Murata-Electronics-BLM18EG221TZ1D
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Reference Only
Spec. No. JENF243A-9124A-01
P.1/8
GHz Noise Suppression Chip Ferrite Bead
BLM18EG
□□□□
Z1
□
Murata Standard Reference Specification
[AEC-Q200]
1. Scope
This reference specification applies to Chip Ferrite Bead BLM18EG_
□
Z Series for Automotive Electronics
based on
AEC-Q200 except for Power train and Safety.
2. Part Numbering
(ex.)
BL
(1)
M
(2)
18
(3)
EG
(4)
601
(5)
S
Z
1
D
(9)
(6) (7) (8)
(1)Product ID
(2)Type (3)Dimension(L×W) (4)Characteristics (5)Typical
Impedance at 100MHz
(6)Performance (7)Category(for
Automotive Electronics)
(8)Numbers of Circuit
(9)Packaging(D:Taping)
3. Rating
DC Resistance
(
Ω
max. )
(*1)
Rated refer
to below
Impedance (
Ω
)
(Under Standard Testing Condition)
(*1)
(refer to below comment)
Customer
Part Number
MURATA
Part Number
ESD Rank
2:2kV
Current
(mA)
comment)
Initial Values
Values After
Testing
Remark
at 1GHz
at 100MHz
Typical
BLM18EG101TZ1D
BLM18EG221TZ1D
BLM18EG331TZ1D
BLM18EG391TZ1D
BLM18EG121SZ1D
BLM18EG221SZ1D
100±25%
220±25%
330
±
25%
390±25%
120±25%
220±25%
470
±
25%
600±25%
80 min.
180 min.
280 min.
320 min.
90 min.
140
300
450
520
145
260
2000
1000
500
0.045
0.15
0.21
0.30
0.04
0.05
0.07
0.21
0.30
0.40
0.06
0.06
For
general
use
2
2
(Thin type)
500
2000
2000
For
general
use
160 min.
BLM18EG471SZ1D
BLM18EG601SZ1D
340 min.
450 min.
550
700
500
500
0.21
0.35
0.30
0.45
•
Operating Temperature : -55°C to +125°C
•
Storage Temperature : -55°C to +125°C
(*1)
Standard Testing Conditions
<
Unless otherwise specified
>
Temperature : Ordinary Temp. (15
°
C to 35
°
C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
<
In case of doubt
>
Temperature : 20
°
C
±
2
°
C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
3
As for BLM18EG type,Rated Current is derated as right figure
depending on the operating temperature.
2A
2
1
0
85
125
Operating Temperature
（℃）
4. Style and Dimensions
1.6±0.15
0.8±0.15
■
Equivalent Circuit
0.4±0.2
Resistance element becomes
dominant at high frequencies.
(
)
: Electrode
■
Unit Mass (Typical value)
BLM18EG
∗∗∗
TZ1 : 0.004g
BLM18EG
∗∗∗
SZ1 : 0.005g
Part Number
Dimension(T)
0.5±0.15
BLM18EG
∗∗∗
TZ1
BLM18EG
∗∗∗
SZ1
0.8±0.15
(in mm)
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9124A-01
P.2/8
5. Marking
No marking.
6. Specifications
6-1. Electrical Performance
No.
Item
Specification
Test Method
6-1-1 Impedance
Meet item 3.
Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz
Measuring Equipment :
KEYSIGHT
4291A or the equivalent
Test Fixture :
KEYSIGHT
16192A or the equivalent
Measuring Equipment : Digital multi meter
6-1-2 DC
Resistance
Meet item 3.
*Except resistance
of the Substrate and Wire
6-2. Mechanical Performance
(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Murata Specification / Deviation
No.
3
Stress
Test Method
High
1000hours at 125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
Table A
Temperature
Exposure
Appearance No
damage
Impedance
Change
Within ±30%
(at 100MHz)
DC
Resistance
Meet item 3.
Meet Table B.
Table B
4
Temperature Cycling
1000cycles
-55 deg C to +125 deg C
Set for 24hours at room
temperature, then measured.
Appearance No
damage
Impedance
Within
Change
(at 100MHz)
+50
%
/-10%
DC
Meet item 3.
Resistance
5
7
Destructive
Physical Analysis
Per EIA469
No electrical tests
No defects
Biased Humidity
1000hours at 85 deg C, 85%RH
Meet Table A after testing.
Apply max rated current.
9
8
External Visual
Operational Life
Visual inspection
No abnormalities
Meet Table A after testing.
If the rated current of parts exceed 1A,
the operating temperature should be 85 deg C.
Apply 125 deg C 1000hours
Set for 24hours at room
temperature, then measured
No defects
10 Physical
Dimension
Meet ITEM 4
（
Style and Dimensions
）
Not Applicable
12 Resistance
to Solvents
Per MIL-STD-202
Method 215
Meet Table A after testing.
Meet Table A after testing.
13 Mechanical
Shock
Per MIL-STD-202 Method 213
Condition F
1500g’s (14.7N)/0.5ms/
Half sine
5g’s(0.049N) for 20 minutes,
12cycles each of 3 orientations
Test from 10-2000Hz.
14 Vibration
15 Resistance
Solder temperature
260C+/-5 deg C
Pre-heating:150C +/-10 deg,60s to 90s
Meet Table A after testing.
to Soldering Heat
Immersion time 10s
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9124A-01
AEC-Q200
P.3/8
Murata Specification / Deviation
Test Method
No.
Stress
17 ESD
Per AEC-Q200-002
Meet Table A after testing.
ESD Rank: Meet Item 3.(Rating)
18 Solderability
19 Electrical
Per J-STD-002
Method b : Not Applicable
95% of the terminations is to be soldered.
