MSKSEMI-AO4480-MS

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MSKSEMI-AO4480-MS
AO4480-MS  
Semiconductor  
Compiance  
Features  
●
V

DS (V)

= 40V  
SOP-8  
●
I
D
= 14 A (V

GS

= 10V)  
5 Drain  
6 Drain  
7 Drain  
8 Drain  
1 Source  
2 Source  
3 Source  
4 Gate  
●
R

DS(ON)

<
13.0m
Ω
(V

GS

= 10V)  
●
R

DS(ON)

<
16.5m
Ω
(V

GS

= 4.5V)  
D
G
S
Absolute Maximum Ratings Ta = 25
℃
 
Parameter  
Drain-Source Voltage  
Symbol  
Rating  
40  
Unit  
V
V
DS  
GS  
Gate-Source Voltage  
V
±
20  
14  
T
T
A
=25
℃  
=70
℃  
Continuous Drain Current  
I
D  
10  
A
A
Pulsed Drain Current  
Avalanche Current  
I
DM  
AR  
AR  
70  
I
30  
Repetitive Avalanche Energy  
L=0.3mH  
E
135  
3.1  
mJ  
W
T
T
A
=25
℃  
=70
℃  
Power Dissipation  
P
D  
2
A
40  
t
≤
10s  
Steady-State  
Thermal Resistance.Junction- to-Ambient  
R
thJA  
thJL  
75  
℃
/W  
Thermal Resistance.Junction- to-Lead  
Junction Temperature  
R
24  
T
J
150  
-55 to 150  
℃
Storage Temperature Range  
T
stg  

AO4480-MS  
Semiconductor  
Compiance  
Electrical Characteristics Ta = 25
℃
 
Parameter  
Symbol  
Test Conditions  
D
=250
μ
A, V

GS

=0V  
Min  
Typ  
Max  
Unit  
V
40  
Drain-Source Breakdown Voltage  
V
DSS  
I
V
V
V
V
V
V
V
V
V

DS

=32V, V

GS

=0V  

DS

=32V, V

GS

=0V, T  

DS

=0V, V

GS

=
±
20V  
1
5
Zero Gate Voltage Drain Current  
I
DSS  
GSS  
uA  
J
=55
℃  
Gate-Body Leakage Current  
Gate Threshold Voltage  
I
uA  
V
±
100  
3
V
GS(th)  

DS

=V

GS

, I  
D
=250uA  
1

GS

=10V, I  

GS

=10V, I  
D
=14A  
11.5  
Static Drain-Source On-Resistance  
R
DS(O  
n
)
13  
D
=14A  
T
J
=125
℃  
m
Ω  

GS

=4.5V, I  

GS

=10V, V

DS

=5V  

DS

=5V, I =5A  
D
=5A  
16.5  
On State Drain Current  
Forward Transconductance  
Input Capacitance  
I
D(ON)  
FS  
iss  
oss  
70  
50  
A
S
g
D
C
1600 1920  
V
V

GS

=0V, V

DS

=20V, f=1MHz  

GS

=0V, V

DS

=0V, f=1MHz  
pF  
Output Capacitance  
C
320  
100  
3.4  
22  
Reverse Transfer Capacitance  
Gate Resistance  
C
rss  
R
g  
Ω
Total Gate Charge
 
(10V)  
Total Gate Charge
 
(4.5V)  
Gate Source Charge  
Q
g  
10.5  
4.2  
4.8  
3.5  
6
V
V

GS

=10V, V

DS

=20V, I  
D
=14A  
nC  
Q
gs  
gd  
Gate Drain Charge  
Q
Turn-On DelayTime  
t
d(on)  
Turn-On Rise Time  
t
r  

GS

=10V, V

DS

=20V, R  
L
=1.5
Ω
,  
R

GEN

=3
Ω  
ns  
Turn-Off DelayTime  
t
d(off)  
13.2  
3.5  
31  
Turn-Off Fall Time  
t
f  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Maximum Body-Diode Continuous Current  
Diode Forward Voltage  
t
rr  
rr  
I
I
F
= 14A,
 
d
I
/d
t
= 100A/us  
Q
33  
nC  
A
I
S
4
V
SD  
S
=1A,V

GS

=0V  
1
V
Note : The static characteristics in Figures 1 to 6 are obtained using <300 us pulses, duty cycle 0.5% max.  

