Microchip-Tech-TP2104K1-G

Part #Microchip-Tech-TP2104K1-G
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Microchip-Tech-TP2104K1-G
Supertex inc.  
TP2104  
P-Channel Enhancement-Mode  
Vertical DMOS FET  
Features  
General Description  
►
High input impedance and high gain  
►
Low power drive requirement  
►
Ease of paralleling  
This low threshold, enhancement-mode (normally-off) transistor  
utilizes a vertical DMOS structure and Supertex’s well-  
proven, silicon-gate manufacturing process. This combination  
produces a device with the power handling capabilities of  
bipolar transistors and the high input impedance and positive  
temperature coefficient inherent in MOS devices. Characteristic  
of all MOS structures, this device is free from thermal runaway  
and thermally-induced secondary breakdown.  
►
Low C

ISS

and fast switching speeds  
►
Excellent thermal stability  
►
Integral source-drain diode  
►
Free from secondary breakdown  
Applications  
Supertex’s vertical DMOS FE
T
s
a
re ideally suited to a wide  
range of switching and amplifying applications where very  
low threshold voltage, high breakdown voltage, high input  
impedance, low input capacitance, and fast switching speeds  
are desired.  
►
Logic level interfaces – ideal for TTL and CMOS  
►
Solid state relays  
►
Analog switches  
►
Power management  
►
T
e
lecom switches  
Ordering Information  
Product Summary  
R

DS(ON)  

Part Number  
Package Option  
Packing  
V

GS(th)  

(max)  
BV

DSS

/BV

DGS  

(max)  
TP2104K1-G  
TO-236AB (SOT-23)
 
3000/Reel  
-40V  
6.0
Ω  
-2.0V  
TP2104N3-G  
3-Lead TO-92  
1000/Bag  
2000/Reel  
TP2104N3-G P002  
TP2104N3-G P003  
Pin Configuration  
DRAIN  
TP2104N3-G P005
 
3-Lead TO-92  
TP2104N3-G P013  
TP2104N3-G P014  
DRAIN  
SOURCE  
GATE  
-G denotes a lead (Pb)-free / RoHS compliant package.  
Contact factory for Wafer / Die availablity.  
Devices in Wafer / Die form are lead (Pb)-free / RoHS compliant.  
SOURCE  
GATE  
TO-236AB (SOT-23)  
TO-92  
Absolute Maximum Ratings  
Parameter  
Value  
BV

DSS  

BV

DGS  

±20V  
Product Marking  
Drain-to-source voltage  
Drain-to-gate voltage  
W = Code for week sealed  
= “Green” Packaging  
P1LW  
Gate-to-source voltage  
Package may or may not include the following marks: Si or  
Operating and storage temperature  
-55

O

C to +150

O

C  
TO-236AB (SOT-23)  
Absolute Maximum Ratings are those values beyond which damage to the device  
may occur. Functional operation under these conditions is not implied. Continuous  
operation of the device at the absolute rating level may affect device reliability. All  
voltages are referenced to device ground.  
SiTP  
2 1 0 4  
YYWW  
YY = Year Sealed  
WW = Week Sealed  
Typical Thermal Resistance  
= “Green” Packaging  
Package  
θ

ja  

Package may or may not include the following marks: Si or  
203

O

C/W  
132

O

C/W  
TO-92  
TO-236AB (SOT-23)  
TO-92  
Doc.# DSFP-TP2104  
B081313  
Supertex inc.  

TP2104  
Thermal Characteristics  
I

D  

I

D  

Power Dissipation  
†
Package  
I

DR  

I

DRM  

(continuous)

†  

(pulsed)  
@T

A

= 25

O

C  
TO-236AB (SOT-23)  
TO-92  
-160mA  
-175mA  
-800mA  
-1.0A  
0.36W  
0.74W  
-160mA  
-175mA  
-800mA  
-1.0A  
†
I

D

(continuous) is limited by max rated T

j

.  
Electrical Characteristics
(T

A

= 25°C unless otherwise specified)  
Sym  
BV

DSS  

V

GS(th)  

∆V

GS(th)  

I

GSS  

Parameter  
Min  
-40  
-1.0  
–
Typ  
Max  
–
Units  
Conditions  
Drain-to-source breakdown voltage  
Gate threshold voltage  
Change in V

