Murata-Electronics-BLM18KG121TH1D
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Reference Only
Spec. No. JENF243A-9101Q-01
P.1/10
Chip Ferrite Bead BLM18
□□□□□□
H1D
Murata Standard Reference Specification[AEC-Q200]
1.Scope
This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM18_
□
H Series based on AEC-Q200.
2.Part Numbering
(ex.)
BL
M
18
(3)
AG
(4)
121
(5)
S
(6)
Ｈ
1
D
(9)
(1)
(2)
(7) (8)
(1)Product ID
(2)Type
(3)Dimension (L×
Ｗ
) (6)Performance
(4)Characteristics
(5)Typical Impedance at 100MHz
(8)Numbers of Circuit
(9)Packaging (D:Taping)
(7)Category(for Automotive Electronics)
3.Rating
Impedance (
Ω
)
DC Resistance
(at 100MHz)
(*1)
(
Ω
max.)
(*1)
(refer to below
comment)
Rated
Current
(mA)
ESD Rank
2:2kV
6:25kV
(refer to below comment)
Customer
Part Number
MURATA
Part Number
Remark
Initial
Values
Values After
Typical
at 85
℃
at 125
℃
Testing
0.10
20 min.
33±25%
BLM18PG300SH1D
BLM18PG330SH1D
BLM18PG600SH1D
BLM18PG121SH1D
BLM18PG181SH1D
BLM18PG221SH1D
BLM18PG331SH1D
BLM18PG471SH1D
BLM18KG221SH1D
BLM18KG331SH1D
BLM18KG471SH1D
BLM18KG601SH1D
BLM18KG102SH1D
30
33
1000
3000
*2
1000
*2
1000
0.05
0.025
0.1
0.050
0.2
40 min.
60
2000
*2
120±25%
180±25%
220±25%
330±25%
470±25%
220±25
％
330±25
％
470±25
％
600±25
％
1000±25
％
22
±
7
1000
*2
120
180
220
330
470
220
330
470
600
1000
0.05
0.10
6
1500
*2
1000
*2
1400
*2
1000
*2
1200
*2
1000
*2
1000
0.09
0.18
0.10
0.14
For DC
power line
0.15
0.20
0.20
0.26
2200
*2
1500
*2
1700
*2
1200
*2
1500
*2
1000
*2
1300
*2
1000
*2
0.050
0.080
0.130
0.150
0.200
0.060
0.095
0.145
0.165
0.230
2
2
1000
*2
800
*2
8000
*2
5000
*2
6000
*2
4000
*2
5000
*2
3300
*2
3500
*2
2200
*2
3000
*2
1900
*2
3000
*2
1900
*2
800
BLM18SN220TH1D
BLM18KG260TH1D
BLM18KG300TH1D
BLM18KG700TH1D
BLM18KG101TH1D
BLM18KG121TH1D
BLM18AG121SH1D
BLM18AG151SH1D
BLM18AG221SH1D
BLM18AG331SH1D
BLM18AG471SH1D
BLM18AG601SH1D
BLM18AG102SH1D
22
26
0.004
0.007
0.010
0.022
0.030
0.030
0.18
0.005
0.012
0.015
0.032
0.040
0.040
0.28
26±25
％
30±25
％
70±25
％
100±25
％
120±25
％
For DC
power line
(Thin type)
30
70
100
120
120
150
220
330
470
600
1000
120±25%
150±25%
220±25%
330±25%
700
700
0.25
0.25
0.35
0.35
For
600
0.30
0.40
general
2
use
470±25%
600±25%
1000±25%
550
500
450
0.35
0.38
0.50
0.45
0.48
0.60
BLM18BB050SH1D
BLM18BA050SH1D
BLM18BB100SH1D
BLM18BA100SH1D
BLM18BB220SH1D
BLM18BA220SH1D
5±25%
5±25%
10±25%
10±25%
22±25%
22±25%
5
5
10
10
22
22
800
500
700
500
700
500
0.05
0.2
0.10
0.25
0.20
0.35
0.10
0.3
0.20
0.35
0.30
0.45
For
high speed
signal line
2
BLM18BB470SH1D
BLM18BD470SH1D
BLM18BA470SH1D
47±25%
47
±
25
％
47±25%
47
47
47
600
500
300
0.25
0.3
0.35
0.4
0.55
0.65
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9101Q-01
P.2/10
Impedance (
Ω
)
DC Resistance
(
Ω
max.)