AO4480-MS  
Semiconductor  
Compiance  
Typical Characterisitics  
100  
100  
80  
60  
40  
20  
0
-40
°
C  
25
°
C  
10V  
V

DS

=5V  
5V  
80  
4V  
125
°
C  
60  
40  
20  
0
V

GS

=3.5V  
V

GS

=3V  
-40
°
C  
25
°
C  
125
°
C  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
0
1
2
3
4
5
V

GS

(Volts)  
V

DS

(Volts)  
Figure 2: Transfer Characteristics  
Figure 1: On-Region Characteristics  
14  
12  
10  
8
1.6  
1.4  
1.2  
1
V

GS

=4.5V  
V

GS

=10V  
I

D

=14A  
V

GS

=4.5V  
I

D

=5A  
V

GS

=10V  
0.8  
0.6  
6
0
5
10  
15  
20  
25  
30  
-50 -25  
0
25 50 75
 
100 125 150 175  
I

D

(A)  
Temperature (
°
C
)  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
Figure 4: On-Resistance vs. Junction  
Temperature  
30  
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
125
°
C  
25  
20  
15  
10  
5
I

D

=14A  
125
°
C  
-40
°
C  
25
°
C  
25
°
C  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
2
4
6
8
10  
V

SD

(Volts)  
V

GS

(Volts)  
Figure 6: Body-Diode Characteristics  
Figure 5: On-Resistance vs. Gate-Source Voltage  

AO4480-MS  
Semiconductor  
Compiance  
Typical Characterisitics  
2400  
2000  
1600  
1200  
800  
400  
0
10  
V

DS

=20V  
C

iss  

I

D

=14A  
8
6
4
2
0
C

oss  

C

rss  

0
4
8
12  
16  
20  
24  
0
5
10  
15  
20  
25  
30  
35  
40  
Q

g

(nC)  
V

DS

(Volts)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
100.0  
10.0  
1.0  
100  
80  
60  
40  
20  
0
10
µ
s  
100
µ
s  
T

J(Max)

=150
°
C  
Tc=25
°
C  
10ms  
1ms  
100ms  
R

DS(ON)  

limited  
10s  
1s  
DC  
T

J(Max)

=150
°
C  
T

A

=25
°
C  
0.1  
0.0  
0.01  
0.1  
1
10  
100  
0.001  
0.01  
0.1  
1
10  
100  
V

DS

(Volts)  
.
Pulse Width (s)  
Figure 9: Maximum Forward Biased Safe  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note F)  
Operating Area (Note F)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
D=T

on

/T  
T

J,PK

=T

A

+P

DM

.Z

θ
JA

.R

θ
JA  

R

θ
JA

=75
°
C
/W  
0.1  
0.01  
P

D  

T

on  

Single Pulse  
T
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  

AO4480-MS  
Semiconductor  
Compiance  
PACKAGE MECHANICAL DATA  
Dimensions In Millimeters  
Dimensions In Inches  
Sy
m
bo l  
M
i
n  
1.350  
0.100  
1.
3
50  
0.330  
0.170  
4.800  
Max  
1.
7
50  
0.250  
1.5
5
0  
0.510  
0.250  
5.000  
M
i
n  
0.053  
0.004  
0.0
53  
0.013  
0.007  
0.189  
Max  
A
A1  
A2  
b
0.069  
0.010  
0.0
61  
0.020  
0.010  
0.197  
c
D
e
1.270(BSC)  
0.050(BSC)  
E
5.800  
3.800  
0.400  
0°  
6.200  
4.000  
1.270  
8°  
0.228  
0.150  
0.016  
0°  
0.244  
0.157  
0.050  
8°  
E1  
L
θ
REEL SPECIFICATION  
P/N  
PKG  
QTY  
AO4480-MS  
3000  
SOP-8  

AO4480-MS  
Semiconductor  
Compiance  
Attention  
■
Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications  
that can handle applications that require extremely high levels of reliability, such as life-support systems,  
aircraft’s control systems, or other applications whose failure can be reasonably expected to result in serious  
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you  
before using any MSKSEMI Semiconductor products described or contained herein in such applications.  
■
MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products  
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or  
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described  
orcontained herein.  
■
Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the  
performance, characteristics, and functions of the described products in the independent state, and are not  
guarantees of the performance, characteristics, and functions of the described products as mounted in the  
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent  
device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment.  
■
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semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to  
accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause  
damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents  
or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention  
circuitsfor safedesign, redundant design, and structural design.  
■
In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described  
or contained herein are controlled under any of applicable local export control laws and regulations, such  
products must not be exported without obtaining the export license from theauthorities concerned in  
accordance with the above law.  
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without the prior written permission of MSKSEMI Semiconductor.  
■
Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not  
guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and  
reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property  
rights or other rightsof third parties.  
■
Any and all information described or contained herein are subject to change without notice due to  
product/technology improvement, etc. Whendesigning equipment, referto the “Delivery Specification” for the  
MSKSEMI Semiconductor productthat you intend to use.