Murata-Electronics-BLM18KG102SZ1D
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Spec No.: JENF243A_9122S -01
P1/13
CHIP FERRITE BEAD BLM18
□□□□□□
Z1
□
Murata Standard REFERENCE SPECIFICATION [AEC-Q200]
1. Scope
This specification applies to chip ferrite bead BLM18_
□
Z series for automotive electronics based on AEC-Q200 except for
power trains and safeties.
2. Part Numbering
(Ex.)
BL
M
18
AG
121
S
Z
1
D
Product Type
ID
Dimension Characteristics Impedance
Performance
Category
Numbers
of circuit
Packaging
D: taping
(L × W)
(Typical value
at 100 MHz)
3. Part Number and Rating
Operating temperature range
Storage temperature range
-55°C to +125°C
-55°C to +125°C
Impedance
(
Ω
)
at 100 MHz
Rated current
*1
(mA)
DC resistance
(
Ω
max.)
Customer
Part number
Murata
Part number
ESD Rank
2: 2 kV
Remark
Ambient
Ambient
Values
after
testing
Initial
values
Typ. temperature
temperature
85°C
–
125°C
1000
For DC power
line
BLM18PG300SZ1D 20
min.
BLM18PG330SZ1D 33±25%
BLM18PG600SZ1D 40
min.
30
33
60
0.05
0.10
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
For DC power
line
3000
–
1000
1000
1000
1000
1000
1000
1000
4000
2500
1900
1000
800
0.025 0.050
For DC power
line
0.10
0.05
0.09
0.10
0.15
0.20
0.20
0.10
0.18
0.14
0.20
0.26
For DC power
line
BLM18PG121SZ1D 120±25%
120
BLM18PG181SZ1D 180±25%
180
BLM18PG221SZ1D 220±25%
220
BLM18PG331SZ1D 330±25%
330
BLM18PG471SZ1D 470±25%
470
2000
1500
1400
1200
–
For DC power
line
For DC power
line
For DC power
line
For DC power
line
For DC power
line
BLM18SP300SZ1D
30±10
30
6000
3700
2800
1500
1200
2200
1700
1500
0.008 0.010
0.022 0.026
0.040 0.048
0.140 0.168
0.185 0.222
0.050 0.060
0.080 0.095
0.130 0.145
For DC power
line
BLM18SP101SZ1D 100±25%
100
BLM18SP221SZ1D 220±25%
220
BLM18SP601SZ1D 600±25%
600
BLM18SP102SZ1D 1000±25%
1000
BLM18KG221SZ1D 220±25%
220
BLM18KG331SZ1D 330±25%
330
BLM18KG471SZ1D 470±25%
470
For DC power
line
For DC power
line
For DC power
line
For DC power
line
1500
1200
1000
For DC power
line
For DC power
line
MURATA MFG CO., LTD
Spec No.: JENF243A_9122S -01
P2/13
Impedance
(
Ω
)
at 100 MHz
Rated current
*1
(mA)
DC resistance
(
Ω
max.)
