Murata-Electronics-BLA31BD471SN4D
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Spec. No. JENF243A
–
0008N-01
P 1 / 9
Reference Only
Chip Ferrite Bead Array
BLA31
□□□□□
SN4
□
Reference Specification
1. Scope
This reference specification applies to Chip Ferrite Bead Array
BLA31 Series
used for electronic machinery.
2. Part Numbering
(ex.) BL
(1)
A
(2)
31
(3)
AG
(4)
121
(5)
S
N
4
(8)
D
(9)
(6) (7)
(1)Product ID
(2)Type
(6)Performance
(7)Category
(3)Dimension (L×
Ｗ
)
(8)Numbers of Circuit
(4)Characteristics
(9)Packaging (D:Taping / B:Bulk)
(5)Typical Impedance at 100MHz
3. Rating
DC Resistance
(
max. )
Impedance (
)
Insulation
Resistance
between
Rated
Current
(mA)
Customer
Part Number
MURATA
Part Number
at 100MHz ,
Under Standard
Testing Condition)
Remark
Initial
Values
Values
After
Elements
Testing
BLA31AG300SN4D
BLA31AG300SN4B
BLA31AG600SN4D
BLA31AG600SN4B
BLA31AG121SN4D
BLA31AG121SN4B
BLA31AG221SN4D
BLA31AG221SN4B
BLA31AG601SN4D
BLA31AG601SN4B
BLA31AG102SN4D
BLA31AG102SN4B
30±25%
60±25%
200
200
150
150
100
50
0.10
0.15
0.20
0.25
0.35
0.45
0.20
0.25
0.30
0.35
0.45
0.55
120±25%
220±25%
600±25%
1000±25%
For
general
use
100M
min.
BLA31BD121SN4D
BLA31BD121SN4B
BLA31BD221SN4D
BLA31BD221SN4B
BLA31BD471SN4D
BLA31BD471SN4B
BLA31BD601SN4D
BLA31BD601SN4B
BLA31BD102SN4D
BLA31BD102SN4B
120±25%
220±25%
470±25%
600±25%
1000±25%
150
150
100
100
50
0.30
0.35
0.40
0.45
0.55
0.40
0.45
0.50
0.55
0.65
For
high
speed
signal
line
· Operating Temperature : -55°C to +125°C
· Storage Temperature : -55°C to +125°C
MURATA MFG.CO., LTD.
Spec. No. JENF243A
–
0008N-01
P 2 / 9
Reference Only
4. Style and Dimensions
■
Equivalent Circuit
3.2±0.2
:Electrode
0.8
±0.1
(in mm)
0.4±0.2
No polarity
■
Unit Mass (Typical value)
0.018g
5. Marking
No marking.
6. Standard Testing Conditions
Unless otherwise specified
In case of doubt
Temperature : Ordinary Temp. (15
°
C to 35
°
C )
Temperature : 20
°
C
±
2
°
C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7. Electrical Performance
No. Item
Specification
Meet item 3.
Test Method
7.1 Impedance
Measuring Frequency : 100 MHz ± 1 MHz
Measuring Equipment : Agilent 4291A or the equivalent
(OSC = 0.05 V)
Test Fixture : Agilent 16192A
7.2 DC
Resistance
7.3 Insulation
Resistance
between Elements
Measuring Equipment : Digital multi meter
Measuring Voltage : 5 V(DC)
Measuring Time
: 1 min max.
8. Mechanical Performance
No.
Item
Specification
Test Method
8.1 Appearance
and Meet
item 4.
Dimensions
Visual Inspection and measured with Slide Calipers.
8.2 Bonding
Strength
Meet Table 1.
It shall be soldered on the substrate.
Applying Force(F) : 9.8 N
Table 1
Applying Time : 5s ± 1s
Product
F
Appearance
Impedance
Change
No damage
Within ±30%
(at 100MHz)
DC
Resistance
Meet item 3.
Substrate
8.3 Bending
Strength
It shall be soldered on the substrate.
Substrate : Glass-epoxy substrate
(100mm
40mm
1.0mm)
Deflection : 2.0 mm
Speed of Applying Force : 0.5 mm / s
Keeping Time : 30 s
Pressure jig
R340
F
Deflection
45mm
45mm
Product
MURATA MFG.CO., LTD.
