MSKSEMI-AOD409-MS

Part #MSKSEMI-AOD409-MS
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MSKSEMI-AOD409-MS
AOD409-MS  
Semiconductor  
Compiance  
TO252 Pin Configuration  
Features  
-60V,-25A, RDS(ON) 38mΩ @VGS = -10V  
Improved dv/dt capability  
Fast switching  
D
Green Device Available  
G
S
Applications  
Networking  
Load Switch  
LED applications  
D
G
BVDSS  
-60V  
RDSON  
ID  
-25A  
38m
 
S
Absolute Maximum Ratings
(
Tc=25
℃
unless otherwise noted)  
Symbol  
V

DS  

Parameter  
Rating  
Units  
V
Drain-Source Voltage  
r
ce Voltage  
-60  
±
20  
V

GS  

Gate-Sou  
V
Drain Current – Continuous (T

C

=25
℃
)  
Drain Current – Continuous (T

C

=100
℃
)  
Drain Current – Pulsed

1  

-25  
A
I

D  

-16  
A
I

DM  

P

D  

-100  
A
Power Dissipation (T

C

=25
℃
)  
72  
W
Power Dissipation – Derate above 25
℃  
Storage Temperature Range  
0.578  
-55 to 150  
-55 to 150  
W/
℃  
℃
T

STG  

T

J  

℃
Operating Junction Temperature Range  
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
Max.  
62  
Unit  
℃
/W  
℃
/W  
R

θJA  

R

θJC  

Thermal Resistance Junction to ambient  
Thermal Resistance Junction to Case  
—  
—  
1.73  

AOD409-MS  
Semiconductor  
Compiance  
Electrical Characteristics
(T

J

=25
℃
, unless otherwise noted)  
Off Characteristics  
Symbol  
Parameter  
Conditions  
V

GS

=0V , I

D

=-250uA  
Min.  
-60  
—  
Typ.  
—  
Max.  
—  
Unit  
V
BV

DSS  

Drain-Source Breakdown Voltage  
V

DS

=-60V , V

GS

=0V , T

J

=25
℃
 
V

DS

=-48V , V

GS

=0V , T

J

=125
℃  
—  
-1  
uA  
uA  
nA  
I

DSS  

I

GSS  

Drain-Source Leakage Current  
Gate-Source Leakage Current  
—  
—  
-10  
V

GS

=
±
20V , V

DS

=0V  
±
100  
—  
—  
On Characteristics  
V

GS

=-10V , I

D

=-8A  
V

GS

=-4.5V , I

D

=-6A  
V

GS

=V

DS

, I

D

=-250uA  
V

DS

=-10V , I

S

=-3A  
—  
—  
38  
46  
48  
60  
m
 
m
  
V
R

DS(ON)  

Static Drain-Source On-Resistance  
V

GS(th)  

gfs  
Gate Threshold Voltage  
-1.0  
—  
-1.6  
11  
-2.5  
—  
Forward Transconductance  
S
Dynamic and switching Characteristics  
Q

g  

Q

gs  

Q

gd  

T

d(on)  

T

r  

Total Gate Charge

2 , 3  

Gate-Source Charge

2 , 3  

Gate-Drain Charge

2 , 3  

Turn-On Delay Time

2 , 3  

Rise Time

2 , 3  

—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
19  
2.5  
4.3  
25  
30  
3.8  
6.5  
40  
V

DS

=-30V , V

GS

=-10V , I

D

=-10A  
nC  
ns  
V

DD

=-30V , V

GS

=-10V , R

G

=25
  
58  
95  
T

d(off)  

T

f  

Turn-Off Delay Time

2 , 3  

Fall Time

2 , 3  

65  
110  
55  
I

D

=-10A  
35  
C

iss  

C

oss  

C

rss  

R

g  

Input Capacitance  
1200  
85  
1800  
130  
90  
V

DS

=-30V , V

GS

=0V , F=1MHz  
V

GS

=0V, V

DS

=0V, F=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
60  
14  
—  
Drain-Source Diode Characteristics and Maximum Ratings  
Symbol  
I

S  

Parameter  
Continuous Source Current  
Pulsed Source Current  
Conditions  
Min.  
—  
Typ.  
—  
Max.  
-25  
-50  
-1  
Unit  
A
V

G

=V

D

=0V , Force Current  
I

SM  

—  
—  
A
V

GS

=0V , I

S

=-1A , T

J

=25
℃  
V
R
=-50V, I
S
=-10A  
V

SD  

t

rr  

Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
—  
—  
V
—  
30  
20  
—  
ns  
nC  
di/dt=100A/µs, T

J

=25
℃  
Q

rr  

—  
—  
Note :  
1. Repetitive
 
Rating : Pulsed width limited by maximum junction temperature.  
V

DD

=-25V,V

GS

=-10V,L=0.1mH,I

AS

=-34A.,Starting T
J
=25
℃
 
2.  
3. The
 
data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%.  
4. Essentially
 
independent of operating temperature.  