Customer
Part number
Murata
Part number
ESD Rank
2: 2 kV
Remark
Ambient
Ambient
Values
Initial
Typ. temperature
temperature
after
values
85°C
1300
125°C
1000
testing
For DC power
line
BLM18KG601SZ1D 600±25%
600
BLM18KG102SZ1D 1000±25%
1000
BLM18AG121SZ1D 120±25%
120
BLM18AG151SZ1D 150±25%
150
BLM18AG221SZ1D 220±25%
220
BLM18AG331SZ1D 330±25%
330
BLM18AG471SZ1D 470±25%
470
BLM18AG601SZ1D 600±25%
600
BLM18AG102SZ1D 1000±25%
1000
0.150 0.165
0.200 0.230
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
For DC power
line
1000
800
800
700
700
600
550
500
450
800
500
700
500
700
500
600
500
300
600
300
600
550
300
200
500
For general
use
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
0.18
0.25
0.25
0.30
0.35
0.38
0.50
0.05
0.2
0.28
0.35
0.35
0.40
0.45
0.48
0.60
0.10
0.3
For general
use
For general
use
For general
use
For general
use
For general
use
For general
use
For high speed
signal line
BLM18BB050SZ1D 5±25%
BLM18BA050SZ1D 5±25%
BLM18BB100SZ1D 10±25%
BLM18BA100SZ1D 10±25%
BLM18BB220SZ1D 22±25%
BLM18BA220SZ1D 22±25%
BLM18BB470SZ1D 47±25%
BLM18BD470SZ1D 47±25%
BLM18BA470SZ1D 47±25%
BLM18BB600SZ1D 60±25%
BLM18BA750SZ1D 75±25%
BLM18BB750SZ1D 75±25%
5
For high speed
signal line
5
For high speed
signal line
10
10
22
22
47
47
47
60
75
75
0.10
0.25
0.20
0.35
0.25
0.3
0.20
0.35
0.30
0.45
0.35
0.4
For high speed
signal line
For high speed
signal line
For high speed
signal line
For high speed
signal line
For high speed
signal line
For high speed
signal line
0.55
0.25
0.70
0.30
0.30
0.4
0.65
0.35
0.80
0.40
0.40
0.5
For high speed
signal line
For high speed
signal line
For high speed
signal line
For high speed
signal line
BLM18BB121SZ1D 120±25%
120
BLM18BD121SZ1D 120±25%
120
BLM18BA121SZ1D 120±25%
120
BLM18BB141SZ1D 140±25%
140
For high speed
signal line
For high speed
signal line
0.9
1.0
For high speed
signal line
0.35
0.45
MURATA MFG CO., LTD
Spec No.: JENF243A_9122S -01
P3/13
Impedance
(
Ω
)
at 100 MHz
Rated current
*1
(mA)
DC resistance
(
Ω
max.)
Customer
Part number
Murata
Part number
ESD Rank
2: 2 kV
Remark
Ambient
Ambient
Values
Initial
Typ. temperature
temperature
after
values
85°C
–
125°C
450
testing
For high speed
signal line
BLM18BB151SZ1D 150±25%
150
BLM18BD151SZ1D 150±25%
150
BLM18BB221SZ1D 220±25%
220
BLM18BD221SZ1D 220±25%
220
BLM18BB331SZ1D 330±25%
330
BLM18BD331SZ1D 330±25%
330
BLM18BD421SZ1D 420±25%
420
BLM18BB471SZ1D 470±25%
470
BLM18BD471SZ1D 470±25%
470
BLM18BD601SZ1D 600±25%
600
BLM18BD102SZ1D 1000±25%
1000
BLM18BD152SZ1D 1500±25%
1500
BLM18BD182SZ1D 1800±25%
1800
BLM18BD222SZ1D 2200±25%
2200
BLM18BD252SZ1D 2500±25%
2500
0.37
0.4
0.47
0.5
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
For high speed
signal line
–
300
450
For high speed
signal line
–
0.45
0.45
0.58
0.5
0.55
0.55
0.68
0.6
For high speed
signal line
–
250
For high speed
signal line
–
400
For high speed
signal line
–
250
For high speed
signal line
–
250
0.55
0.85
0.55
0.65
0.85
1.2
0.65
0.95
0.65
0.75
0.95
1.3
For high speed
signal line
–
300
For high speed
signal line
–
250
For high speed
signal line
–
200
For high speed
signal line
–
200
For high speed
signal line
–
150
For high speed
signal line
–
150
1.5
1.6
For high speed
signal line
–
150
1.5
1.6
For high speed
signal line
–
150
1.5
1.6
For DC power
line (thin type)
BLM18SG260TZ1D 26±25%
BLM18SG700TZ1D 70±25%
26
70
6000
4000
3000
2500
1500
8000
6000
5000
3500
3000
1000
1000
1000
1000
1000
5000
4000
3300
2200
1900
0.007 0.012
0.020 0.030
0.025 0.035
0.040 0.055
0.070 0.085
0.004 0.005
0.007 0.012
0.010 0.015
0.022 0.032
0.030 0.040
For DC power
line (thin type)
For DC power
line (thin type)
BLM18SG121TZ1D 120±25%
120
BLM18SG221TZ1D 220±25%
220
BLM18SG331TZ1D 330±25%
330
For DC power
line (thin type)
For DC power
line (thin type)
For DC power
line (thin type)
BLM18SN220TZ1D
22±7
22
26
30
70
For DC power
line (thin type)
BLM18KG260TZ1D 26±25%
BLM18KG300TZ1D 30±25%
BLM18KG700TZ1D 70±25%
For DC power
line (thin type)
For DC power
line (thin type)
For DC power
line (thin type)
BLM18KG101TZ1D 100±25%
100
MURATA MFG CO., LTD
Spec No.: JENF243A_9122S -01
P4/13
Impedance
(
Ω
)
at 100 MHz
Rated current
*1
(mA)
DC resistance
(
Ω
max.)
