_3
P3_4
P3_5
P3_6
VCC
1
2
3
4
5
P0_7
P1_0
P1_1
P1_2
P1_3
P2_2
P2_3
R2
UART_RX
UART_TX
4.7k
U2
VCC
3
RST
1
V
OUT
VDD
V
SS
MCP111-195
GND
2
DS50002489G-page 26
2016-2023 Microchip Technology Inc.
RN4870/71
FIGURE 5-4:
RN4871 REFERENCE CIRCUIT
Configuration Interface
P2_0
J2
GND
VCC
1
2
3
4
5
Reverse Voltage Protection
Power Input
UART_RX
UART_TX
Q1
P1_7
P1_6
UART_RX
UART_TX
5
6
7
8
16
15
14
13
P2_0
P2_7
P1_7
P1_6
UART_RX
UART_TX
P2_0
P2_7
VBAT
GND
VCC
U1
RN4871
J1
STS2301
1
2
C1
GND
UART Interface
VCC
R2
GND
GND
GND
GND
4.7k
Configurable I/O
10 μF
6.3V X5R
P0_0
P0_2
P1_2
P1_3
P1_6
P1_7
P2_0
P2_7
P3_6
U2
P2_0
Low
MODE
VCC
1
RST
V
OUT
3
VCC
LED Option
VDD
Test Mode
APP Mode
2
LD1
V
SS
MCP111-195
R1
P0_2
High
330
FIGURE 5-5:
RN4871U REFERENCE CIRCUIT
VCC
R2
VCC
Configuration Interface
4.7k
LED Option
P2_0
Low
MODE
P2_0
LD1
J2
Test Mode
APP Mode
R1
U2
VCC
P0_2
1
2
3
4
5
VCC
RST
1
2
V
OUT
330
3
High
VDD
UART_RX
UART_TX
V
SS
MCP111-195
Reverse Voltage Protection
Power Input
Q1
UART_RX
UART_TX
J1
VCC
C1
STS2301
GND
1
2
UART Interface
10
11
12
13
4
3
2
1
BK_I
VBAT
GND
P1_6
UART_TX
P1_3
P1_2
BT_RF
U1
P1_3
P1_2
RN4871U
GND
GND
GND
10 μF
6.3V X5R
ANT1
Antenna Matching
GND
L1
Configurable I/O
P1_6
1nH
C3
C4
P0_0
P1_7
P2_0
P2_7
P3_6
P0_2
P1_2
P1_3
P1_6
GND
GND
GND
2016-2023 Microchip Technology Inc.
DS50002489G-page 27
RN4870/71
of a Reset IC, which acts as an
Open-Drain
with a Delay
≤
10 ms, and is triggered at a 1.8V power supply.
5.3
Power Drop Protection
To
p
revent any problems that may arise when the power
supply goes below 1.9V, a power supply drop protection
circuit is recommended. Essentially, this circuit consists
Figure 5-6
shows
protection circuit.
a recommended power drop
FIGURE 5-6:
POWER DROP PROTECTION CIRCUIT
VBAT
RN4870/71
Reset IC
OUT
VDD
RST_N
DS50002489G-page 28
2016-2023 Microchip Technology Inc.
RN4870/71
• GATT
Services
6.0
ASCII COMMAND API
– Create/delete
public services/characteristics
– Read/write
characteristic values
– Set
notification for characteristics
• GAP
Role
The RN4870/71 command Application Programming
Interfaces (APIs) are documented in the
“RN4870/71
Bluetooth
®
Low Energy Module User’s Guide”
(DS50002466).
– Central,
Peripheral, Observer and
Broadcaster
The following are the available command options and
their categories:
• Advertising
• Connection
– Start/stop
– Establish
connection
– Disconnect
– Set
custom advertisement content
– Set
scan response content
– Set
beacon content
– Bond/unbond
current connection
– Start/stop
scan for other devices
– Add/delete
peer devices to white list
– Read
RSSI values
– Stop
connection process
• I/O
• Private
Service
– Create/delete
private services/characteristics
– Read/write
characteristic values
– Set
notification for characteristics
• Transparent
UART
– Read/write
I
2
C
– Enable/disable
– Change
settings in the EEPROM
– Configure
pin functions
– Configure
GPIO mask
– Set/get
GPIO states
– Read
and write analog data
– PWM
control (only for RN4870)
• System
– Peripheral
side configuration
– Central
side configuration
• Remote
configuration of the module
• Read
individual device information or profile
settings
– Reboot
– Factory
default
– Enter
and Exit Command mode
– Enter
Low-Power mode
• Scripting
– Enter
Script mode
– Declare
event handler
– Execute
current script
– List
current script
– Clear
script
– Define
user function
2016-2023 Microchip Technology Inc.
DS50002489G-page 29
RN4870/71
NOTES:
DS50002489G-page 30
2016-2023 Microchip Technology Inc.
RN4870/71
Private services are
not
registered with the Bluetooth
SIG, and therefore,
not
inter-operable with other
Bluetooth Low Energy devices unless the device
implements the private service. An example of a built-
in private service is the Transparent UAR
T
.
F
or an
example on how to create a custom service using the
RN4870, refer to
“RN4870/71 Bluetooth
®
Low Energy
Module User’s Guide”
(DS50002466).
