Murata-Electronics-BLM18KN121EH1D
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Reference Only
Chip Ferrite Bead BLM18KN
□□□
EH1
□
Series
Spec. No. JENF243A-9160-01
P.1/8
Reference Specification
[AEC-Q200]
1.Scope
This reference specification applies to Chip Ferrite Bead BLM18KN_EH series for Automotive Electronics based on
AEC-Q200.
2.Part Numbering
(ex.)
BL
M
18
(3)
KN
(4)
121
(5)
E
(6)
H
1
D
(9)
(1)
(2)
(7) (8)
(1)Product ID
(2)Type
(4)Characteristics
(5)Typical Impedance at 100MHz
(7)Category(for Automotive Electronics)
(8)Numbers of Circuit
(3)Dimension (L×
Ｗ
) (6)
Performance
(9)Packaging (D:Taping / B:Bulk)
3.Rating
DC Resistance
(
max.)
Rated
Impedance (
)
(refer to below
Current
(at 100MHz)
(refer to below
comment)
Customer
Part Number
MURATA
Part Number
comment)
Initial Values
Values After
Testing
(mA)
*1
at 175
℃
at 125
℃
at 150
℃
BLM18KN260EH1D
BLM18KN300EH1D
BLM18KN700EH1D
26±25%
30±25%
70±25%
4000
2600
2200
2600
1700
1500
10
10
10
0.007
0.010
0.022
0.012
0.015
0.032
BLM18KN101EH1D
BLM18KN121EH1D
BLM18KN221EH1D
BLM18KN331EH1D
BLM18KN471EH1D
BLM18KN601EH1D
BLM18KN102EH1D
100±25%
120±25%
220±25%
330±25%
470±25%
600±25%
1000±25%
1900
1900
1400
1100
920
1200
1200
1000
790
610
560
10
10
10
10
10
10
10
0.030
0.030
0.050
0.080
0.130
0.150
0.200
0.04
0.04
0.06
0.095
0.145
0.165
0.23
860
740
490
Operating Temperature : -55°C to +175°C
Storage Temperature
: -55°C to +175°C
(*1)Rated Current is derated as right figure
depending on the operating temperature.
4.Style and Dimensions
1.6±0.15
0.8±0.15
Ｔ
■
Equivalent Circuit
0.4±0.2
Resistance element becomes
dominant at high frequencies.
: Electrode
(
in mm
)
(
)
■
Unit Mass (Typical value)
BLM18KN260/300/700/101/121
：
0.004g
BLM18KN221/331/471/601/102
：
0.005g
P/N
T(mm)
0.6±0.15
0.8±0.15
BLM18KN260/300/700/101/121
BLM18KN221/331/471/601/102
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9160-01
P.2/8
5.Marking
No marking.
6.Standard Testing Conditions
Unless otherwise specified
Temperature : Ordinary Temp. (15
°
C to 35
°
C )
In case of doubt
Temperature : 20
°
C
±
2
°
C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7.Specifications
7-1.Electrical Performance
No. Item
Specification
Meet item 3.
Test Method
7-1-1 Impedance
Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT 4991A or the equivalent
Test Fixture : KEYSIGHT 16192A or the equivalent
Measuring Equipment : Digital multi meter
7-1-2 DC
Resistance
Meet item 3.
＊
Except resistance
of the Substrate and Wire
7-2. Mechanical Performance(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Murata Specification / Deviation
No.
Stress
Test Method
3
High
Temperature
Exposure
1000hours at 175 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
Table A
Appearance
Impedance
Change
No damage
Within
±
50%
(at 100MHz)
DC
Resistance
Meet item 3.
4
Temperature Cycling
1000cycles
Meet Table A after testing.
-55 deg C to +175 deg C
Set for 24hours at room
temperature, then measured.
Per EIA469
No electrical tests
1000hours at 85 deg C, 85%RH
Meet Table A after testing.
Apply max rated current.
5
7
Destructive
Physical Analysis
Biased Humidity
No defects
Meet Table A after testing.
8
Operational Life
Apply 175deg C 1000hours
Set for 24hours at room
temperature, then measured
If the rated current of parts exceed 10mA,
the operating temperature should be 125 deg C
or 150 deg C.
9
External Visual
Visual inspection
No abnormalities
10
Physical Dimension
Meet ITEM 4
No defects
（
Style and Dimensions
）
12
13
Resistance to Solvents
Per MIL-STD-202
Method 215
Not Applicable
Mechanical Shock
Per MIL-STD-202 Method 213
Meet Table B after testing.
Table B
Condition F
1500g’s (14.7N)/0.5ms/
Half sine
Appearance
Impedance
Change
(at 100MHz)
DC Resistance
No damage
Within ±30%
Meet item 3.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9160-01
AEC-Q200
P.3/8
Murata Specification / Deviation
No.
Stress
Test Method
14
15
17
Vibration
5g’s(0.049N) for 20 minutes,
12cycles each of 3 orientations
Test from 10-2000Hz.
Solder temperature
260C+/-5 deg C
Immersion time 10s
Meet Table B after testing.