Customer
Part number
Murata
Part number
ESD Rank
2: 2 kV
Remark
Ambient
Ambient
Values
Initial
Typ. temperature
temperature
after
values
85°C
3000
125°C
1900
testing
For DC power
line (thin type)
BLM18KG121TZ1D 120±25%
120
0.030 0.040
2
*1 As shown in the diagram below, derating is applied to the rated current of the BLM18PG (excluding BLM18PG300SZ1,
BLM18PG600SZ1, BLM18PG471SZ1), BLM18S
□
, BLM18KG series based on the operating temperature.
4. Testing Conditions
Unless otherwise specified
T
e
mperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
T
e
mperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
MURATA MFG CO., LTD
Spec No.: JENF243A_9122S -01
P5/13
5. Appearance and Dimensions
Equivalent circuit
Unit mass (typical value):
BLM18*****SZ1*: 0.005 g
BLM18*****TZ1*: 0.004 g
Part number
T
BLM18SG***TZ1*
BLM18SN***TZ1*
BLM18KG***TZ1*
BLM18*****SZ1*
0.5±0.15
0.6±0.15
0.6±0.15
0.8±0.15
6. Marking
No marking.
7. Electrical Performance
No.
Item
Specification
T
e
st method
7.1 Impedance
Meet chapter 3 ratings.
Measuring equipment: Keysight 4991A or the
equivalent
Measuring frequency: 100 MHz±1 MHz
Measuring fixture: Keysight 16192A or the equivalent
7.2 DC
resistance
Meet chapter 3 ratings.
Measuring equipment: digital multimeter
(Applied to BLM18SN type)
Measuring equipment: Yokogawa 755611 or the
equivalent
Measuring fixture: Keysight 16044A or the
equivalent
Substrate wiring resistance is excluded.
8. AEC-Q200 Requirement
8.1 Performance [(based on table 13 for filter EMI suppressors/filters) AEC-Q200 Rev.D issued June 1,
2010]
AEC-Q200
Murata specification/deviation
No.
3
Stress
T
e
st method
High
1000 h at 125°C
Set for 24 h at room condition, then
measured.
Meet table A after testing.
T
a
ble A
temperature
exposure
Appearance
No damage
Impedance change
(at 100 MHz)
Within ±30% (within ±50% for
BLM18SN)
DC Resistance
Meet chapter 3 ratings.
MURATA MFG CO., LTD
Spec No.: JENF243A_9122S -01
P6/13
AEC-Q200
Murata specification/deviation
No.
4
Stress
T
e
st method
T
e
mperature
cycling
1000 cycles
-55°C to +125°C
Set for 24 h at room condition, then
measured.
Meet table B after testing.
T
a
ble B
Appearance
No damage
Within ±30% (within ±50% for
BLM18SN) (within -10% to
+50% for BLM18KG)
Impedance change
(at 100 MHz)
DC Resistance
Meet chapter 3 ratings.
5
7
Destructive
physical
analysis
Per EIA469
No electrical tests
No defects
Biased humidity
1000 h at 85°C, 85% (RH).
Apply max rated current.
Meet table C after testing.
T
a
ble C
Appearance
No damage
Impedance change
(at 100 MHz)
Within ±30% (within ±50% for
BLM18KG/SN)
DC Resistance
Meet chapter 3 ratings.
8
9
Operational life
Apply 125°C 1000 h
Set for 24 h at room condition, then
measured.
Meet table C after testing.
If the rated current of parts exceed 1 A, the operating
temperature should be 85°C.
External visual
Visual inspection
No abnormalities
No defects
10 Physical
dimension
Meet chapter 5, “Appearance and
Dimensions”.