Measured : Impedance
No defects
Characterization
20 Flammability
21 Board
Flex
Per UL-94
Not Applicable
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding time
Per AEC-Q200-006
Meet Table A after testing.
22 Terminal
Strength
No defects
30 Electrical
Transient
Per ISO-7637-2
Not Applicable
Conduction
7. Specification of Packaging
7-1. Appearance and Dimensions
(8mm-wide paper tape)
2.0±0.
05
+0.1
4.0±0.1
4.0±0.1
φ
1.5
-0
Dimension
(a)
Part Number
0.85 max.
1.1 max.
(in mm)
BLM18EG
∗∗∗
TZ1
BLM18EG
∗∗∗
SZ1
a
1.05±0.1
(1) Taping
Direction of feed
Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point
The base tape and top tape have no spliced point
(4) Cavity
There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous.The specified quantity per reel is kept.
7-2. Tape Strength
(1)Pull Strength
Top tape
165 to 180 degree
Top tape
Bottom tape
F
5N min.
Bottom tape
Base tape
(2)Peeling off force of Top tape
0.1N to 0.6N (Minimum value is typical.)
∗
Speed of Peeling off:300mm/min
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9124A-01
P.4/8
7-3. Taping Condition
(1) Standard quantity per reel
Quantity per 180mm reel: 4000 pcs. / reel
(2) There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more
than 5 pitch.
(4) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(
∗
1), RoHS marking (
∗
2), Quantity, etc)
∗
1) « Expression of Inspection No. »
□□
OOOO
×××
(1)
(2)
(3)
(1)
Factory Code
(2)
Date
First digit
: Year
/ Last digit of year
Second digit
Third, Fourth digit : Day
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
(3)
Serial No.
∗
2) « Expression of RoHS marking »
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked on
a label and the label is stuck on the box.
(Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking(
∗
2) , Quantity , etc)
(6) Dimensions of reel and taping(leader-tape, trailer-tape)
Leader
Trailer
160 min.
2.0±0.5
190 min.
210 min.
Label
Empty tape
Top tape
13.0±0.2
φ
60±
1
φ
0
21.0±0.8
φ
Direction of feed
9±
1
0
13±1.4
180
±
0
φ
3
(in mm)
7-4. Specification of Outer Case
Outer Case Dimensions
(mm)
Label
Standard Reel Quantity in Outer Case
(Reel)
H
W
D
H
186
186
93
5
D
∗
Above Outer Case size is typical. It depends on a quantity of an order.
W
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9124A-01
P.5/8
8.
！
Caution
8-1.Rating
Do not use products beyond the Operating Temperature Range and Rated Current.
8-2.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause
a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
8-3. Fail Safe
Be sure to provide an appropreate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
8-4. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1)Aircraft equipment
(2)Aerospace equipment
(3)Undersea equipment
(4)Power plant control equipment
(5)Medical equipment
(6)Disaster prevention / crime prevention equipment
(7)Traffic signal equipment
(8)Transportation equipment (trains, ships, etc.)
(9)Data-processing equipment
(10)Applications of similar complexity and /or reliability requirements to the applications listed in the above.
9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1. Land pattern designing
•
Standard land dimensions (Flow and Reflow soldering)
Chip Ferrite Bead
c
Soldering
Flow
Reflow
a
0.8
0.7
b
2.5
2.0
c
0.7
0.7
a
b
Solder Resist
Pattern
(in mm)
9-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100
µ
m to 200
μ
m
(2) Soldering conditions
•
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150
℃
max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100
℃
max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
•
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration
of product quality.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9124A-01
P.6/8
□
Flow soldering profile
Temp.
(
℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.
(
s)
Standard Profile
Limit Profile
Pre-heating
Heating
Cycle of flow
150°C, 60s min.
250°C, 4s~6s
2 times
265°C±3°C, 5s max.
2 times
□
Reflow soldering profile
Temp.
(
℃)
260℃
230℃
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s
～60
s
60s max.
90s±30s
Time.
(
s)
Standard Profile
Limit Profile
Pre-heating
Heating
Peak temperature
Cycle of reflow
150°C~180°C, 90s±30s
above 220°C, 30s~60s
245°C±3°C
above 230°C, 60s max.
260°C, 10s
2 times
2 times
9-3. Reworking with soldering iron
•
Pre-heating: 150°C, 1 min
•
Soldering iron output: 80W max.
•
Tip diameter:
φ
3mm max.
•
Times : 2times max.
•
Tip temperature: 350°C max.
•
Soldering time : 3(+1,-0) s
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite
material due to the thermal shock.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9124A-01
P.7/8
9-4. Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Recommendable
t
1/3T
≦
t
≦
T
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
9-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are are not subject to the mechanical stress for board warpage.
<Products direction>
a
Products shall be located in the sideways
direction (Length:a
<
b) to the mechanical
stress.
b
Poor example
〈
〉
Good example
〈
〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
>
>
D *1
B
C
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
9-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9124A-01
P.8/8
9-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases
and etc.
(the sea breeze, Cl
2
, H
2
S, NH
3
, SO
2
, NO
2
,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
9-8. Resin coating
The impedance value may change and/or it may affect on the product’s performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior
to use, please make the reliability evaluation with the product mounted in your application set.
9-9. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA)
(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/
max. Frequency:28kHz
to 40kHz
Time:5 min max.
(3)Cleaner
1.Cleaner
•
Isopropyl alcohol (IPA)
2.Aqueous agent
•
PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5)Other cleaning
Please contact us.
9-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
9-11. Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
•
Products should be stored in
the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
•
Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
•
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
•
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
•
Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
10.
! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
