MSKSEMI-AO3418

Part #MSKSEMI-AO3418
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MSKSEMI-AO3418
AO3418  
Semiconductor  
Compiance  
Features  
30V,3.8A , RDS(ON)=45mΩ@VGS=10V  
Improved dv
/
d
t capability  
Fast switching  
D
Green Device Available  
G
S
Applications  
SOT-23-3L  
MB / VGA / Vcore  
Load Switch  
D
Hand
–
H
eld Instrument  
BVDSS  
30V  
RDSON  
ID  
G
45m
Ω
 
3.8A  
S
Absolute Maximum Ratings
Tc= 2 5
℃
unless otherwise noted  
Symbol  
Rating  
Units  
Parameter  
Drain-Source Voltage  
30  
V
V
A
A
A
V
DS  
V
GS  
Gate-Sou
r
ce Voltage  
±
12  
3.8  
Drain Current – Continuous (T
A
=25
C
)  
Drain Current – Continuous (T
A
=70
C
)  
I
D  
S.0  
Drain Current – Pulsed

1  

15  
I
DM  
P
D  
Power Dissipation (T
A
=25
C
)  
278  
2.22  
mW  
Power Dissipation – Derate above 25
C  
Storage Temperature Range  
mW/
C  
T
STG  
T
J  
C
C
-50 to 150  
-50 to 150  
Operating Junction Temperature Range  
Thermal  
Characteristics  
Symbol  
Typ.  
Parameter  
Max
.  
450  
Unit  
C
/ W  
R
θJA  
Thermal Resistance Junction to ambient  
—  

AO3418  
Semiconductor  
Compiance  
Off Characteristics  
Symbol  
Typ.  
Unit  
V
Parameter  
Drain-Source Breakdown Voltage  
△
BV
DSS
/△
T

J

BV
DSS
Temperature Coefficient  
Conditions  
V
GS
=0V , I
D
=250uA  
Min.  
Max.  
30  
BV
DSS  
—  
—  
0.018  
Reference to 25
C
, I
D
=1mA  
V
DS
=30V , V
GS
=0V , T
J
=25
C  
V
DS
=24V , V
GS
=0V , T
J
=125
C  
V
GS
=
±
12V , V
DS
=0V  
V/
C  
uA  
—  
—  
—  
—  
—  
1
—  
—  
—  
Drain-Source Leakage Current  
Gate-Source Leakage Current  
I
DSS  
I
GSS  
10  
uA  
nA  
±
100  
On Characteristics  
45  
50  
60  
70  
V
GS
=10V , I
D
=3A  
V
GS
=4.5V , I
D
=2A  
m
m
—  
R
DS(ON)  
Static Drain-Source On-Resistance  
—  
Gate Threshold Voltage  
0.5  
1.0  
-3.2  
2.3  
2.5  
V
V
GS(th)  
△
V
GS(th)  
gfs  
V
GS
=V
DS
, I
D
=250uA  
V
DS
=10V , I
D
=2A  
V
GS(th)
Temperature Coefficient  
mV/
C  
S
—  
—  
—  
—  
Forward Transconductance  
Dynamic and switching Characteristics  
Total Gate Charge

2 , 3  

3.1  
0.1  
1.7  
2.2  
6.9  
15.2  
4.5  
245  
40  
Q
g  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
Gate-Source Charge

2 , 3  

nC  
V
DS
=24V , V
GS
=10V , I
D
=1A  
Q
gs  
Gate-Drain Charge

2 , 3  

Q
gd  
Turn-On Delay Time

2 , 3  

T
d(on)  
Rise Time

2 , 3  

V
DD
=24V , V
GS
=10V ,  
R
G
=3.3 I
D
=1A  
T
r  
ns  
pF  
Turn-Off Delay Time

2 , 3  

T
d(off)  
Fall Time

2 , 3  

T
f  
Input Capacitance  
C
iss  
C
oss  
C
rss  
V
DS
=25V , V
GS
=0V , F=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
78  
—  
7.6  
A
V
Pulsed Source Current  
Diode Forward Voltage  
z
I
SM  
V
SD  
—  
—  
1.3  
V
GS
=0V , I
S
=1A , T
J
=25
C  
Note :  
1. Repetitive
 
Rating : Pulsed width limited by maximum junction temperature.  
2. The
 
data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%.  
3. Essentially
 
independent of operating temperature.  

AO3418  
Semiconductor  
Compiance  
T

J

, Junction Temperature (
℃
)  
T

J

, Junction Temperature (
℃
)  
Fig. 1  
Fig. 2  
Continuous Drain Current vs.
 
T

J  

Normalized RDSON vs.
 
T

J  

T

J

, Junction Temperature (
℃
)  
Qg , Gate Charge (
nC
)  
Fig. 3  
Fig. 4
 
Gate Charge Waveform  
Normalized V

th

vs. T

J  

V

DS

, Drain to Source Voltage (V)  
Square Wave Pulse Duration (s)  
Fig. 5
 
Normalized  
Transient  
Impedance  
Fig. 6  
Maximum Safe Operation Area  

AO3418  
Semiconductor  
Compiance  
V

DS  

90%  
10%  
V

GS  

T

d(on)  

T

d(off)  

T

r  

T

on  

T

f  

T

off  

Fig. 7  
Switching Time Waveform  
Fig. 8  
Gate Charge Waveform  

AO3418  
Semiconductor Compiance  
PACKAGE MECHANICAL DATA  
Di
m
e
nsions In Millimeters  
Di
m
e
nsions In Inches  
S
y
mbol  
Min.  
1.050  
0.000  
1.050  
0.300  
0.100  
2.820  
1.500  
2.650  
Max.  
1.250  
0.100  
1.150  
0.500  
0.200  
3.020  
1.700  
2.950  
Min.  
0.041  
0.000  
0.041  
0.012  
0.004  
0.111  
0.059  
0.104  
Max.  
0.049  
0.004  
0.045  
0.020  
0.008  
0.119  
0.067  
0.116  
A
A1  
A2  
b
c
D
E1  
E
e
0.950(BSC)  
0.037(BSC)  
e1  
L
1.800  
0.300  
0°  
2.000  
0.600  
8°  
0.071  
0.012  
0°  
0.079  
0.024  
8°  
ꢀ
REEL SPECIFICATION  
QTY  
P/N  
PKG  
AO3418  
SOT-23
-3L  
3000  

AO3418  
Semiconductor  
Compiance  
Attention  
■
Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications  
that can handle applications that require extremely high levels of reliability, such as life-support systems,  
aircraft’s control systems, or other applications whose failure can be reasonably expected to result in serious  
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you  
before using any MSKSEMI Semiconductor products described or contained herein in such applications.  
■
MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products  
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or  
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described  
orcontained herein.  
■
Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the  
performance, characteristics, and functions of the described products in the independent state, and are not  
guarantees of the performance, characteristics, and functions of the described products as mounted in the  
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent  
device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment.  
■
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semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to  
accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause  
damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents  
or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention  
circuitsfor safedesign, redundant design, and structural design.  
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or contained herein are controlled under any of applicable local export control laws and regulations, such  
products must not be exported without obtaining the export license from theauthorities concerned in  
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without the prior written permission of MSKSEMI Semiconductor.  
■
Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not  
guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and  
reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property  
rights or other rightsof third parties.  
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Any and all information described or contained herein are subject to change without notice due to  
product/technology improvement, etc. Whendesigning equipment, referto the “Delivery Specification” for the  
MSKSEMI Semiconductor productthat you intend to use.