Spec. No. JENF243A
–
0008N-01
P 3 / 9
Reference Only
No.
Item
Specification
Test Method
8.4 Solderability
The electrodes shall be at least
95% covered with new solder
coating.
Flux : Ethanol solution of rosin, 25 (wt)%
Pre-Heating : 150 °C ± 10 °C, 60 s ~ 90 s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240 °C ± 5 °C
Immersion Time 3 s ± 1 s
Immersion and emersion rates : 25mm / s
Flux : Ethanol solution of rosin, 25 (wt)%
Pre-Heating : 150 °C ± 10 °C, 60 s ~ 90 s
Solder Sn-3.0Ag-0.5Cu
8.5 Resistance
to Soldering
Heat
Meet Table 1.
Solder Temperature : 270 °C ± 5 °C
Immersion Time : 10 s ± 1 s
Immersion and emersion rates : 25mm / s
Then measured after exposure in the room condition
for 48h ± 4h.
8.6 Vibration
8.7 Drop
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5 mm
Testing Time : A period of 2 hours in each of
3 mutually perpendicular directions.
Products shall be no failure
after tested.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75 cm
Attitude from which the product is dropped
: 3 directions
The Number of Time : 3 times for each direction
(Total 9 times)
9. Environmental Performance
(It shall be soldered on the substrate.)
No. Item
Specification
Meet Table 1.
Test Method
9.1 Temperature
Cycle
1 cycle:
1 step : -55
°
C(+0
°
C,-3
°
C) / 30min ± 3min
2 step : Ordinary temp. / 10min to 15min
3 step : +125
°
C(+3
°
C,-0
°
C) / 30min ± 3min
4 step:Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room
condition for 48h ± 4h.
9.2 Humidity
Temperature : 40 °C ± 2 °C
Humidity : 90 %(RH) to 95 %(RH)
Time : 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 48h ± 4h.
9.3 Heat
Life
Temperature : 125 °C ± 3 °C
Applying Current : Rated Current
Time : 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 48h ± 4h.
9.4 Cold
Resistance
Temperature : – 55 ± 2 °C
Time : 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 48h ± 4h.
MURATA MFG.CO., LTD.
Spec. No. JENF243A
–
0008N-01
P 4 / 9
Reference Only
10. Specification of Packaging
10.1. Appearance and Dimensions (8mm-wide paper tape)
2.0±0.1
4.0±0.1
1.5±
0.1
4.0±0.1
0
1.8±0.1
1.1max.
(in mm)
Direction of feed
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously and sealed
by top tape and bottom tape.
(2)
The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
10.2. Tape Strength
(1) Pull Strength
Top tape
5N min.
Bottom tape
Top tape
165 to 180 degree
F
(2) Peeling off force of Top tape
0.1N to 0.6N (Minimum value is typical.)
Speed of Peeling off : 300mm / min
Bottom tape
Base tape
10.3. Taping Condition
(1) Standard quantity per reel
Quantity per 180mm reel : 4000 pcs. / reel
(2) There shall be leader-tape (top tape and empty tape ) and trailer- tape (empty tape) as follows.
(3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(
1), RoHS
marking
(
2), Quantity, etc)
1) « Expression of Inspection No. »
□□
OOOO
(1)
(2)
(3)
(1)
Factory Code
(2)
Date
First digit
: Year
/ Last digit of year
Second digit
Third, Fourth digit : Day
: Month / Jan. to Sep.
1 to 9, Oct. to Dec.
O, N, D
(3)
Serial No.
2) « Expression of RoHS
marking
»
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
MURATA MFG.CO., LTD.
Spec. No. JENF243A
–
0008N-01
P 5 / 9
Reference Only
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked on
a label and the label is stuck on the box.
(Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS
marking
(
2) , Quantity , etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
Leader
Trailer
160 min.
2.0±0.5
190 min.
210 m
i
n.
Label
Empty tape
Top tape
13.0±0.2
60±
1
0
21.0±0.8
Direction of feed
9±
1
0
13±1.4
180
±
0
(in mm)
3
10-4. Specification of Outer Case
Outer Case Dimensions
(mm)
Label
Standard Reel Quantity in Outer Case
(Reel)
H
W
D
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an order.
