MSKSEMI-MMBT2907

Part #MSKSEMI-MMBT2907
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MSKSEMI-MMBT2907
MMBT2907  
Product specification  

MMBT2907  
MARKING  
Reference News  
TRANSISTOR (PNP)  
PACKAGE OUTLINE  
FEATURES  
1. BASE  
Epitaxial planar die construction  
Complementary NPN Type  
available(MMBT2222)  
2. EMITTER  
3.COLLECTOR  
2F  
SOT-23  
MAXIMUM RATINGS (Ta=25
℃
unless otherwise noted)  
Symbol  
V

CBO  

V

CEO  

V

EBO  

I

C  

Parameter  
Collector-Base Voltage  
Value  
-60  
Unit  
V
Collector-Emitter Voltage  
-60  
V
Emitter-Base Voltage  
-5  
V
Collector Current -Continuous  
Total Device Dissipation  
-600  
250  
500  
mA  
mW  
℃/W  
P

D  

Thermal Resistance
 
Junction to Ambient  
R

θJA  

T

J  

Junction Temperature  
Storage Temperature  
150  
℃
℃
-55 to +150  
T

stg  

ELECTRICAL CHARACTERISTICS (Ta=25
℃
unless otherwise specified)  
Parameter  
Symbol Test
 
conditions  
Min  
Typ Max Unit  
Collector-base breakdown voltage  
I

C

=-10μA,I

E

=0  
-60  
V
V

(BR)CBO  

V

(BR)CEO*  

V

(BR)EBO  

I

CBO  

Collector-emitter breakdown voltage  
Emitter-base breakdown voltage  
Collector cut-off current  
I

C

=-10mA,I

B

=0  
-60  
-5  
V
V
I

E

=-10μA,I

C

=0  
V

CB

=-50V,I

E

=0  
-20  
-10  
-50  
300  
nA  
nA  
nA  
Base cut-off current  
V

EB

=-3V, I

C

=0  
I

EBO  

Collector cut-off current  
I

CEX  

V

CE

=-30 V, V

BE(off)

=-0.5V  
V

CE

=-10V,I

C

=-150mA  
V

CE

=-10V,I

C

=-0.1mA  
V

CE

=-10V,I

C

=-1mA  
V

CE

=-10V,I

C

=-10mA  
V

CE

=-10V,I

C

=-500mA  
I

C

=-150mA,I

B

=-15mA  
I

C

=-500mA,I

B

=-50mA  
I

C

=-150mA,I

B

=-15mA  
I

C

=-500mA,I

B

=-50mA  
V

CE

=-20V,I

C

=-50mA,f=100MHz  
100  
75  
h

FE(1)  

h

FE(2)  

h

FE(3)  

h

FE(4)  

h

FE(5)  

V

CE(sat)*  

V

CE(sat)*  

V

BE(sat)*  

V

BE(sat)*  

f

T  

DC current gain  
100  
100  
50  
-0.4  
-1.6  
-1.3  
-2.6  
V
V
Collector-emitter saturation voltage  
Base-emitter saturation voltage  
V
V
Transition frequency  
Delay time  
200  
MHz  
ns  
ns  
ns  
ns  
t

d  

10  
25  
V

CE

=-30V,I

C

=-150mA,

B1

=-15mA  
t

r  

Rise time  
t

S  

Storage time  
225  
60  
V

CE

=-6V,I

C

=-150mA,  
I

B1

=- I

B2

=- 15mA  
t

f  

Fall time  
*Pulse test: t

p

≤300μs, δ≤0.02.  
Copyright© Msksemi Incorporated  

MMBT2907  
Typical Characteristics  
I

C  

h

FE

——  
Static Characteristic  
-0.25  
500  
400  
300  
200  
100  
0
COMMON EMITTER  

