MSKSEMI-BCP56-16-MS

Part #MSKSEMI-BCP56-16-MS
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MSKSEMI-BCP56-16-MS
BCP54-MS BCP55-MS BCP56-MS  
Semiconductor  
Compiance  
BCP54-MS,55-MS,56-MS
TRANSISTOR (NPN)  
SOT-223  
FEATURES  
z
z
z
z
For AF driver and output stages  
High collector current  
Low collector-emitter saturation voltage  
1
1. BASE  
2
2. COLLECTOR  
3. EMITTER  
3
Complementary types: BCP51 … BCP53 (PNP)  
MAXIMUM RATINGS (T

a

=25
℃
unless otherwise noted)  
Symbol  
V

CBO  

V

CEO  

V

EBO  

I

C  

Parameter  
Collector-Base Voltage  
Unit  
V
BCP54-MS  
BCP55-MS BCP56-MS  
45  
45  
60  
60  
5
100  
80  
Collector-Emitter Voltage  
Emitter-Base Voltage  
V
V
Collector Current -Continuous  
1
A
P

C  

Collector Power Dissipation  
1.5  
83.3  
W
R

θ
JA  

T

stg  

Thermal Resistance Junction to Ambient  
Storage
T
e
mperature Range  
℃
/W  
-65
~
+150  
℃
ELECTRICAL CHARACTERISTICS (T
a
=25
℃
unless otherwise specified)  
Parameter  
Symbol  
T
e
st conditions  
Min  
Max  
Unit  
Collector-base breakdown voltage  
BCP54-MS  
BCP55-MS  
BCP56-MS  
45  
60  
V

(BR)CBO  

I

C

= 0.1mA,I

E

=0  
V
100  
45  
Collector-emitter breakdown voltage  
BCP54-MS  
BCP55-MS  
BCP56-MS  
V

(BR)CEO  

I

C

= 10mA,I

B

=0  
60  
V
80  
Base-emitter breakdown voltage  
Collector cut-off current  
V

(BR)EBO  

I

CBO  

I

E

= 10
μ
A,I

C

=0  
5
V
V

CB

= 30
V
,
I

E

=0  
100  
250  
nA  
h

FE(1)  

h

FE(2)  

h

FE(3)  

V

CE(sat)  

V

BE  

V

CE

= 2V, I

C

=5mA  
25  
63  
25  
DC current gain  
V

CE

= 2V, I

C

=150m A  
V

CE

= 2V, I

C

=500m A  
I

C

=500mA,I

B

=50mA  
V

CE

=2
V
,
I

C

=500m A  
V

CE

=10
V
,
I

C

=50mA,f=100MHz  
Collector-emitter saturation voltage  
Base-emitter voltage  
0.5  
1
V
V
Transition frequency  
f

T  

100  
MHz  
CLASSIFICATION OF
 
h

FE(2)  

BCP54-10, BCP55-10, BCP56-10  
63-160  
BCP54-16, BCP55-16, BCP56-16  
100-250  
Rank  
Range  

BCP54-MS BCP55-MS BCP56-MS  
Semiconductor  
Compiance  
Typical Characteristics  
h