12 Resistance
to
solvents
Per MIL-STD-202
Method 215
Not applicable
13 Mechanical
shock
Per MIL-STD-202
Method 213
Meet table D after testing.
T
a
ble D
Condition F:
1500 g’s (14.7 N), 0.5 ms, half sine
Appearance
No damage
Impedance change
(at 100 MHz)
Within ±30%
DC Resistance
Meet chapter 3 ratings.
14 Vibration
5 g’s (0.049 N) for 20 min, 12 cycles
each of 3 orientations
Meet table D after testing.
T
e
st from 10 Hz to 2000 Hz
15 Resistance
to
soldering heat
Solder temperature
260°C±5°C
Pre-heating: 150°C±10°C, 60 s to 90 s
Meet table C after testing.
Immersion time 10 s
17 ESD
Per AEC-Q200-002
Per J-STD-002
ESD rank: Refer to chapter 3 ratings.
Meet table D after testing.
18 Solderability
Method b: not applicable
95% of the terminations is to be soldered.
19 Electrical
Measured: impedance
No defects
characterization
20 Flammability
21 Board
flex
Per UL-94
Not applicable
Epoxy-PCB (1.6 mm)
Meet table C after testing.
Deflection 2 mm (min.)
60 s minimum holding time
22
T
e
rminal
strength
Per AEC-Q200-006
No defects
30 Electrical
transient
Per ISO-7637-2
Not applicable
conduction
MURATA MFG CO., LTD
Spec No.: JENF243A_9122S -01
P7/13
9. Specification of Packaging
9.1 Appearance and dimensions of tape
• 8 mm width/paper tape (BLM18PG***SZ1D, BLM18SP***SZ1D, BLM18AG***SZ1D, BLM18B****SZ1D, BLM18KG****Z1D,
BLM18SN***TZ1D)
A
B
1.05±0.1
1.85±0.1
1.1 max.
(BLM18*****S*1)
t
0.85 max.
(BLM18*****T*1)
(in mm)
• 8 mm width/paper tape (BLM18SG***TZ1D)
A
B
t
1.05±0.1
1.85±0.1
0.9 max.
(in mm)
9.2 Taping specifications
Packing quantity
(Standard quantity)
4000 pcs/reel (except BLM18SG)
10000 pcs/reel (only BLM18SG)
Packing method
Feed hole position
Joint
The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom
tape when the cavities of the carrier tape are punched type).
The feed holes on the carrier tape are on the right side when the cover tape (top tape when the
cavities of the carrier tape are punched type) is pulled toward the user.
The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are
seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Break down force of tape
Cover tape (or top tape)
5 N min.
5 N min.
Bottom tape (only when the cavities of the carrier tape are punched type)
9.4 Peeling off force of tape
Speed of peeling off
Peeling off force
300 mm/min
0.1 N to 0.6 N (The lower limit is for typical value.)
MURATA MFG CO., LTD
Spec No.: JENF243A_9122S -01
P8/13
9.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)
9.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.:
(1) Factory code
□□
(1)
○○○○
(2)
(2) Date
First digit: year/last digit of year
(3)
Second digit: month/Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking:
(1) RoHS regulation conformity
ROHS-
Y
(
)
(2) Murata classification number
(1)
(2)
9.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
9.8 Specification of outer box
Dimensions of outer box
Standard reel quantity
(mm)
Label
in outer box (reel)
W
D
H
H
186
186
93
5
D
* Above outer box size is typical. It depends on a
quantity of an order.
W
10. Caution
10.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea
equipment
(4) Power plant
control equipment
(5) Medical equipment
(6) Transportation equipment
(7) Traffic signal
(trains, ships, etc.)
equipment
(8) Disaster/crime
prevention
equipment
(9) Data-processing
equipment
(10) Applications of similar complexity and/or
reliability requirements to the applications listed in
the above
10.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
MURATA MFG CO., LTD
Spec No.: JENF243A_9122S -01
P9/13
10.3 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,
overheating could occur, resulting in wire breakage, burning, or other serious fault.
10.4 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the
abnormal function or the failure of our product.
10.5 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,
etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated
corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of
product electrode, etc. We will not bear any responsibility for use under these environments.