7.0
SUPPORTED SERVICES
The RN4870 supports two built-in GATT services:
• Device
information public service
• UART
transparent private service, which handles
data streaming function
In addition to the above predefined private services, the
RN4870 provides the ability to create private services.
If the services are supported on both end points of a
Bluetooth Low Energy connection, such as Central and
Peripheral devices, data can be exchanged. For
example, two RN4870 modules can define a custom
(private) service with their own unique characteristics.
Data can be exchanged easily via Command API.
RN4870 allows custom-defined services for up to five
public and four private services. Each custom-defined
service allows up to eight custom-defined characteris-
tics. All service definitions are saved in on-board
Nonvolatile Memory (NVM), where the user must set up
the module only once.
2016-202G Microchip Technology Inc.
DS50002489G-page 31
RN4870/71
NOTES:
DS50002489G-page 32
2016-202G Microchip Technology Inc.
RN4870/71
8.0
ANTENNA CHARACTERISTICS
The RN4870 and RN4871 modules contain an integral
ceramic chip antenna.
Figure 8-1
and
Figure 8-2
show
the antenna performance on the modules.
FIGURE 8-1:
RN4870 ANTENNA PERFORMANCE
Parameter
Values
Frequency
Max Gain
Efficiency
2450 MHz
1.63 dBi
71.55%
Antenna Description
Manufacturer Part Number
Manufacturer
Yageo Corporation
ANT ANT3216A063R2400A
PIFA 2.4GHz L3 2W1.6
ANT3216A063R2400A
2016-2023 Microchip Technology Inc.
DS50002489G-page 33
RN4870/71
FIGURE 8-2:
RN4871 ANTENNA PERFORMANCE
Parameter
Values
Frequency
Max Gain
Efficiency
2442 MHz
0.1 dBi
42.7%
Antenna Description
Manufacturer Part Number
Manufacturer
ANT AANT3216LL00R2400A
PIFA 2.4GHz L3 2W1.6
ANT3216LL00R2400A
Yageo Corporation
DS50002489G-page 34
2016-2023 Microchip Technology Inc.
RN4870/71
when RN4870/71 is ready to talk to the MCU after
Reset, the module provides a UART response indicat-
ing that the Reset is complete. For more details, refer
to the
“RN4870/71 Bluetooth
®
Low Energy Module
User’s Guide”
(DS50002466).
9.0
TIMING CHARACTERISTICS
Figure 9-1
shows the timing diagram for the RN4870/
71 module when it is reset in the
T
e
st mode and Appli-
cation mode.
Figure 9-2
shows the timing diagram for
the module when it is powered on. In Application mode,
FIGURE 9-1:
TIMING DIAGRAM OF RN4870/71 UART READY AFTER RESET (IN TEST AND
APPLICATION MODE)
Ext
Reset
UART Ready
for MCU
1mS
Test Mode
Process
P2_0=0
UART Ready
for MCU
Application
Mode
Process
Status pin/UART
Report Command
P2_0=1
25mS
46mS
68mS
2016-2023 Microchip Technology Inc.
DS50002489G-page 35
RN4870/71
FIGURE 9-2:
TIMING DIAGRAM OF RN4870/71 UART WHEN POWERED ON (IN TEST AND
APPLICATION MODE)
VBAT
UART Ready
for MCU
P2_0=0
25mS
Test Mode
Process
UART Ready
for MCU
Status pin/UART
Report Command
P2_0=1
Application
Mode
Process
46mS
68mS
The table below shows the error rate for various UART
baud rates for the RN4870/71 module. The system
clock is running at 16 MHz.
TABLE 9-1:
ERROR RATE FOR VARIOUS BAUD RATES ON THE RN4870/71
Set Baud Rate
Measured Baud Rate
Error
921600
460800
307200
230400
115200
57600
38400
19200
9600
941176
457143
307692
231884
115942
57971
38095
19048
9524
-2.12%
0.79%
-0.16%
-0.64%
-0.64%
-0.64%
0.79%
0.79%
0.79%
DS50002489G-page 36
2016-2023 Microchip Technology Inc.
RN4870/71
10.0 ORDERING
INFORMATION
The table below provides ordering information for the
RN4870/71 module.
TABLE 10-1:
ORDERING INFORMATION
Operating Temperature
Range
Part Number
(
1
)
Antenna
Shielding
Number of Pins
RN4870-V/RMXXX
RN4870U-V/RMXXX
RN4871-V/RMXXX
RN4871U-V/RMXXX
RN4870-I/RMXXX
RN4871-I/RMXXX
On-Board
External
Yes
No
33
30
16
17
33
16
-20°C to +70°C
-20°C to +70°C
-20°C to +70°C
-20°C to +70°C
-40°C to +85°C
-40°C to +85°C
On-Board
External
Yes
No
On-Board
On-Board
Yes
Yes
Note 1:
The last three digits in the P/N indicate the firmware version. At the time of publication, the latest firmware
version is 1.30. Ensure to check product webpage for the latest part number and firmware version.
Note:
Go to
http://www.microchip.com
for current pricing and a list of distributors carrying Microchip products.
2016-2023 Microchip Technology Inc.
