Murata-Electronics-BLM21AG221SZ1D
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Spec. No.
JENF243A-9114F-01
Reference Only
P.1/10
Chip Ferrite Bead BLM21
□□□□□□
Z1
□
Murata Standard Reference Specification[AEC-Q200]
1. Scope
This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM21_SZ Series based on
AEC-Q200 except for Power train and Safety.
2. Part Numbering
(ex.)
BL
M
(2)
21
(3)
AG
(4)
121
(5)
S
(6)
Z
(7)
1
(8)
D
(9)
(1)
(1)Product ID
(2)Type
(7)Category (for Automotive Electronics)
(8)Numbers of Circuit
(3)Dimension (L×
Ｗ
)
(9)Packaging
(4)Characteristics
(5)Typical Impedance at 100MHz
(6)Performance
D:Taping(
φ
180mm Reel, Paper Tape)
L:Taping(
φ
180mm Reel, Plastic Tape)
3. Rating
DC Resistance
Impedance (
Ω
)
(at 100MHz)
(*1)
(refer to below comment)
(
Ω
) max.
(*1)
(refer to below
comment)
Rated Current
ESD Rank
2:2kV
6:25kV
(mA)(
*
2
)
Customer
Part Number
MURATA
Part Number
Initial
Values
Values After
at
at
Typical
22
Testing
0.018
85
℃
125
℃
*2 *2
6000 3300
*2 *2
4000 2300
*2 *2
3500 1900
*2 *2
3000 1550
*2 *2
2000 1250
*2 *2
1500 1000
*2 *2
8500 6000
*2 *2
6000 4000
*2 *2
5000 3300
*2 *2
4000 2600
*2 *2
2800 1900
*2 *2
2500 1700
*2 *2
2300 1500
*2 *2
1600 1100
BLM21PG220SZ1D
BLM21PG300SZ1D
BLM21PG600SZ1D
BLM21PG121SZ1D
BLM21PG221SZ1D
BLM21PG331SZ1D
BLM21SN300SZ1D
BLM21SP700SZ1D
BLM21SP111SZ1D
BLM21SP181SZ1D
BLM21SP331SZ1D
BLM21SP471SZ1D
BLM21SP601SZ1D
BLM21SP102SZ1D
22±25%
20 min.
0.009
0.014
0.02
30
60
0.028
0.04
60±25%
120
±
25
％
220±25%
330±25%
30±10
Ω
120
220
330
30
0.03
0.06
0.045
0.07
0.09
0.14
0.004
0.009
0.013
0.020
0.040
0.050
0.060
0.120
0.005
0.012
0.016
0.025
0.051
0.063
0.074
0.144
2
70±25%
70
110±25%
180±25%
330±25%
470±25%
600±25%
1000±25%
110
180
330
470
600
1000
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9114F-01
Reference Only
P.2/10
DC Resistance
(
Ω
) max.
(*1)
(refer to below
comment)
Impedance (
Ω
)
(at 100MHz)
(*1)
(refer to below comment)
Rated Current
ESD Rank
2:2kV
6:25kV
(mA)(
*
2
)
Customer
Part Number
MURATA
Part Number
Initial
Values
Values After
at
at
Typical
Testing
85
℃
125
℃
BLM21BB050SZ1D
BLM21BB600SZ1D
BLM21BB750SZ1D
BLM21BB121SZ1D
BLM21BD121SZ1D
BLM21BB151SZ1D
BLM21BD151SZ1D
BLM21BB201SZ1D
BLM21BB221SZ1D
BLM21BD221SZ1D
BLM21BB331SZ1D
BLM21BD331SZ1D
BLM21BD421SZ1D
BLM21BB471SZ1D
BLM21BD471SZ1D
BLM21BD601SZ1D
BLM21BD751SZ1D
BLM21BD102SZ1D
BLM21BD152SZ1D
BLM21BD182SZ1D
BLM21BD222SZ1L
BLM21BD222TZ1D
BLM21BD272SZ1L
BLM21AG121SZ1D
BLM21AG151SZ1D
BLM21AG221SZ1D
BLM21AG331SZ1D
BLM21AG471SZ1D
BLM21AG601SZ1D
BLM21AG102SZ1D
5±25%
60±25%
75±25%
5
60
75
1000
800
700
600
350
600
350
500
500
350
400
300
300
400
300
300
250
250
250
250
250
200
200
1000
1000
900
800
700
700
600
0.02
0.13
0.16
0.19
0.25
0.21
0.25
0.26
0.26
0.25
0.33
0.3
0.3
0.4
0.35
0.35
0.4
0.04
0.23
0.26
0.29
0.35
0.31
0.35
0.36
0.36
0.35
0.43
0.4
0.4
0.5
0.45
0.45
0.5
120±25%
120±25%
150±25%
150±25%
200±25%
220±25%
220±25%
330±25%
330±25%
420±25%
470±25%
470±25%
600±25%
750±25%
1000±25%
1500±25%
1800±25%
1600 min.