GS(th)

with temperature  
Gate body leakage  
–
–
V
V
V

GS

= 0
V
,
I

D

= -1.0mA  
V

GS

= V

DS

, I

D

= -1.0mA  
-2.0  
6.5  
-100  
-10  
5.8  
-1.0  
–
mV/

O

C V

GS

= V

DS

, I

D

= -1.0mA  
–
nA  
V

GS

= ± 20
V
,
V

DS

= 0V  
μA  
V

GS

= 0
V
,
V

DS

= Max Rating  
I

DSS  

Zero gate voltage drain current  
On-state drain current  
–
V

DS

= 0.8 Max Rating,  
V

GS

= 0
V
, T

A

= 125°C  
–
-1.0  
mA  
A
I

D(ON)  

-0.6  
–
–
–
V

GS

= -10
V
,
V

DS

= -25V  
V

GS

= -4.5
V
,
I

D

= -50mA  
V

GS

= -10
V
,
I

D

= -500mA  
V

GS

= -10
V
,
I

D

= -500mA  
V

DS

= -25
V
,
I

D

= -500mA  
–
10  
6.0  
1.0  
–
Static drain-to-source on-state  
resistance  
R

DS(ON)  

Ω
–
∆R

DS(ON)

Change in R

DS(ON)

with temperature  
–
0.55  
200  
35  
%/

O

C  
G

FS  

C

ISS  

C

OSS  

C

RSS  

t

d(ON)  

t

r  

Forward transconductance  
Input capacitance  
150  
mmho  
–
–
–
–
–
–
–
–
–
60  
30  
10  
6.0  
8.0  
9.0  
8.0  
-2.0  
–
V

GS

= 0
V
,  
V

DS

= -25
V
,  
f = 1.0 MHz  
Common source output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
22  
pF  
ns  
8.0  
4.0  
4.0  
5.0  
5.0  
-1.2  
400  
V

DD

= -25
V
,  
I

D

= -500mA,  
R

GEN

= 25Ω  
Rise time  
t

d(OFF)  

t

f  

Turn-off delay time  
Fall time  
V

SD  

t

rr  

Diode forward voltage drop  
Reverse recovery time  
V
V

GS

= 0
V
,
I

SD

= -500mA  
V

GS

= 0
V
,
I

SD

= -500mA  
ns  
Notes:  
1. All
 
D.C. parameters 100% tested at 25

O

C unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.)  
2. All
 
A.C. parameters sample tested.  
Switching Waveforms and Test Circuit  
0V  
Pulse  
10%  
Generator  
INPUT  
R

GEN  

90%  
t

(OFF)  

-10V  
t

(ON)  

t

d(ON)  

D.U.
T
.  
t

r  

t

d(OFF)  

t

f  

INPUT  
OUTPUT  
0V  
R

L  

90%  
90%  
OUTPUT  
VDD  
10%  
10%  
VDD  
Doc.# DSFP-TP2104  
B081313  
Supertex inc.  
2

TP2104  
Typical Performance Curves  
BV

DSS

Variation with Temperature  
On-Resistance vs. Drain Current  
1.1  
20  
16  
12  
8.0  
4.0  
0
V

GS

= -4.5V  
1.0  
V

GS

= -10V  
0.9  
-50  
0
50  
100  
150  
0
-0.4  
-0.6  
-0.8  
-1.2  
-2.0  
T

j

(

O

C)  
I

D

(amperes)  
V

GS(th)

and R

DS(ON)

Variation with Temperature  
Transfer Characteristics  
V

DS

= -25

O

C  
1.2  
-2.0  
1.6  
R

DS(ON)

@ -10V, -0.5A  
1.1  
-1.6  
-1.2  
-0.8  
-0.4  
0
T

A

= -55

O

C  
1.4  
1.0  
V

GS(th)

@ -1.0mA  
1.2  
25

O

C  
0.9  
1.0  
0.8  
0.8  
0.7  
125

O  

C
0
-2.0  
-4.0  
-6.0  
-8.0  
10  
-50  
0
50  
100  
150  
V

GS

(volts)  
T

j

(

O

C)  
Capacitance vs. Drain-to-Source Voltage  
Gate Drive Dynamic Characteristics  
-10  
100  
V

DS

= -10V  
f = 1.0MHz  
-8.0  
-6.0  
-4.0  
-2.0  
0
75  
V

DS

= -40V  
125 pF  
50  
C

ISS  

25  
C

OSS  

C

RSS  

35 pF  
0.5  
0
0
-10  
-20  
-30  
-40  
0
1.0  
1.5  
2.0  
2.5  
V

DS

(volts)  
Q

G

(nanocoulombs)  
Doc.# DSFP-TP2104  
B081313  
Supertex inc.  
3

TP2104  
Typical Performance Curves
(cont.)  
Output Characteristics  
Saturation Characteristics  
-2.0  
-2.0  
-1.6  
-1.2  
-0.8  
-0.4  
0
V