DS50002489G-page 37
RN4870/71
NOTES:
DS50002489G-page 38
2016-2023 Microchip Technology Inc.
RN4870/71
11.1.1
LABELING AND USER
INFORMATION REQUIREMENTS
11.0 REGULATORY
APPROVAL
The RN4870 module has received the regulatory
approval for the following countries:
The RN4870 module has been labeled with its own
FCC ID number, and if the FCC ID is not visible when
the module is installed inside another device, then the
outside of the finished product into which the module is
installed must also display a label referring to the
enclosed module. This exterior label can use wording
as follows:
• United
States/FCC ID: A8TBM70ABCDEFGH
• Canada/ISED
– IC:
12246A-BM70BLES1F2
– HVIN:
BM70BLES1F2
• Europe/CE
• Japan/MIC:
202-SMD069
For the RN4870 module:
• Korea/KCC:
MSIP-CRM-mcp-BM70BLES1FC2
•
T
a
iwan/NCC
No: CCAN15LP0501T3
• China/SRRC:
CMIIT ID: 2016DJ5729
Contains Transmitter Module
FCC ID: A8TBM70ABCDEFGH
or
The RN4871 module has received the regulatory
approval for the following countries:
Contains FCC ID: A8TBM70ABCDEFGH
• United
States/FCC ID: A8TBM71S2
• Canada/ISED
– IC:
12246A-BM71S2
– HVIN:
BM71BLES1FC2
• Europe/CE
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
• Japan/MIC:
005-101150
• Korea/KCC:
MSIP-CRM-mcp-BM71BLES1FC2
•
T
a
iwan/NCC
No: CCAN16LP0011T7
• China/SRRC:
CMIIT ID: 2016DJ5890
• Brazil/ANATEL:
02699-19-08759
Due to the limited size of the RN4871, the FCC Identifier
(FCC ID) is not displayed on the module. Therefore, the
FCC ID must be placed on the outside of the finished
product into which the module is installed and must
also display a label referring to the enclosed module.
This exterior label can use wording as follows:
11.1 United
States
For the RN4871 module:
The RN4870/71 module has received Federal Communi-
cations Commission (FCC) CFR47
T
e
lecommunications,
Part 15 Subpart C “Intentional Radiators” single modular
approval in accordance with Part 15.212 Modular
Transmitter approval. Single modular transmitter
approval is defined as a complete RF transmission sub-
assembly, designed to be incorporated into another
device, that must demonstrate compliance with FCC rules
and policies independent of any host. A transmitter with a
modular grant can be installed in different end-use
products (referred to as a host, host product or host
device) by the grantee or other equipment manufacturer,
then the host product may not require additional testing,
or equipment authorization for the transmitter function
provided by that specific module or limited module device.
Contains Transmitter Module
FCC ID: A8TBM71S2
or
Contains FCC ID: A8TBM71S2
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
A host product itself is required to comply with all other
applicable FCC equipment authorization regulations,
requirements and equipment functions that are not
associated with the transmitter module portion. For
example, compliance must be demonstrated: to regula-
tions for other transmitter components within a host
product; to requirements for unintentional radiators
(Part 15 Subpart B), such as digital devices, computer
peripherals, radio receivers, etc.; and to additional
authorization requirements for the non-transmitter
functions on the transmitter module (i.e., Verification or
Declaration of Conformity) as appropriate (e.g.,
Bluetooth and Wi-Fi
®
transmitter modules may also
contain digital logic functions).
2016-2023 Microchip Technology Inc.
DS50002489G-page 39
RN4870/71
A user’s manual for the product should include the
following statement:
11.1.3
APPROVED ANTENNAS
To
m
aintain modular approval in the United States, only
the antenna types that have been tested shall be used.
It is permissible to use different antenna, provided it is
the same antenna type, antenna gain (equal to or less
than) with similar in-band and out-of band characteristics
(refer to specification sheet for cutoff frequencies).
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
Part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference in a residential installation. This equip-
ment generates, uses and can radiate radio
frequency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However,
there is no guarantee that interference will not occur
in a particular installation. If this equipment does
cause harmful interference to radio or television
reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to
correct the interference by one or more of the
following measures:
For RN4870, the approval is received using the
antenna listed in
Figure 8-1
.
For RN4871, the approval is received using the
antenna listed in
Figure 8-2
.
11.1.4
HELPFUL WEBSITES
Federal Communications Commission (FCC):
FCC Office of Engineering and
T
e
chnology (OET)
Laboratory Division Knowledge Database (KDB):
• Reorient
or relocate the receiving antenna.
• Increase
the separation between the equipment
and receiver.
11.2 Canada
• Connect
the equipment into an outlet on a circuit
different from that to which the receiver is
connected.
The RN4870/71 module has been certified for use in
Canada under Innovation, Science and Economic
Development Canada (ISED, formerly Industry
Canada) Radio Standards Procedure (RSP) RSP-100,
Radio Standards Specification (RSS) RSS-247 and
RSS-Gen. Modular approval permits the installation of
a module in a host device without the need to recertify
the device.
• Consult
the dealer or an experienced radio/TV
technician for help.