(*1)
(refer to below
comment)
(at 100MHz)
(*1)
Rated
Current
(refer to below comment)
ESD Rank
2:2kV
6:25kV
Customer
Part Number
MURATA
Part Number
Remark
(mA) (
*
2
)
Values
After
Initial
Values
Testing
at 85
℃
at 125
℃
Typical
BLM18BB600SH1D
BLM18BA750SH1D
BLM18BB750SH1D
BLM18BB121SH1D
BLM18BD121SH1D
BLM18BA121SH1D
BLM18BB141SH1D
BLM18BB151SH1D
BLM18BD151SH1D
BLM18BB221SH1D
BLM18BD221SH1D
BLM18BB331SH1D
BLM18BD331SH1D
BLM18BD421SH1D
BLM18BB471SH1D
BLM18BD471SH1D
BLM18BD601SH1D
BLM18BD102SH1D
BLM18BD152SH1D
BLM18BD182SH1D
BLM18BD222SH1D
BLM18BD252SH1D
60±25%
75±25%
75±25%
60
75
75
600
300
600
550
300
200
500
450
300
450
250
400
250
250
300
250
200
200
150
150
150
150
0.25
0.70
0.30
0.30
0.4
0.35
0.80
0.40
0.40
0.5
120±25%
120±25%
120±25%
140±25%
150±25%
150±25%
220±25%
220±25%
330±25%
330±25%
420±25%
470±25%
470±25%
600±25%
1000±25%
1500±25%
1800±25%
2200±25%
2500±25%
120
120
120
140
150
150
220
220
330
330
420
470
470
600
1000
1500
1800
2200
2500
0.9
1.0
0.35
0.37
0.4
0.45
0.47
0.5
0.45
0.45
0.58
0.5
0.55
0.85
0.55
0.65
0.85
1.2
0.55
0.55
0.68
0.6
0.65
0.95
0.65
0.75
0.95
1.3
For
high speed
signal line
2
1.5
1.5
1.5
1.6
1.6
1.6
•
Operating Temperature : -55°C to +125°C
(*1)
•
Storage Temperature
: -55°C to +125°C
Standard Testing Conditions
<
Unless otherwise specified
>
Temperature : Ordinary Temp. (15
°
C to 35
°
C )
<
In case of doubt
>
Temperature : 20
°
C
±
2
°
C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
Rated current
at 85°C
(Note)As for Rated currentmarked with *2,
Rated Current is derated as right figure
depending on the operating temperature.
Rated current
at 125°C
0
85
125
4.Style and Dimensions
1.6±0.15
Operating Temperature (°C)
0.8±0.15
■
Equivalent Circuit
Ｔ
0.4±0.2
Resistance element becomes
dominant at high frequencies.
(
)
: Electrode
(
in mm
)
■
Unit Mass (Typical value)
BLM18_SH
：
0.005g
BLM18_TH
：
0.004g
P/N
BLM18_SH
BLM18_TH
T
0.8
±
0.15
0.6
±
0.15
(in mm)
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9101Q-01
P.3/10
5.Marking
No marking.
6.Specifications
6-1.Electrical Performance
No.
Item
Specification
Test Method
Measuring Frequency : 100MHz±1MHz
6-1-1 Impedance
Meet item 3.
Measuring Equipment : KEYSIGHT 4991A or the equivalent
Test Fixture : KEYSIGHT 16192A or the equivalent
Measuring Equipment : Digital multi meter
6-1-2 DC
Resistance
Meet item 3.
For BLM18SN
Measuring Equipment : YOKOGAWA 755611 or the equivalent
Test Fixture : KEYSIGHT 16044A or the equivalent
＊
Except resistance
of the Substrate and Wire
6-2. Mechanical Performance(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Murata Specification / Deviation
No.
Stress
Test Method
3
High
Temperature
Exposure
1000hours at 125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
Table A
Appearance
No damage
Impedance
Change
(at 100MHz)
Within ±30%
（
for BLM18SN
Within
±
50%
）
Meet item 3.
