MSKSEMI-MMST4401

Part #MSKSEMI-MMST4401
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MSKSEMI-MMST4401
MMST4401  
Product specification  

MMST4401  
Reference News  
FEATURES  
Complementary to MMST4403  
PACKAGE OUTLINE  
MARKING  
Small Surface Mount Package  
1. BASE  
2. EMITTER  
3. COLLECTOR  
K3X  
SOT-323  
MAXIMUM RATINGS (Ta=25
℃
unless otherwise noted)  
Symbol  
Parameter  
Value  
Unit  
Collector-Base Voltage  
60  
V
V

CBO  

Collector-Emitter Voltage  
Emitter-Base Voltage  
40  
6
V
V
V

CEO  

V

EBO  

I

C  

Collector Current  
600  
200  
625  
mA  
mW  
℃
/W  
Collector Power Dissipation  
P

C  

Thermal Resistance From Junction To Ambient  
R

ΘJA  

Operation Junction
 
and  
T

J

,T

stg  

℃
-55
~
+150  
Storage Temperature Range  
ELECTRICAL CHARACTERISTICS (Ta=25
℃
unless otherwise specified)  
Parameter  
Symbol  
V

(BR)CBO  

V

(BR)CEO  

V

(BR)EBO  

I

CBO  

Test conditions  
I

C

=100µA, I

E

=0  
Min  
60  
Typ  
Max  
Unit  
V
Collector-base breakdown voltage  
Collector-emitter breakdown voltage  
Emitter-base breakdown voltage  
Collector cut-off current  
I

C

=1mA, I

B

=0  
40  
V
I

E

=100µA, I

C

=0  
6
V
V

CB

=35V, I

E

=0  
100  
500  
nA  
nA  
V

CE

=35V, I

B

=0  
Collector cut-off current  
I

CEO  

V

CE

=1V, I

C

=100µA  
V

CE

=1V, I

C

=1mA  
20  
40  
V

CE

=1V, I

C

=10mA  
V

CE

=1V, I

C

=150mA  
V

CE

=2V, I

C

=500mA  
I

C

=150mA, I

B

=15mA  
I

C

=500mA, I

B

=50mA  
I

C

=150mA, I

B

=15mA  
I

C

=500mA, I

B

=50mA  
V

CE

=10V,I

C

=20mA , f=100MHz  
V

CB

=5V, I

E

=0, f=1MHz  
80  
DC current gain  
h

FE  

100  
40  
300  
0.4  
0.75  
0.95  
1.2  
V
V
Collector-emitter saturation voltage  
Base-emitter saturation voltage  
V

CE(sat)  

0.75  
250  
V
V

BE(sat)  