Additional information on labeling and user information
requirements for Part 15 devices can be found in KDB
Publication 784748, available at the FCC Office of
Engineering and
T
e
chnology (OET) Laboratory
Division Knowledge Database (KDB):
11.2.1
LABELING AND USER
INFORMATION REQUIREMENTS
Labeling requirements for the host product (from
RSP-100, Issue 12, Section 5): The host product shall
be properly labeled to identify the module within the
host device.
11.1.2
RF EXPOSURE
All transmitters regulated by FCC must comply with RF
exposure requirements. KDB Publication 447498
General RF Exposure Guidance provides guidance in
determining whether proposed or existing transmitting
facilities, operations or devices comply with limits for
human exposure to Radio Frequency (RF) fields adopted
by the Federal Communications Commission (FCC).
On the RN4871, due to the limited module size, the IC
identifier is displayed in the data sheet only and it
cannot be displayed on the module label.
The Innovation, Science and Economic Development
Canada certification label of a module shall be clearly
visible at all times when installed in the host device;
otherwise, the host device must be labeled to display
the Innovation, Science and Economic Development
Canada certification number of the module, preceded
by the word, “Contains”, or similar wording expressing
the same meaning, as follows:
Output power listed is conducted. This grant is valid
only when the module is sold to OEM integrators and
must be installed by the OEM or OEM integrators. This
transmitter is restricted for use with the specific
antenna(s) tested in this application for Certification
and must not be co-located or operating in conjunction
with any other antenna or transmitters within a host
device, except in accordance with FCC multitransmitter
product procedures. This module is approved for
installation into mobile or/and portable host platforms.
For the RN4870 module:
Contains IC: 12246A-BM70BLES1F2
For the RN4871 module:
Contains IC: 12246A-BM71S2
DS50002489G-page 40
2016-2023 Microchip Technology Inc.
RN4870/71
User Manual Notice for License-Exempt Radio Appara-
tus (from Section 8.4, RSS-Gen, Issue 5, March 2019):
User manuals for license-exempt radio apparatus shall
contain the following or equivalent notice in a conspic-
uous location in the user manual or alternatively, on the
device or both:
11.2.2
RF EXPOSURE
All transmitters regulated by the Innovation, Science and
Economic Development Canada (ISED) must comply
with RF exposure requirements listed in RSS-102 – Radio
Frequency (RF) Exposure Compliance of Radio
Communication Apparatus (all frequency bands).
This device contains license-exempt transmit-
ter(s)/receiver(s) that comply with Innovation,
Science and Economic Development Canada’s
license-exempt RSS(s). Operation is subject to
the following two conditions:
This transmitter is restricted for use with a specific
antenna tested in this application for certification, and
must not be co-located or operating in conjunction with
any other antenna or transmitters within a host device,
except in accordance with Innovation, Science and
Economic Development Canada multitransmitter
guidelines.
1. This
device may not cause interference.
2. This
device must accept any interference,
including interference that may cause
undesired operation of the device.
The installation of the transmitter must ensure compliance
is demonstrated according to the ISED SAR procedures.
L’émetteur/récepteur exempt de licence contenu
dans le présent appareil est conforme aux
CNR d’Innovation,
Sciences et Développement
économique Canada applicables aux appareils
radio exempts de licence. L’exploitation est
autorisée aux deux conditions suivantes:
11.2.3
APPROVED ANTENNAS
For RN4870, the approval is received using the
antenna listed in
Figure 8-1
.
For RN4871, the approval is received using the
antenna listed in
Figure 8-2
.
1. L’appareil
ne doit pas produire de brouillage.
11.2.4
HELPFUL WEBSITES
2. L’appareil
doit accepter tout brouillage
radioélectrique subi, même si le brouillage
est susceptible d’en compromettre le
fonctionnement.
11.3 Europe
Transmitter Antenna
(from Section 6.8 RSS-GEN,
Issue 5,
March 2019): User manuals for transmitters
shall display the following notice in a conspicuous
location:
The RN4870/4871 module is Radio Equipment
Directive (RED) assessed, CE marked, and has been
manufactured and tested with the intention of being
integrated into a final product.
This radio transmitter [IC: 12246A-BM70BLES1F2
and IC: 12246A-BM71S2] has been approved by
Innovation, Science and Economic Development
Canada to operate with the antenna types listed
below, with the maximum permissible gain indi-
cated. Antenna types not included in this list that
have a gain greater than the maximum gain
indicated for any type listed are strictly prohibited
for use with this device.
The RN4870/71 module has been tested to RED 2014/
53/EU Essential Requirements mentioned in the
following European Compliance table.
TABLE 11-1:
EUROPEAN COMPLIANCE
Certification
Safety
Standards
EN 62368
Article
3.1(a)
Health
EN 62311
Le présent émetteur radio
Electromagnetic
Compatibility (EMC)
EN 301 489-1
EN 301 489-17
EN300 328
3.1(b)
3.2
[IC: 12246A-BM70BLES1F2 and IC: 12246A-
BM71S2] a été approuvé par Innovation, Sciences
et Développement économique Canada pour
fonctionner avec les types d’antenne énumérés
cidessous et ayant un gain admissible maximal.