2200±25%
2700±25%
120±25%
150±25%
220±25%
330±25%
470±25%
600±25%
1000±25%
120
120
150
150
200
220
220
330
330
420
470
470
600
750
1000
1500
1800
2250
2200
2700
120
150
220
330
470
600
1000
2
0.4
0.45
0.5
0.6
0.6
0.5
0.55
0.6
0.7
0.7
0.8
0.9
0.09
0.09
0.12
0.15
0.18
0.2
0.19
0.19
0.22
0.25
0.28
0.3
0.27
0.37
•
Operating Temperature : -55°C to +125°C
•
Storage Temperature
: -55°C to +125°C
(*1)
Standard Testing Conditions
<
Unless otherwise specified
>
Temperature : Ordinary Temp. (15
°
C to 35
°
C )
<
In case of doubt
>
Temperature : 20
°
C
±
2
°
C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
(Note)As for Rated currentmarked with *2,
Rated Current is derated as right figure
depending on the operating temperature.
85℃
12
5
℃
0
85
125
Operating Temperature (°C)
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9114F-01
Reference Only
P.3/10
4. Style and Dimensions
L
W
■
Equivalent Circuit
T
E
Resistance element becomes
dominant at high frequencies.
(
)
:Electrode
■
Unit Mass (Typical value)
0.010g
0.014g ( for 21BD222SZ1
□
/21BD272SZ1
□
)
L
W
T
E
0.85±0.2
for 21BD222SZ1
0.5±0.2
□
2.0±0.2 1.25±0.2
21BD272SZ1
□
for 21BD272SZ1
□
1.25±0.2
0.3±0.2
(in mm)
5. Marking
No marking.
6. Specifications
6-1. Electrical Performance
No.
Item
Specification
Test Method
Measuring Frequency : 100MHz±1MHz
Impedance
Meet item 3.
6-1-1
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
Measuring Equipment : Digital multi meter
6-1-2 DC
Resistance
Meet item 3.
*Except resistance of the Substrate and Wire
6-2. Mechanical Performance (based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Murata Specification / Deviation
No.
Stress
Test Method
1000hours at 125 deg C
Set for 24hours at room
temperature, then
measured.
3
High
Meet Table A after testing.
Table A
Temperature
Exposure
Appearance
Impedance
Change
(at 100MHz)
DC
No damage
Within ±30%
(for BLM21SN within
±
50%)
Meet item 3.
Resistance
4
Temperature Cycling
1000cycles
-55 deg C to +125 deg C
Meet Table A after testing.
Set for 24hours at room
temperature, then
measured.
5
7
Destructive
Physical Analysis
Per EIA469
No electrical tests
No defects
Biased Humidity
1000hours at 85 deg C,
85%RH
Meet Table A after testing.
Apply max rated current.
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9114F-01
Reference Only
P.4/10
Murata Specification / Deviation
AEC-Q200
Stress
No.
Test Method
Apply 125 deg C
Meet Table A after testing.
8
Operational Life
If the rated current of parts exceed 1A,
the operating temperature should be 85 deg C.
1000hours
Set for 24hours at room
temperature, then
measured
9
External Visual
Visual inspection
No abnormalities
No defects
10
Physical Dimension
Meet ITEM 4
（
Style and Dimensions
）
12
13
Resistance to Solvents Per MIL-STD-202 Method
Not Applicable
215
Mechanical Shock
Per MIL-STD-202 Method
Meet Table B after testing.
213
Table B
Condition F:
1500g’s(14.7N)/0.5ms/
Half sine
Appearance
Impedance
Change
No damage
Within ±30%
(at 100MHz)
DC
Resistance
Meet item 3.
14
Vibration
5g’s(0.049N) for 20
minutes, 12cycles each of
3 orientations
Meet Table B after testing.
Test from 10-2000Hz.
15
17
Resistance
to Soldering Heat
Solder temperature
260C+/-5 deg C
Immersion time 10s
Pre-heating:150C +/-10 deg,60s to 90s
Meet Table A after testing.
ESD
Per AEC-Q200-002
Meet Table A after testing.
ESD Rank: Refer to Item 3. Rating
18
19
Solderability
Per J-STD-002
Method b : Not Applicable
95% of the terminations is to be soldered.
Electrical
Measured : Impedance
No defects
Characterization
20
21
Flammability
Board Flex
Per UL-94
Not Applicable
Epoxy-PCB(1.6mm)
Meet Table B after testing.