DC
Resistance
4
Temperature Cycling
1000cycles
Meet Table B after testing.
TableB
-55 deg C to +125 deg C
Set for 24hours at room
temperature, then measured.
Appearance
Impedance
Change
No damage
Within ±30%
（
for BLM18SN
Within ±50%
）
(for BLM18KG
(at 100MHz)
Within-10%to+50%)
DC Resistance
Meet item 3.
5
7
Destructive
Physical Analysis
Per EIA469
No electrical tests
No defects
Biased Humidity
1000hours at 85 deg C, 85%RH
Meet Table C after testing.
Apply max rated current.
TableC
Appearance
No damage
Impedance
Change
(at 100MHz)
DC
Within ±30%
（
for BLM18KG/SN
Within
±
50%
）
Meet item 3.
Resistance
Meet Table C after testing.
If the rated current of parts exceed 1A,
the operating temperature should be 85 deg C.
8
Operational Life
Apply 125 deg C 1000hours
Set for 24hours at room
temperature, then measured
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9101Q-01
AEC-Q200
P.4/10
Murata Specification / Deviation
No.
Stress
Test Method
Visual inspection
9
External Visual
No abnormalities
No defects
10
Physical Dimension
Meet ITEM 4
（
Style and Dimensions
）
12
13
Resistance to Solvents Per MIL-STD-202
Method 215
Not Applicable
Mechanical Shock
Per MIL-STD-202 Method 213
Meet Table D after testing.
Table D
Condition F
1500g’s (14.7N)/0.5ms/
Half sine
Appearance
Impedance
Change
(at 100MHz)
DC Resistance
No damage
Within ±30%
Meet item 3.
14
15
Vibration
5g’s(0.049N) for 20 minutes,
12cycles each of 3 orientations
Test from 10-2000Hz.
Solder temperature
Meet Table D after testing.
Resistance
to Soldering Heat
Pre-heating:150C +/-10 deg,60s to 90s
Meet Table C after testing.
260C+/-5 deg C
Immersion time 10s
17
18
ESD
Per AEC-Q200-002
Per J-STD-002
Meet Table D after testing.
ESD Rank: Meet Item 3. (Rating)
Solderability
Method b : Not Applicable
95% of the terminations is to be soldered.
19
Electrical
Characterization
Measured : Impedance
Per UL-94
No defects
20
21
Flammability
Board Flex
Not Applicable
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding tim
Per AEC-Q200-006
Meet Table C after testing.
22
30
Terminal Strength
No defects
Electrical
Transient
Conduction
Per ISO-7637-2
Not Applicable
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9101Q-01
P.5/10
7.Specification of Packaging
7-1.Appearance and Dimensions
(8mm-wide paper tape)
2.0±0.05
4.0±0.1
+0.1
4.0±0.1
φ
1.5
-0
1.05±0.1
BLM18_SH
：
1.1 max.
Direction of feed
BLM18_TH
：
0.85max.
(in mm)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously
and sealed by top tape and bottom tape.
(2) The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel are kept.
7-2.Tape Strength
(1)Pull Strength
Top tape
Bottom tape
5N min.
Top tape
165 to 180 degree
(2)Peeling off force of Top tape
F
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
Bottom tape
Base tape
7-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel: 4000 pcs. / reel
(2)There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(
∗
1) , RoHS marking (
∗
2) , Quantity, etc)
∗
1) « Expression of Inspection No. »
□□
OOOO
×××
(1) (2) (3)
(1)
Factory Code
(2)
Date
First digit
: Year
/ Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
Third, Fourth digit : Day
(3)
Serial No.
∗
2) « Expression of RoHS marking »
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9101Q-01
(5)Outside package
P.6/10
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS discrimination(
∗
2) ,Quantity, etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
Trailer
Leader
160 min.
2.0±0.5
Label
190 min.
210 min.