Les types d’antenne non inclus dans cette liste, et
dont le gain est supérieur au gain maximal indiqué
pour tout type figurant sur la liste, sont strictement
interdits pour l’exploitation de l’émetteur.
Radio
Immediately following the above notice, the manufac-
turer shall provide a list of all antenna types approved
for use with the transmitter, indicating the maximum
permissible antenna gain (in dBi) and required
impedance for each.
2016-2023 Microchip Technology Inc.
DS50002489G-page 41
RN4870/71
The ETSI provides guidance on modular devices in
“Guide to the application of harmonised standards
covering Article 3.1(b) and Article 3.2 of the Directive
2014/53/EU RED to multi-radio and combined radio
and non-radio equipment”
document available at:
11.3.4
HELPFUL WEBSITES
A document that can be used as a starting point in
understanding the use of Short Range Devices (SRD) in
Europe is the European Radio Communications Com-
mittee (ERC) Recommendation 70-03 E, which can be
downloaded from the European Radio Communications
Note:
To
m
aintain conformance to the standards
listed in the preceding European Compli-
ance table, the module shall be installed in
accordance with the installation instructions
in this data sheet and shall not be modified.
When integrating a radio module into a
completed product, the integrator becomes
the manufacturer of the final product and is
therefore responsible for demonstrating
compliance of the final product with the
essential requirements against the RED.
Additional helpful websites are:
• Radio
Equipment Directive (2014/53/EU):
• European
Conference of Postal and
T
e
lecommunications Administrations (CEPT):
• European
T
e
lecommunications Standards
• The
Radio Equipment Directive Compliance
11.3.1
LABELING AND USER
INFORMATION REQUIREMENTS
11.4 Japan
The label on the final product which contains the
RN4870/71 module must follow CE marking
requirements.
The RN4870/71 module has received type certification,
and is labeled with its own technical conformity mark
and certification number, as required, to conform to the
technical standards regulated by the Ministry of Internal
Affairs and Communications (MIC) of Japan pursuant
to the Radio Act of Japan.
11.3.2
CONFORMITY ASSESSMENT
From ETSI Guidance Note EG 203367, Section 6.1,
non-radio products are combined with a radio product:
Integration of this module into a final product does not
require additional radio certification, provided installa-
tion instructions are followed and no modifications of
the module are allowed. Additional testing may be
required:
• If
the manufacturer of the combined equipment
installs the radio product in a host non-radio
product in equivalent assessment conditions
(i.e., host equivalent to the one used for the
assessment of the radio product) and according
to the installation instructions for the radio
product, then no additional assessment of the
combined equipment against Article 3.2 of the
RED is required.
• If
the host product is subject to electrical appliance
safety (for example, powered from an AC mains),
the host product may require Product Safety
Electrical Appliance and Material (PSE) testing.
The integrator should contact their conformance
laboratory to determine if this testing is required.
11.3.3
APPROVED ANTENNAS
• There
is a voluntary Electromagnetic Compatibility
(EMC) test for the host product administered by
For RN4870, the approval is received using the antenna
listed in
Figure 8-1
.
For RN4871, the approval is received using the antenna
listed in
Figure 8-2
.
11.4.1
LABELING AND USER
INFORMATION REQUIREMENTS
11.3.3.1
Simplified EU Declaration of
Conformity
The label on the final product which contains the
RN4870/71 module must follow Japan marking
requirements. The integrator of the module should refer
to the labeling requirements for Japan available at the
Ministry of Internal Affairs and Communications (MIC)
website.
Hereby, Microchip
T
e
chnology Inc. declares that the
radio equipment type RN4870/71 is in compliance
with Directive 2014/53/EU.
The full text of the EU declaration of conformity for this
product is available at:
(available under
Documents > Certifications
).
DS50002489G-page 42
2016-2023 Microchip Technology Inc.
RN4870/71
The RN4870 module is labeled with its own technical
conformity mark and certification number. The final
product in which this module is being used must have
a label referring to the type of certified module inside:
Due to the limited size of the RN4871, the KC mark is
not displayed on the module. Therefore, the final
product requires the KC mark and certificate number of
the module:
Contains transmitter module with certificate number:
11.5.2
HELPFUL WEBSITES
Due to the limited size of the RN4871, the technical
conformity mark and certification number are not dis-
played on the module. Therefore, the final product in
which this module is being used must have a label
referring to the type of certified module inside:
Korea Communications Commission (KCC):
National Radio Research Agency (RRA):
Contains transmitter module with certificate number:
11.6 Taiwan
The RN4870/71 module has received compliance
approval in accordance with the
T
e
lecommunications
Act. Customers seeking to use the compliance
approval in their product should contact Microchip
T
e
chnology sales or distribution partners to obtain a
Letter of Authority.
Integration of this module into a final product does not
require additional radio certification, provided installa-
tion instructions are followed and no modifications of
the module are allowed.
11.4.2
HELPFUL WEBSITES
Ministry of Internal Affairs and Communications (MIC):
Association of Radio Industries and Businesses (ARIB):
11.6.1
LABELING AND USER
INFORMATION REQUIREMENTS
11.5 Korea
The RN4870 module is labeled with its own NCC ID
number, and if the NCC ID is not visible when the
module is installed inside another device, then the out-
side of the device must also display a label referring to
the enclosed module. This exterior label can use
wording such as the following:
The RN4870/71 module has received certification of
conformity in accordance with the Radio Waves Act.