Resistance
to Soldering Heat
Pre-heating:150C +/-10 deg,60s to 90s
Meet Table A after testing.
ESD
Per AEC-Q200-002
Meet Table A after testing.
ESD Rank: Meet Item 3. (Rating)
18
19
Solderability
Per J-STD-002
Measured : Impedance
Per UL-94
Method b : Not Applicable
95% of the terminations is to be soldered.
No defects
Electrical
Characterization
Flammability
20
21
Not Applicable
Board Flex
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding tim
Per AEC-Q200-006
Meet Table B after testing.
22
30
Terminal Strength
No defects
Electrical Transient
Conduction
Per ISO-7637-2
Not Applicable
8.Specification of Packaging
8-1.Appearance and Dimensions
(8mm-wide paper tape)
2.0±0.05
+0.1
4.0±0.1
4.0±0.1
1.5
-0
1.05±0.1
t
Direction of feed
t
P/N
BLM18KN260/300/700/101/121
0.85
max.
BLM18KN221/331/471/601/102
1.1
max.
(in mm)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously
and sealed by top tape and bottom tape.
(2) The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within
0.025%
of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel are kept.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9160-01
P.4/8
8-2.Tape Strength
(1)Pull Strength
Top tape
5N min.
Bottom tape
Top tape
165 to 180 degree
F
(2)Peeling off force of Top tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
Bottom tape
Base tape
8-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel: 4000 pcs. / reel
(2)There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(
1) , RoHS marking (
2) , Quantity, etc)
1) « Expression of Inspection No. »
□□
OOOO
(1)
(2)
(3)
(1)
Factory Code
(2)
Date
First digit
: Year
/ Last digit of year
Second digit
: Month / Jan. to Sep.
1 to 9, Oct. to Dec.
O, N, D
Third, Fourth digit : Day
(3)
Serial No.
2) « Expression of RoHS marking »
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
(5)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS discrimination(
2) ,Quantity, etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
8-4. Specification of Outer Case
Outer Case Dimensions
Label
Standard Reel Quantity in Outer Case
(mm)
(Reel)
H
W
D
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an
W
order.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9160-01
P.5/8
9.
Caution
9-1.Rating
Do not use products beyond the Operating Temperature Range and Rated Current.
9-2.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause
a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-3.Fail Safe
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
9-4.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(7)Traffic signal equipment
(8)Transportation equipment (trains,ships,etc.)
(9)Data-processing equipment
(10)Applications of similar complexity and /or reliability requirements
to the applications listed in the above
(2)Aerospace equipment
(3)Undersea equipment
(4)Power plant control equipment
(5)Medical equipment
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1.Land pattern designing
Standard land dimensions
Chip Ferrite Bead
Land pad thickness and
dimension d
18µm 35µm 70µm
Rated
Current
(A)
Soldering
a
b
c
c
d
0.7
1.2
2.4
6.4
0.7
0.7
1.2
0.7
0.7
~1.0
~1.5
~2.5
~4.0
Flow
0.8
Reflow
Flow
Flow/
Reflow
2.5
Reflow
2.0
0.7
Solder Resist
Pattern
0.7
a
b
0.7
3.3
1.65
(in mm)
The excessive heat by land pads may cause deterioration
at joint of products with substrate.
10-2.Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100
µ
m to 200
m
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150
℃
max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100
℃
max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9160-01
P.6/8
(3)
soldering profile
□
Flow soldering profile
Temp.
(
℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.
(
s)
Standard Profile
150
℃、
60s min.
250
℃、
4
～
6s
2 times
Limit Profile
Pre-heating
Heating
265
℃±
3
℃
、
5s max.
Cycle of flow
2 times
□
Reflow soldering profile
Temp.
(
℃)
260℃
230℃
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s
～60
s
60s max.
90s±30s
Time.
(
s)
Standard Profile
Limit Profile
Pre-heating
150
～
180°C
、
90s
±
30s
above 220°C
、
30s
～
60s above
230°C
、
60s max.
Heating
Peak temperature
Cycle of reflow
245
±
3°C
260°C,10s
2 times
2 times
10-3.Reworking with soldering iron
Pre-heating: 150°C, 1 min
Soldering iron output:
60W
max.
Tip diameter:
φ
3mm max.
Times : 2times max.
Tip temperature: 350°C max.
Soldering time : 3(+1,-0) seconds.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
10-4.Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Recommendable
1/3T
≦
t
≦
T
t
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9160-01
P.7/8
10-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
a
b
Products shall be located in the sideways
direction (Length:a
b) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
D *1
B
C
>
>
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting
Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
10-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
10-7.Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases
and etc.
(the sea breeze, Cl
2
, H
2
S, NH
3
, SO
2
, NO
2
,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9160-01
P.8/8
10-8.Resin coating
The impedance value may change and/or it may affect on the product’s performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior
to
use, please make the reliability evaluation with the product mounted in your application set.
10-9.Cleaning
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or
broken solder joints. Before starting your production process,
test your cleaning equipment / process to insure it does not degrade this product.
10-10.Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10-11.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Avoid storing the product by itself bare (i.e.exposed directly to air).
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11 .
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