W
11.
！
Caution
11.1. Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause
a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
11.2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(6) Disaster prevention / crime prevention equipment
(7) Traffic signal equipment
(8) Transportation equipment (vehicles, trains, ships, etc.)
(9) Data-processing equipment
(10) Application of similar complexity and/or with reliability
requirements to the applications listed in the above.
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
12. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
MURATA MFG.CO., LTD.
Spec. No. JENF243A
–
0008N-01
P 6 / 9
Reference Only
12.1. Land pattern designing
· Standard land dimensions (Flow and Reflow soldering)
0.4
0.8
The excessive heat by land pads may cause
deterioration at joint of products with substrate.
Pattern
Solder resist
(in mm)
0.8
Product
2.2 to 2.6
12.2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux
Solder
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 µm
Use of Sn-Zn based solder will deteriorate performance of products.
In case of using Sn-Zn based solder, please contact Murata in advance.
(2) Soldering conditions
· Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is
limited to 150 °C max. Also cooling into solvent after soldering should be in such a way that the temperature
difference is limited to 100 °C max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
· Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
□
Flow soldering profile
Temp.
(
℃)
265±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.
(
s)
Standard Profile
Limit Profile
Pre-heating
Heating
Cycle of flow
150°C , 60s min.
250°C
、
4~6s
2 times
265±3°C
、
5s max.
2 times
MURATA MFG.CO., LTD.
Spec. No. JENF243A
–
0008N-01
□
Reflow soldering profile
P 7 / 9
Reference Only
Temp.
(
℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s
～60
s
60s max.
90s±30s
Time.
(
s)
Standard Profile
Limit Profile
Pre-heating
Heating
150
～
180°C
、
90s
±
30s
above 220°C
、
30s
～
60s above
230°C
、
60s max.
Peak temperature
Cycle of reflow
245
±
3°C
2 times
260°C,10s
2 times
12.3. Reworking with soldering iron
· Pre-heating : 150 °C , 1 min
· Tip temperature: 350°C max.
· Soldering time : 3 (+1, -0) seconds.
· Soldering iron output : 80 W max.
· Tip diameter :
3mm max.
·Times : 2times max.
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
12.4. Solder Volume
Solder shall be used not to be exceeded as shown below.
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendabl
1/3T t T
≦ ≦
(T:Chip thickness)
t
12.5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
a
Products shall be located in the sideways
direction (Length : a < b) to the mechanical
b
stress.
Poor example
〈
〉
Good example
〈
〉
(2) Products location on P.C.B. separation.
C
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A > C > B
D.
B
Seam
D
A
a
b
Slit
Length:a b
12.6. Potential between Elements
Products should be used within 5 V (DC) between elements.
When the products are used the excessive voltage over 5 V (DC) , it may cause breaking of inner electrode
and / or decreasing of insulation resistance between elements.
MURATA MFG.CO., LTD.
Spec. No. JENF243A
–
0008N-01
P 8 / 9
Reference Only
12.7. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
12.8. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60 °C max. (40 °C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power : 20 W / l max.
Frequency : 28 kHz to 40 kHz
Time : 5 min max.
(3) Cleaner
1.Cleaner
·
Isopropyl alcohol (IPA)
2.Aqueous agent
·
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Other cleaning
Please contact us.
12.9.Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
12.10. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of
the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
12.11. Resin coating
The impedance value may change and/or it may affect on the product’s performance due to high cure-stress of resin
to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use,
please make the reliability evaluation with the product mounted in your application set.
12.12. Storage Conditions
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
·Products should be stored in the warehouse on the following conditions.
Temperature : – 10 °C to 40 °C
Humidity
: 15 % to 85 % relative humidity
No rapid change on temperature and humidity
·Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
·Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
·Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
·Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
MURATA MFG.CO., LTD.
Spec. No. JENF243A
–
0008N-01
13. Notes
P 9 / 9
Reference Only
!
(1) Please make sure that your product has been evaluated in view of your specifications with our product
being mounted to your product.
(2)
Y
o
u are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