GS

= -10V  
-1.6  
-8V  
-1.2  
V

GS

= -10V  
-8V  
-0.8  
-6V  
-6V  
-4V  
-0.4  
-4V  
-3V  
-3V  
0
0
-10  
-20  
-30  
-40  
-50  
0
-2.0  
-4.0  
-6.0  
-8.0  
-10  
V

DS

(volts)  
V

DS

(volts)  
Transconductance vs. Drain Current  
Power Dissipation vs. Temperature  
1.0  
0.8  
0.6  
0.4  
0.2  
0
0.5  
V

DS

= -25V  
0.4  
0.3  
0.2  
0.1  
0
TO-92  
T

A

= -55

O

C  
25

O

C  
SOT-23  
125

O

C  
0
25  
50  
75  
100  
125  
150  
0
-0.2  
-0.4  
-0.6  
-0.8  
-1.0  
T

A

(

O

C)  
I

D

(amperes)  
Maximum Rated Safe Operating Area  
Thermal Response Characteristics  
-1.0  
-0.1  
1.0  
0.8  
0.6  
0.4  
0.2  
0
SOT-23 (pulsed)  
SOT-23 (DC)  
SOT-23  
P

D

= 0.36W  
T

A

= 25

O

C  
-0.01  
TO-92  
P

D

= 1.0W  
T

C

= 25

O

C  
T

A

= 25

O

C  
-0.001  
-0.1  
-1.0  
-10  
-100  
0.001  
0.01  
0.1  
1.0  
10  
t

P

(seconds)  
V

DS

(volts)  
Doc.# DSFP-TP2104  
B081313  
Supertex inc.  
4

TP2104  
3-Lead TO-236AB (SOT-23) Package Outline (K1)  
2.90×1.30mm body, 1.12mm height (max), 1.90mm pitch  
D
3
E
E1  
Gauge  
Plane  
0.25  
Seating  
Plane  
L
L1  
1
2
e
b
e1  
View B  
Top View  
View B  
A
A2  
A
Seating  
Plane  
A1  
View A – A  
Side View  
A
Symbol  
A
A1  
0.01  
–
A2  
b
D
E
2.10  
–
E1  
e
e1  
L
L1  
θ
0

O  

–
MIN  
NOM  
MAX  
0.89  
–
0.88  
0.95  
1.02  
0.30  
–
2.80  
2.90  
3.04  
1.20  
1.30  
1.40  
0.20

†  

0.50  
0.60  
Dimension  
(mm)  
0.95  
BSC  
1.90  
BSC  
0.54  
REF  
1.12  
0.10  
0.50  
2.64  
8

O  

JEDEC Registration TO-236, Variation AB, Issue H, Jan. 1999.  
† This dimension differs from the JEDEC drawing.  
Drawings not to scale.  
Supertex Doc.#:
DSPD-3TO236ABK1, Version C041309.  
Doc.# DSFP-TP2104  
B081313  
Supertex inc.  
5

TP2104  
3-Lead TO-92 Package Outline (N3)  
D
A
Seating  
Plane  
1
2
3
L
c
b
e1  
e
Side View  
Front View  
E
E1  
1
3
2
Bottom View  
Symbol  
A
.170  
–
b
.014

†  

–
c
D
.175  
–
E
.125  
–
E1  
.080  
–
e
e1  
.045  
–
L
.500  
–
MIN  
NOM  
MAX  
.014

†  

–
.095  
–
Dimensions  
(inches)  
.210  
.022

†  

.022

†  

.205  
.165  
.105  
.105  
.055  
.610*  
JEDEC Registration TO-92.  
* This dimension is not specified in the JEDEC drawing.  
† This dimension differs from the JEDEC drawing.  
Drawings not to scale.  
Supertex Doc.#:
DSPD-3TO92N3, Version E041009.  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline  
Supertex inc.
does not recommend the use of its products in life support applications, and will not knowingly sell them for use in such applications unless it receives  
an adequate “product liability indemnification insurance agreement.”
Supertex inc.
does not assume responsibility for use of devices described, and limits its liability  
to the replacement of the devices determined defective due to workmanship. No responsibility is assumed for possible omissions and inaccuracies. Circuitry and  
specifications are subject to change without notice. For the latest product specifications refer to the
Supertex inc.
(website: http//www.supertex.com)  
©2013
Supertex inc
.
All rights reserved. Unauthorized use or reproduction is prohibited.  
Supertex inc.  
1235 Bordeaux Drive, Sunnyvale, CA 94089  
Doc.# DSFP-TP2104  
B081313  
T
e
l: 408-222-8888  
6