AOD409-MS  
Semiconductor  
Compiance  
T

J

, Junction Temperature (
℃
)  
-V
DS
,Drain to Source Voltage (
V
)  
Fig.1 Typical
 
Output Characteristics  
Fig.2 Normalized
 
RDSON vs. T

J  

T

J

, Junction Temperature (
℃
)  
Qg , Gate Charge (
nC
)  
Fig.4 Gate
 
Charge Waveform  
Fig.3 Normalized
 
V

th

vs. T

J  

T

C

, Case Temperature (
℃
)  
-V

DS

, Drain to Source Voltage (
V
)  
Fig.5 Continuous
 
Drain Current vs. T

J  

Fig.6 Capacitance
 
Characteristics  

AOD409-MS  
Semiconductor  
Compiance  
-V

DS

, Drain to Source Voltag
e
(
V)  
Square Wave Pulse Duration (s)  
Fig.7 Normalized
 
Transient Impedance  
Fig.8 Maximum
 
Safe Operation Area  

AOD409-MS  
Semiconductor Compiance  
PACKAGE MECHANICAL DATA  
D
A
D1  
c
h
φ
A1  
D2  
b
e
Dimensions In Millimeters  
Dimensions In Inches  
Symbol  
Min.  
2.200  
0.000  
0.635  
0.460  
6.500  
5.100  
Max.  
2.400  
0.127  
0.770  
0.580  
6.700  
5.460  
Min.  
0.087  
0.000  
0.025  
0.018  
0.256  
0.201  
Max.  
0.094  
A
A1  
b
c
D
D1  
D2  
E
e
L
0.005  
0.030  
0.023  
0.264  
0.215  
4.830 REF.  
0.190 REF.  
6.000  
2.186  
9.712  
6.200  
2.386  
10.312  
0.236  
0.086  
0.382  
0.244  
0.094  
0.406  
L1  
L2  
L3  
L4  
Φ
θ
2.900 REF.  
0.114 REF.  
0.063 REF.  
1.400  
1.700  
0.055  
0.067  
1.600 REF.  
0.600  
1.100  
0°  
1.000  
1.300  
8°  
0.024  
0.043  
0°  
0.039  
0.051  
8°  
h
0.000  
0.300  
0.000  
0.012  
V
5.250 REF.  
0.207 REF.  
REEL SPECIFICATION  
QTY  
P/N  
PKG  
AOD409-MS  
TO-252  
2500  

AOD409-MS  
Semiconductor  
Compiance  
Attention  
■
Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications  
that can handle applications that require extremely high levels of reliability, such as life-support systems,  
aircraft’s control systems, or other applications whose failure can be reasonably expected to result in serious  
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you  
before using any MSKSEMI Semiconductor products described or contained herein in such applications.  
■
MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products  
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or  
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described  
orcontained herein.  
■
Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the  
performance, characteristics, and functions of the described products in the independent state, and are not  
guarantees of the performance, characteristics, and functions of the described products as mounted in the  
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent  
device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment.  
■
MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all  
semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to  
accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause  
damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents  
or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention  
circuitsfor safedesign, redundant design, and structural design.  
■
In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described  
or contained herein are controlled under any of applicable local export control laws and regulations, such  
products must not be exported without obtaining the export license from theauthorities concerned in  
accordance with the above law.  
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No part of this publication may be reproduced or transmitted in any form or by any means, electronic or  
mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise,  
without the prior written permission of MSKSEMI Semiconductor.  
■
Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not  
guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and  
reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property  
rights or other rightsof third parties.  
■
Any and all information described or contained herein are subject to change without notice due to  
product/technology improvement, etc. Whendesigning equipment, referto the “Delivery Specification” for the  
MSKSEMI Semiconductor productthat you intend to use.