CE

=-10V  
COMMON EMITTER  
V
T

a

=25
℃
 
-800uA  
-720uA  
-0.20  
-0.15  
-0.10  
-0.05  
-0.00  
-640uA  
-560uA  
T

a

=100
℃  
-480uA  
-400uA  
-320uA  
T

a

=25
℃  
-240uA  
-160uA  
I

B

=-80uA  
-0  
-2  
-4  
-6  
-8  
-10  
-12  
-0.1  
-1  
-10  
-100  
-600  
COLLECTOR-EMITTER VOLTAGE
 
V

CE

(V)  
COLLECTOR CURRENT
 
I

C

(mA)  
V

CEsat

—— I

C  

V

BEsat

—— I

C  

-0.9  
-0.6  
-0.3  
-0.0  
-1.2  
-0.8  
-0.4  
β
=10  
β
=10  
T

a

=25
℃  
T

a

=100
℃  
T

a

=100
℃  
T

a

=25
℃  
-0.0  
100  
-1  
-10  
-100  
-1  
-10  
-100  
-600  
-1.0  
150  
-600  
COLLECTOR CURRENT
 
I

C

(mA)  
COLLECTOR CURRENT
 
I

C

(mA)  
I

C

—— V

BE  

C

ob

/ C

ib

—— V

CB

/ V

EB  

-600  
-100  
f=1MHz  
I

E

=0/ I

C

=0  
COMMON EMITTER  
V

CE

=-10V  
T

a

=25
℃  
C

ib  

C

ob  

T

a

=100
℃  
-10  
-1  
10  
T

a

=25
℃  
-0.1  
-0.0  
1
-0.1  
-0.2  
-0.4  
-0.6  
-0.8  
-1  
-10  
-20  
BASE-EMMITER VOLTAGE
 
V

BE

(V)  
REVERSE VOLTAGE  
V
(V)  
P

c

—— T

a  

300  
250  
200  
150  
100  
50  
0
0
25  
50  
75  
100  
125  
AMBIENT TEMPERATURE
 
T

a

(
℃
)  
Copyright© Msksemi Incorporated  

MMBT2907  
PACKAGE MECHANICAL DATA  
Dimensions In Millimeters  
Dimensions In Inches  
Symbol  
Min  
Max  
1.150  
0.100  
1.050  
0.500  
0.150  
3.000  
1.400  
2.550  
Min  
Max  
0.045  
0.004  
0.041  
0.020  
0.006  
0.118  
0.055  
0.100  
A
A1  
A2  
b
c
D
E
E1  
e
e1  
L
0.900  
0.000  
0.900  
0.300  
0.080  
2.800  
1.200  
2.250  
0.035  
0.000  
0.035  
0.012  
0.003  
0.110  
0.047  
0.089  
0.950 T
Y
P  
0.550 REF  
0.037 T
Y
P  
0.022 REF  
1.800  
2.000  
0.071  
0.079  
L1  
θ
0.300  
0°  
0.500  
8°  
0.012  
0°  
0.020  
8
°  
Suggested Pad Layout  
REEL SPECIFICATION  
P/N  
PKG  
QTY  
MMBT2907  
SOT-23  
3000  
Copyright© Msksemi Incorporated  

MMBT2907  
Attention  
■
Any and all MSKSEMI Semiconductor products described or contained herein do not
 
have specifications
 
that can  
handle applications that require extremely high levels of reliability, such as life-support
 
systems, aircraft’s control systems, or  
other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with  
your MSKSEMI Semiconductor representative
 
nearest you
 
before using any MSKSEMI Semiconductor products described  
or contained herein in such
 
applications.  
■
MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products  
at values that  
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in  
products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein.  
■
Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the  
performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the  
performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment.
T
o  
verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test  
devices mounted in the customer’sproducts orequipment.  
■
MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor  
products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could  
endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing  
equipment, adopt safety measures so that these kinds of accidents
 
or events cannot occur. Such measures include but are  
not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design.  
■
In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described
 
or contained  
herein are controlled under any of applicable local export control laws and regulations, such products must not be exported  
without obtaining the export license from theauthorities
 
concerned in accordance
 
with the above law.  
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No part of this publication may be reproduced or transmitted in any form or by any means, electronic or  
mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior  
written permission of MSKSEMI Semiconductor.  
■
Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume  
production. MSKSEMI Semiconductor believes information herein is accurate and
 
reliable, but no guarantees are made or  
implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties.  
■
Any and all information described or contained herein are subject to change without notice due to  
product/technology improvement, etc. Whendesigning equipment, referto the “Delivery Specification” for the MSKSEMI  
Semiconductor productthat you intend to use.  
Copyright© Msksemi Incorporated