V
MHz  
pF  
Transition frequency  
f

T  

6.5  
Collector output capacitance  
C

ob  

Copyright© Msksemi Incorporated  

MMST4401  
Static Characteristic  
h

FE

——  
I

C  

250  
200  
150  
100  
50  
1000  
COMMON  
EMITTER  
T

a

=25
℃
 
COMMON EMITTER  
V

CE

= 1V  
1mA  
T

a

=100
℃  
0.9mA  
0.8mA  
T

a

=25
℃  
0.7mA  
0.6mA  
100  
0.5mA  
0.4mA  
0.3mA  
0.2mA  
I

B

=0.1mA  
0
10  
600  
0
1
2
3
4
1
10  
100  
COLLECTOR CURRENT
 
I

C

(mA)  
COLLECTOR-EMITTER VOLTAGE
 
V

CE

(V)  
V

CEsat

——  
I

C  

V

BEsat

——  
I

C  

1000  
1000  
800  
600  
400  
200  
0
β
=10  
β
=10  
T

a

=25
℃  
T

a

=100
℃  
100  
T

a

=100
℃  
T

a

=25
℃  
10  
0.5  
600  
0.1  
1
10  
100  
0.1  
1
10  
100  
600  
COLLECTOR CURREMT
 
I

C

(mA)  
COLLECTOR CURREMT
 
I

C

(mA)  
I

C

—— V

BE  

f

T

—— I

C  

500  
600  
COMMON EMITTER  

CE

=1V  
COMMON EMITTER  

CE

=10V  
T

a

=25
℃  
V
V
100  
10  
1
100  
0.1  
10  
0
200  
400  
600  
800  
1000  
1200  
10  
20  
30  
40  
COLLECTOR CURRENT
 
I

C

(mA)  
BASE-EMMITER VOLTAGE
 
V

BE

(mV)  
P

C

—— T

a  

C

ob

/C

ib

——  
V

CB

/V

EB  

400  
300  
200  
100  
0
100  
f=1MHz  
I

E

=0/I

C

=0  
T

a

=25
℃  
C

ib  

10  
C

ob  

1
0.1  
0
25  
50  
75  
100  
125  
150  
30  
1
10  
AMBIENT TEMPERATURE
 
T

a

(
℃
)  
REVERSE VOLTAGE  
V
(V)  
Copyright© Msksemi Incorporated  

MMST440
1  
PACKAGEMECHANICALDATA  
Dimensions In Millimeters  
Dimensions In Inches  
Symbol  
Min  
Max  
1.100  
0.100  
1.000  
0.400  
0.150  
2.200  
1.350  
2.450  
Min  
Max  
0.043  
0.004  
0.039  
0.016  
0.006  
0.087  
0.053  
0.096  
A
A1  
A2  
b
0.900  
0.000  
0.900  
0.200  
0.080  
2.000  
1.150  
2.150  
0.035  
0.000  
0.035  
0.008  
0.003  
0.079  
0.045  
0.085  
c
D
E
E1  
e
0.650 TYP  
0.525 REF  
0.026 T
Y
P  
0.021 REF  
e1  
L
1.200  
1.400  
0.047  
0.055  
L1  
ꢀ
0.260  
0°  
0.460  
8°  
0.010  
0°  
0.018  
8°  
Suggested Pad Layout  
Note:  
1.Controlling dimension:in millimeters.  
2.General tolerance:±0.05mm.  
3.The pad layout is for reference purposes only.  
REEL SPECIFICATION  
P/N  
PKG  
QTY  
MMST440
1
 
SOT-323  
3000  
Copyright© Msksemi Incorporated  

MMST4401  
Attention  
■
Any and all MSKSEMI Semiconductor products described or contained herein do not
 
have specifications
 
that can  
handle applications that require extremely high levels of reliability, such as life-support
 
systems, aircraft’s control systems, or  
other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with  
your MSKSEMI Semiconductor representative
 
nearest you
 
before using any MSKSEMI Semiconductor products described  
or contained herein in such
 
applications.  
■
MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products  
at values that  
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in  
products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein.  
■
Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the  
performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the  
performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment.
T
o  
verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test  
devices mounted in the customer’sproducts orequipment.  
■
MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor  
products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could  
endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing  
equipment, adopt safety measures so that these kinds of accidents
 
or events cannot occur. Such measures include but are  
not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design.  
■
In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described
 
or contained  
herein are controlled under any of applicable local export control laws and regulations, such products must not be exported  
without obtaining the export license from theauthorities
 
concerned in accordance
 
with the above law.  
■
No part of this publication may be reproduced or transmitted in any form or by any means, electronic or  
mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior  
written permission of MSKSEMI Semiconductor.  
■
Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume  
production. MSKSEMI Semiconductor believes information herein is accurate and
 
reliable, but no guarantees are made or  
implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties.  
■
Any and all information described or contained herein are subject to change without notice due to  
product/technology improvement, etc. Whendesigning equipment, referto the “Delivery Specification” for the MSKSEMI  
Semiconductor productthat you intend to use.  
Copyright© Msksemi Incorporated