Top tape
Empty tape
13.0±0.2
φ
6
0
+1
φ
–
0
Direction of feed
21.0±0.8
φ
+1
-0
9.0
13.0±1.4
180
+0
φ
-3
(in mm)
7-4. Specification of Outer Case
Outer Case Dimensions
(mm)
Label
Standard Reel Quantity in Outer Case
(Reel)
H
W
D
H
186
186
93
5
D
∗
Above Outer Case size is typical. It depends on a quantity of an order.
W
8.
Caution
8-1.Rating
Do not use products beyond the Operating Temperature Range and Rated Current.
8-2.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a
critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
8-3.Fail Safe
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
8-4.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(7)Traffic signal equipment
(8)Transportation equipment (trains,ships,etc.)
(9)Data-processing equipment
(10)Applications of similar complexity and /or reliability requirements
to the applications listed in the above
(2)Aerospace equipment
(3)Undersea equipment
(4)Power plant control equipment
(5)Medical equipment
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9101Q-01
P.7/10
9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1.Land pattern designing
< For BLM18 series
(except BLM18P/BLM18S/BLM18K type)
>
Chip Ferrite Bead
Type
Soldering
a
b
c
c
BLM18 (except18P/18S/
Flow
BLM18K type)
0.8
0.7
2.5
2.0
0.7
0.7
a
b
Solder Resist
Pattern
Reflow
(in mm)
< For BLM18P/BLM18S/BLM18K type >
Chip Ferrite Bead
Land pad thickness
and dimension d
Rated
Current
Soldering
Type
a
b
c
(A)
18µm 35µm 70µm
0.5 to 1.5
1.7 to 2.5
0.7
1.2
2.4
6.4
–
0.7
0.7
1.2
3.3 1.65
6.4
0.7
0.7
0.7
c
d
Flow
0.8
Reflow
Flow
BLM18P
BLM18K
Flow/
2.5
Reflow
2.0
3 to 4
0.7
Reflow
5 to 6
0.7
BLM18SN
8
3.3
a
b
(in mm)
∗
The excessive heat by land pads may cause deterioration
at joint of products with substrate.
Solder Resist
Pattern
9-2.Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100
µ
m to 200
μ
m
(2) Soldering conditions
•
•
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150
℃
max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100
℃
max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9101Q-01
P.8/10
(3)
soldering profile
□
Flow soldering profile
Temp.
(
℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.
(
s)
Standard Profile
150
℃、
60s min.
250
℃、
4
～
6s
2 times
Limit Profile
Pre-heating
Heating
265
℃±
3
℃
、
5s max.
Cycle of flow
2 times
□
Reflow soldering profile
Temp.
(
℃)
260℃
230℃
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s
～60
s
60s max.
90s±30s
Time.
(
s)
Standard Profile
Limit Profile
Pre-heating
150
～
180°C
、
90s
±
30s
Heating
above 220°C
、
30s
～
60s above
230°C
、
60s max.
Peak temperature
Cycle of reflow
245
±
3°C
260°C,10s
2 times
2 times
9-3.Reworking with soldering iron
•
Pre-heating: 150°C, 1 min
•
Soldering iron output: 80W max.
•
Tip diameter:
φ
3mm max.
•
Times : 2times max.
•
Tip temperature: 350°C max.
•
Soldering time : 3(+1,-0) seconds.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
9-4.Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Recommendable
1/3T
≦
t
≦
T
t
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9101Q-01
P.9/10
9-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
a
b
Products shall be located in the sideways
direction (Length:a
stress.
<
b) to the mechanical
Poor example
〈
〉
Good example
〈
〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
D *1
B
C
>
>
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting
Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
9-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
9-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases
and etc.
(the sea breeze, Cl
2
, H
2
S, NH
3
, SO
2
, NO
2
,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
9-8. Resin coating
The impedance value may change and/or it may affect on the product’s performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to
use, please make the reliability evaluation with the product mounted in your application set.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9101Q-01
P.10/10
9-9.Cleaning Conditions
Products shall be cleaned on the following conditions.
(1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/
max. Frequency:28kHz
to 40kHz
Time:5 min max.
(3)Cleaner
1.Alternative cleaner
•
Isopropyl alcohol (IPA)
2.Aqueous agent
•
PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5)Other cleaning
Please contact us.
9-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
9-11.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
•
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
•
Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
•
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
•
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
•
Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
10.
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