11. Precautions for Use
This product is designed to be mounted by soldering. If you want to use other mounting method, for example, using a
conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and
the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
11.1 Land dimensions
The following diagram shows the recommended land dimensions for flow and reflow soldering:
<Applied to types excluding BLM18
P
,
B
LM18S, BLM18K types>
Flow
0.8
Reflow
0.7
a
b
c
2.5
2.0
0.7
0.7
(in mm)
<Applied to BLM18
P
,
B
LM18S, BLM18K types>
Flow
0.8
Reflow
0.7
a
b
c
2.5
2.0
0.7
0.7
(in mm)
Pattern thickness and
Rated
dimension d
35
μ
m
0.7
Type
current
(A)
18
μ
m
70
μ
m
0.7
0.7
0.7
1.65
3.3
–
0.5 to 1.5
1.7 to 2.5
3 to 4
0.7
1.2
2.4
6.4
–
BLM18P
BLM18S
BLM18K
0.7
1.2
5 to 6
3.3
BLM18SN
BLM18SP
8
6.4
1.2 to 6.0
–
6.4
If heat generation from patterns is large, please pay attention
since the joint of products with substrates may deteriorate.
(in mm)
11.2 Flux and solder used
Flux
• Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100
μ
m to 200
μ
m
If you want to use a flux other than the above, please consult our technical department.
MURATA MFG CO., LTD
Spec No.: JENF243A_9122S -01
P10/13
11.3 Soldering conditions (flow, reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
(1) Flow
Temp.
(
℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.
(
s)
Standard profile
150°C/60 s min.
250°C/4 s to 6 s
2 times
Limit profile
Pre-heating
Heating
150°C/60 s min.
265°C±3°C/5 s
2 times
Number of flow cycles
(2) Reflow
Temp.
(
℃)
260℃
230℃
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.
(
s)
Standard profile
Limit profile
150°C to 180°C/90 s±30 s
Above 230°C/60 s max.
260°C/10 s
Pre-heating
150°C to 180°C/90 s±30 s
Above 220°C/30 s to 60 s
245°C±3°C
Heating
Peak temperature
Number of reflow cycles
2 times
2 times
MURATA MFG CO., LTD
Spec No.: JENF243A_9122S -01
P11/13
11.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
150°C/approx. 1 min
350°C max.
Pre-heating
Tip temperature of soldering iron
Power consumption of soldering iron
Tip diameter of soldering iron
Soldering time
80 W max.
ø3 mm max.
3 s (+1 s, -0 s)
2 times max.
Number of reworking operations
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.
11.5 Solder volume
Solder shall be used not to be exceeded the upper limits as shown below.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
11.6 Product’s location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
Poor example
〈
〉
Good example
〈
〉
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
A > D
*1
A > B
(1) Turn the mounting direction of the component parallel to the
board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the
board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
MURATA MFG CO., LTD
Spec No.: JENF243A_9122S -01
P12/13
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
11.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.8 Cleaning
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder
joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade this
product.
11.9 Storage and transportation
Storage period
Use the product within 6 months after delivery.
If you do not use the product for more than 6 months, check solderability before using it.
Storage conditions
• The products shall be stored in a room not subject to rapid changes in temperature and
humidity. The recommended temperature range is -10°C to +40°C. The recommended relative
humidity range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the
poor solderability.
• Do not place the products directly on the floor; they should be placed on a palette so that they
are not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
• Do not keep products in bulk packaging. Bulk storage could result in collisions between the
products or between the products and other parts, resulting in chipping or wire breakage.
• Avoid storing the product by itself bare (i.e. exposed directly to air).
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
11.10 Resin coating (including moisture-proof coating)
When the product is coated/molded with resin, its electrical characteristics may change.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc.
Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading
to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
11.11 Mounting conditions
Check the mounting condition before using.
Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors,
misalignment, or damage to the product.
MURATA MFG CO., LTD
Spec No.: JENF243A_9122S -01
P13/13
11.12 Operating environment
Do not use this product under the following environmental conditions as it may cause deterioration of product quality.
(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)
(2) In the atmosphere where liquid such as organic solvent, may splash on the products.
(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.
11.13 Mounting density
If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.
If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,
resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that
the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating
temperature for the product.
13.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO., LTD