FE

—— I

C  

Static Characteristic  
250  
200  
150  
100  
50  
1000  
COMMON EMITTER  
V

CE

=2V  
COMMON  
EMITTER  
T

a

=25
℃
 
1.0mA  
0.9mA  
0.8mA  
0.7mA  
T

a

=100
℃  
T

a

=25
℃  
300  
100  
0.6mA  
0.5mA  
0.4mA  
0.3mA  
0.2mA  
I

B

=0.1mA  
30  
10  
0
0
1
2
3
4
5
1
10  
100  
1000  
1000  
20  
COLLECTOR-EMITTER VOLTAGE
 
V

CE

(V)  
COLLECTOR CURRENT
 
I

C

(mA)  
V

CEsat

—— I

C  

V

BEsat

—— I

C  

1000  
1.0  
0.8  
0.6  
0.4  
β
=10  
β
=10  
300  
100  
T

a

=25
℃  
T

a

=100
℃  
T

a

=100
℃  
T

a

=25
℃  
30  
10  
1
10  
100  
1000  
1
10  
100  
COLLECTOR CURRENT
 
I

C

(mA)  
COLLECTOR CURRENT
 
I

C

(mA)  
I

C

—— V

BE  

C

ob

/ C

ib

—— V

CB

/ V

EB  

1000  
100  
10  
300  
100  
COMMON EMITTER  
V

CE

=2V  
f=1MHz  
I

E

=0/I

C

=0  
C

ib  

T

a

=25
℃  
T

a

=100
℃  
C

ob  

10  
T

a

=25
℃  
1
1
0.1  
0.2  
0.4  
0.6  
0.8  
1.0  
1
10  
0.3  
3
BASE-EMITTER VOLTAGE
 
V

BE

(V)  
REVERSE BIAS VOLTAGE  
V
(V)  
P

C

——  
T

a  

f

T

——  
I

C  

1800  
300  
1500  
1200  
900  
600  
300  
0
100  
COMMON EMITTER  
V

CE

=10V  
T

a

=25
℃  
10  
10  
100  
0
25  
50  
75  
100  
125  
150  
30  
COLLECTOR CURRENT
 
I

C

(mA)  
AMBIENT TEMPERATURE
 
T

a

(
℃
)  

BCP54-MS BCP55-MS BCP56-MS  
Semiconductor Compiance  
PACKAGE MECHANICAL DATA  
Di
m
e
nsions In Millimeters  
Di
m
e
nsions In Inches  
S
y
mbol  
Min.  
——  
Max.  
1.800  
0.100  
1.700  
0.840  
3.100  
0.350  
6.700  
7.300  
3.700  
Min.  
——  
Max.  
0.071  
0.004  
0.067  
0.033  
0.122  
0.014  
0.264  
0.287  
0.146  
A
A1  
A2  
b
b1  
c
D
E
E1  
e
0.020  
1.500  
0.660  
2.900  
0.230  
6.300  
6.700  
3.300  
0.001  
0.059  
0.026  
0.114  
0.009  
0.248  
0.264  
0.130  
2.300(BSC)  
0.091(BSC)  
L
θ
0.750  
0°  
——  
10°  
0.030  
0°  
——  
10°  
REEL SPECIFICATION  
QTY  
P/N  
PKG  
1000  
BCP54-MS BCP55-MS BCP56-MS  
SOT-223  

BCP54-MS BCP55-MS BCP56-MS  
Semiconductor  
Compiance  
Attention  
■
Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications  
that can handle applications that require extremely high levels of reliability, such as life-support systems,  
aircraft’s control systems, or other applications whose failure can be reasonably expected to result in serious  
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you  
before using any MSKSEMI Semiconductor products described or contained herein in such applications.  
■
MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products  
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or  
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described  
orcontained herein.  
■
Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the  
performance, characteristics, and functions of the described products in the independent state, and are not  
guarantees of the performance, characteristics, and functions of the described products as mounted in the  
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent  
device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment.  
■
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semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to  
accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause  
damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents  
or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention  
circuitsfor safedesign, redundant design, and structural design.  
■
In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described  
or contained herein are controlled under any of applicable local export control laws and regulations, such  
products must not be exported without obtaining the export license from theauthorities concerned in  
accordance with the above law.  
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mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise,  
without the prior written permission of MSKSEMI Semiconductor.  
■
Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not  
guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and  
reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property  
rights or other rightsof third parties.  
■
Any and all information described or contained herein are subject to change without notice due to  
product/technology improvement, etc. Whendesigning equipment, referto the “Delivery Specification” for the  
MSKSEMI Semiconductor productthat you intend to use.