Integration of this module into a final product does not
require additional radio certification, provided installa-
tion instructions are followed and no modifications of
the module are allowed.
11.5.1
LABELING AND USER
INFORMATION REQUIREMENTS
Due to the limited size of the RN4871, the NCC ID is
not displayed on the module. Therefore, the outside of
the device must also display a label referring to the
enclosed module. This exterior label can use wording
such as the following:
The label on the final product, which contains the
RN4870/71 module, must follow KC marking require-
ments. The integrator of the module should refer to the
labeling requirements for Korea available on the Korea
Communications Commission (KCC) website.
The RN4870 module is labeled with its own KC mark.
The final product requires the KC mark and certificate
number of the module:
2016-2023 Microchip Technology Inc.
DS50002489G-page 43
RN4870/71
The user’s manual should contain the below warning
(for RF device) in traditional Chinese:
11.8 Brazil
The RN4871 stereo audio modules have received
compliance approval in accordance with the
T
e
lecom-
munications Act of the Federal Republic of Brazil
National
T
e
lecommunications Agency (ANATEL).
Customers seeking to use the compliance approval in
their product must contact Microchip
T
e
chnology Inc.
sales or distribution partners to obtain a Letter of
Authority.
注意
!
依據 低功率電波輻射性電機管理辦法
第十二條 經型式認證合格之低功率射頻電機,
非經許可,
公司、商號或使用者均不得擅自變更頻率、加大
功率或變更原設計
The end product (host) manual must include the following
statement:
之特性及功能。
第十四條 低功率射頻電機之使用不得影響飛航安
全及干擾合法通信;
經發現有干擾現象時,應立即停用,並改善至無
干擾時方得繼續使用。
Modelo: RN4871
前項合法通信,指依電信規定作業之無線電信。
低功率射頻電機須忍受合法通信或工業、科學及
醫療用電波輻射性
電機設備之干擾。
02699-19-08759
11.6.2
HELPFUL WEBSITES
“Este equipamento não tem direito à proteção contra
interferência prejudicial e não pode causar interferência
em sistemas devidamente autorizados”.
National Communications Commission (NCC):
11.7 China
Este producto contém a placa Modelo RN4871
código de homologação ANATEL 02699-19-08759.
The RN4870/71 module has received certification of
conformity in accordance with the China MIIT Notice
2014-01 of State Radio Regulation Committee (SRRC)
certification scheme. Integration of this module into a
final product does not require additional radio certifica-
tion, provided installation instructions are followed and
no modifications of the module are allowed.
11.9 UKCA
(UK Conformity Assessed)
The RN4870/71 module is a UK conformity assessed
radio module that meets all the essential requirements
according to CE RED requirements.
Refer to the SRRC certificate available in:
or for expiry date:
11.9.1
LABELING REQUIREMENTS FOR
MODULE AND USER’S
REQUIREMENTS
The label on the final product that contains the
RN4870/71 module must follow the UKCA marking
requirements.
11.7.1
LABELING AND USER
INFORMATION REQUIREMENTS
The RN4870 module is labeled with its own CMIT ID as
follows:
The RN4871 module is labeled with its own CMIT ID as
follows:
DS50002489G-page 44
2016-2023 Microchip Technology Inc.
RN4870/71
utility is available. For further regulatory certification
utility and documentation, contact your local Microchip
T
e
chnology sales office.
11.11 Other
Regulatory Information
• For
information about other country jurisdictions
not covered here, refer to:
• Should
other regulatory jurisdiction certification be
required by the customer, or the customer needs
to recertify the module for other reasons, contact
Microchip for the required utilities and
documentation.
The UKCA mark above is printed on the module itself
or on the packing label.
Additional details for the label requirement are avail-
able at:
11.9.2
UKCA DECLARATION OF
CONFORMITY
Hereby, Microchip
T
e
chnology Inc. declares that the
radio equipment type RN4870/71 is in compliance with
the Radio Equipment Regulations 2017.
The full text of the UKCA declaration of conformity for
this product is available (under
Documents > Certifica-
tions
) at:
11.9.3
APPROVED ANTENNAS
For RN4870, the approval is received using the
antenna listed in
Figure 8-1
.
For RN4871, the approval is received using the
antenna listed in
Figure 8-2
.
11.9.4
HELPFUL WEBSITES
For more information on the UKCA regulatory approv-
11.10 Other
Regulatory Jurisdictions
Should other regulatory jurisdiction certification be
required by the customer, or the customer needs to
recertify the module for other reasons, a certification
2016-2023 Microchip Technology Inc.
DS50002489G-page 45
RN4870/71
Revision F (June 2022)
APPENDIX A:
REVISION HISTORY
TABLE F-1:
Section
MAJOR SECTION UPDATES
Revision A (April 2016)
Update Description
This is the initial release of this document.
11.9 “UKCA (UK Con-
formity Assessed)”
Added UKCA regulatory
approval information
Revision B (October 2017)
• Added
the new parts, RN4870-I/RMXXX and
RN4871-I/RMXXX, released with increased
operating temperature range.
Revision G (March 2023)
• Updated
(included Voltage Monitor/Reset IC on
the reference circuit)
Figure 5-2
,
Figure 5-3
,
Figure 5-4
and
Figure 5-5
• Updated
Features section and removed
Description section on page 1.
• Updated
T
a
ble 1-1
,
T
a
ble 1-2
,
T
a
ble 1-4
and
T
a
ble 10-1
.
• Revised
T
a
ble 2-1
through
T
a
ble 2-4
.
• Updated
Figure 1-4
,
Figure 3-1
,
Figure 3-2
and
Figure 4-7
.
• Added
Section 11.7 “China”
to
Section 11.0
“Regulatory Approval”
.
• Updated
T
a
ble 10-1
and
“Product Identification
System”
.
Revision C (December 2017)
• Updated
T
a
ble 2-1
to correct information for the
operating temperature range.
Revision D (April 2019)
• Updated
Bluetooth version from 4.2 to 5.0.
• Updated
Features
and
Antenna Options
.
• Updated
Figure 5-2
,
Figure 5-3
,
Figure 5-4
and
Figure 5-5
.
• Updated
Figure 9-1
and
Figure 9-2
(P2_0 = 1).
• Updated
Section 7.0 “Supported Services”
.
• Updated
Section 11.2 “Canada”
and
Section 11.3 “Europe”
.
Revision E (February 2021)
• Added
new description for VDD_IO pins in
T
a
ble 1-2
.
• Added
labeling information of Brazil for RN4871
module.
• Added
Section 11.1.3 “Approved Antennas”
,
Section 11.2.3 “Approved Antennas”
and
Section 11.8 “Brazil”
.
• Updated
Section 11.2.1 “Labeling and User
Information Requirements”
,
Section 11.3
“Europe”
and
Section 11.7 “China”
.
DS50002489G-page 46
2016-2023 Microchip Technology Inc.
RN4870/71
NOTES:
2016-2023 Microchip Technology Inc.
DS50002489G-page 47
RN4870/71
THE MICROCHIP WEBSITE
CUSTOMER SUPPORT
www.microchip.com
. This website is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the website contains the following information:
Users of Microchip products can receive assistance
through several channels:
• Distributor
or Representative
• Local
Sales Office
• Field
Application Engineer (FAE)
•
T
e
chnical
Support
•
Product Support
– Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
•
General Technical Support
– Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
•
Business of Microchip
– Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
www.microchip.com
. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
DS50002489G-page 48
2016-2023 Microchip Technology Inc.
RN4870/71
NOTES:
2016-2023 Microchip Technology Inc.
DS50002489G-page 49
RN4870/71
PRODUCT IDENTIFICATION SYSTEM
To
o
rder or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office.
V
PART NO.
Device
RM
XXX
Example:
RN4870-V/RM118: Various
temperature
Temperature
Range
Package
Firmware
Revision
Number
RN4870-I/RM128: Industrial
temperature
Device:
RN4870:
RN4870U: External
Antenna
RN4871: Ceramic
Chip Antenna
RN4871U: External
Antenna
Ceramic Chip Antenna
Note 1:
T
a
pe and Reel identifier only appears in the
catalog part number description. This
Temperature
Range:
V
I
=
=
-20
C to +70
C (Various)
-40
C to +85
C (Industrial)
identifier is used for ordering purposes and
is
not
printed on the device package. Check
with your Microchip Sales Office for package
availability with the
T
a
pe and Reel option.
Package:
RM
=
Radio Module
DS50002489G-page 50
2016-2023 Microchip Technology Inc.
RN4870/71
NOTES:
2016-2023 Microchip Technology Inc.
DS50002489G-page 51
RN4870/71
DS50002489G-page 52
2016-2023 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable” Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this informa-
tion in any other manner violates these terms. Information
regarding device applications is provided only for your conve-
nience and may be superseded by updates. It is your responsi-
bility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec, AVR,
AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory,
CryptoR
F
,
d
sPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq,
Kleer, LANCheck, LinkMD, maXStylus, maX
T
o
uch, MediaLB,
megaAVR, Microsemi, Microsemi logo, MOS
T
,
M
OST logo,
MPLAB, OptoLyzer, PIC, picoPower, PICSTAR
T
,
P
IC32 logo,
PolarFire, Prochip Designer, Q
T
o
uch, SAM-BA, SenGenuity,
SpyNIC, SS
T
,
S
ST Logo, SuperFlash, Symmetricom, SyncServer,
T
a
chyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are
registered trademarks of Microchip
T
e
chnology Incorporated in the
U.S.A. and other countries.
AgileSwitch, AP
T
,
C
lockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, Libero, motorBench, m
T
o
uch, Powermite 3, Precision Edge,
ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld,
T
e
mux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, and ZL are registered
trademarks of Microchip
T
e
chnology Incorporated in the U.S.A.
THIS INFORMATION IS PROVIDED BY MICROCHIP “AS IS”.
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NON-
INFRINGEMEN
T
,
M
ERCHANTABILIT
Y
,
A
ND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALIT
Y
,
O
R PERFORMANCE.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, Clockstudio, CodeGuard, CryptoAuthentication,
CryptoAutomotive, CryptoCompanion, CryptoController,
dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM,
ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, In-
Circuit Serial Programming, ICS
P
,
I
NICnet, Intelligent Paralleling,
IntelliMOS, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display,
KoD, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MP
F
,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMA
P
,
SimpliPH
Y
,
S
martBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPH
Y
, T
o
tal
Endurance, Trusted Time, TSHARC, USBCheck, VariSense,
VectorBlox, VeriPH
Y
,
V
iewSpan, WiperLock, XpressConnect, and
ZENA are trademarks of Microchip
T
e
chnology Incorporated in the
U.S.A. and other countries.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDI-
REC
T
,
S
PECIAL, PUNITIVE, INCIDENTAL, OR CONSE-
QUENTIAL LOSS, DAMAGE, COS
T
,
O
R EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP’S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
AN
Y
,
T
HAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applica-
tions is entirely at the buyer’s risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
SQTP is a service mark of Microchip
T
e
chnology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
T
e
chnology, and Symmcom are registered trademarks of Microchip
T
e
chnology Inc. in other countries.
GestIC is a registered trademark of Microchip
T
e
chnology Germany
II GmbH & Co. KG, a subsidiary of Microchip
T
e
chnology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016-2023, Microchip
T
e
chnology Incorporated and its subsidiar-
ies.
All Rights Reserved.
ISBN: 978-1-6683-1901-7
2016-2023 Microchip Technology Inc. and its subsidiaries
DS50002489G-page 53
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
T
e
l: 480-792-7200
Fax: 480-792-7277
T
e
chnical Support:
Australia – Sydney
T
e
l: 61-2-9868-6733
India – Bangalore
T
e
l: 91-80-3090-4444
Austria – Wels
T
e
l: 43-7242-2244-39
Fax: 43-7242-2244-393
China – Beijing
T
e
l: 86-10-8569-7000
India – New Delhi
T
e
l: 91-11-4160-8631
Denmark – Copenhagen
T
e
l: 45-4485-5910
Fax: 45-4485-2829
China – Chengdu
T
e
l: 86-28-8665-5511
India – Pune
T
e
l: 91-20-4121-0141
Finland – Espoo
T
e
l: 358-9-4520-820
China – Chongqing
T
e
l: 86-23-8980-9588
Japan – Osaka
T
e
l: 81-6-6152-7160
Web Address:
France – Paris
T
e
l: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China – Dongguan
T
e
l: 86-769-8702-9880
Japan – Tokyo
T
e
l: 81-3-6880- 3770
Atlanta
Duluth, GA
T
e
l: 678-957-9614
Fax: 678-957-1455
China – Guangzhou
T
e
l: 86-20-8755-8029
Korea – Daegu
T
e
l: 82-53-744-4301
Germany – Garching
T
e
l: 49-8931-9700
China – Hangzhou
T
e
l: 86-571-8792-8115
Korea – Seoul
T
e
l: 82-2-554-7200
Germany – Haan
T
e
l: 49-2129-3766400
Austin, TX
T
e
l: 512-257-3370
China – Hong Kong SAR
T
e
l: 852-2943-5100
Malaysia – Kuala Lumpur
T
e
l: 60-3-7651-7906
Germany – Heilbronn
T
e
l: 49-7131-72400
Boston
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T
e
l: 774-760-0087
Fax: 774-760-0088
China – Nanjing
T
e
l: 86-25-8473-2460
Malaysia – Penang
T
e
l: 60-4-227-8870
Germany – Karlsruhe
T
e
l: 49-721-625370
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Philippines – Manila
Germany – Munich
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e
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Fax: 49-89-627-144-44
T
e
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l: 63-2-634-9065
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e
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e
l: 972-9-744-7705
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e
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e
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l: 39-049-7625286
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e
l: 281-894-5983
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T
e
l: 86-29-8833-7252
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T
e
l: 84-28-5448-2100
Netherlands – Drunen
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e
l: 31-416-690399
Fax: 31-416-690340
Indianapolis
Noblesville, IN
T
e
l: 317-773-8323
Fax: 317-773-5453
T
e
l: 317-536-2380
China – Xiamen
T
e
l: 86-592-2388138
Norway – Trondheim
T
e
l: 47-7288-4388
China – Zhuhai
T
e
l: 86-756-3210040
Poland – Warsaw
T
e
l: 48-22-3325737
Los Angeles
Mission Viejo, CA
T
e
l: 949-462-9523
Fax: 949-462-9608
T
e
l: 951-273-7800
Romania – Bucharest
T
e
l: 40-21-407-87-50
Spain – Madrid
T
e
l: 34-91-708-08-90
Fax: 34-91-708-08-91
Raleigh, NC
T
e
l: 919-844-7510
Sweden – Gothenberg
T
e
l: 46-31-704-60-40
New York, NY
T
e
l: 631-435-6000
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e
l: 46-8-5090-4654
San Jose, CA
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e
l: 408-735-9110
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e
l: 408-436-4270
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e
l: 44-118-921-5800
Fax: 44-118-921-5820
Canada – Toronto
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e
l: 905-695-1980
Fax: 905-695-2078
DS50002489G-page 54
2016-2023 Microchip Technology Inc. and its subsidiaries
09/14/21