Deflection 2mm(min)
60s minimum holding time
22
30
Terminal Strength
Per AEC-Q200-006
Per ISO-7637-2
No defects
Electrical
Transient
Conduction
Not Applicable
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9114F-01
Reference Only
P.5/10
7. Specification of Packaging
7-1. Appearance and Dimensions
Appearance and Dimensions
Part Number
Type
a
Plastic Tape
a
2.0±0.05
4.0±0.1
+0.1
4.0±0.1
φ
1.5
-0
0.2±0.1
Paper Tape
BLM21
except
8mm-
wide
1.1
21BD222SZ1L
21BD272SZ1L
Paper max.
tape
1.45±0.1
There are holes in the cavity
a
8mm-
Direction of feed
BLM21BD222SZ1L wide
BLM21BD272SZ1L Plastic
±0.1
tape
1.3
+0.3
of the Plastic tape
φ
1.0
-0
*
Dimension of the Cavity is measured at the bottom side.
(in mm)
Paper tape
Plastic tape
Taping
Products shall be packaged in the cavity of the base
Products shall be packaged in the each embossed
tape of 8mm-wide, 4mm-pitch continuously and
sealed by top tape and bottom tape.
cavity of 8mm-wide, 4mm-pitch plastic tape
continuously and sealed by cover tape.
Sprocket hole
Sprocket hole shall be located on the left hand side toward the direction of feed.
Spliced point
The base tape and top tape have no spliced point.
The cover tape has no spliced point.
Cavity
There shall not be burr in the cavity.
－
Missing
Missing components number within
0.025
% of the number per reel or 1 pc., whichever is greater,
components and
are not continuous. The specified quantity per reel is kept.
number
7-2. Tape Strength
(1)
Pull Strength
Top tape
Paper tape
Plastic tape
5N min.
Bottom tape
Plastic tape
Cover tape
5N min.
10N min.
(2
)
Peeling off force of Top tape
･
Cover tape
Speed of Peeling off
Paper tape
Peeling off force
*
300mm/min
0.1N to 0.6N
0.2N to 0.7N
Plastic tape
*
Minimum value is typical.
•
Case of Paper tape
•
Case of Plastic tape
165 to 180 degree
Top tape
165 to 180 degree
F
F
Cover tape
Plastic tape
Bottom tape
Base tape
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9114F-01
Reference Only
P.6/10
7-3. Taping Condition
(1) Standard quantity per reel
Type
Quantity per 180mm reel
BLM21(except 21BD222SZ1L/21BD272SZ1L)
BLM21BD222SZ1L/BLM21BD272SZ1L
4000 pcs. / reel
3000 pcs. / reel
(2) There shall be leader-tape (cover tape/top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more
than 5 pitch.
(4) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(
∗
1) , RoHS marking(
∗
2) , Quantity, etc)
∗
1) « Expression of Inspection No. »
□□
OOOO
×××
(1) (2) (3)
(1)
Factory Code
(2)
Date
First digit
: Year
/ Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
Third, Fourth digit : Day
(3)
Serial No.
∗
2) « Expression of RoHS marking »
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (
∗
2) ,Quantity, etc)
(6) Dimensions of reel and taping(leader-tape, trailer-tape)
7-4. Specification of Outer Case
Outer Case Dimensions
Label
Standard Reel Quantity in Outer Case
(mm)
(Reel)
H
W
D
H
186
186
93
5
D
∗
Above Outer Case size is typical. It depends on a quantity of an
order.
W
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9114F-01
Reference Only
P.7/10
8.
！
Caution
8-1. Rating
Do not use products beyond the Operating Temperature Range and Rated Current.
8-2. Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may
cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us
in advance in case of applying the surge current.
8-3. Fail Safe
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
8-4. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or
property.
(1) Aircraft equipment
(6) Disaster prevention / crime prevention equipment
(7) Traffic signal equipment
(8) Transportation equipment (trains,ships,etc.)
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1. Land pattern designing
•
Standard land dimensions
< BLM21 series(except BLM21PG/BLM21S type) >
Chip Ferrite Bead
c
Soldering
Flow
Reflow
a
1.1
1.2
b
3.5
2.4
c
0.95
1.25
a
b
Solder Resist
Pattern
(in mm)
< For BLM21PG/S type >
Chip Ferrite Bead
Land pad thickness
and dimension d
Rated
Current
(A)
1.5
2
3~4
6
1~8.5
Type
18µm
35µm
1.25
1.25
1.25
3.3
70µm
1.25
1.25
1.25
1.65
1.25
1.25
2.4
6.4
–
c
d
BLM21PG
BLM21S
a
b
6.8
3.4
(in mm)
Solder Resist
Pattern
Soldering
a
b
c
Flow
Reflow
1.1
1.2
3.5
2.4
0.95
1.25
(in mm)
*The excessive heat by land pads may cause
deterioration at joint of products with substrate.
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9114F-01
Reference Only
P.8/10
9-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100
µ
m to 200
μ
m
(2) Soldering conditions
•
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150
℃
max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100
℃
max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
•
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
(3) soldering profile
□
Flow
Temp.
(
℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.
(
s)
Standard Profile
150
℃、
60s min.
250
℃、
4
～
6s
2 times
Limit Profile
Pre-heating
Heating
265
℃±
3
℃
、
5s max.
Cycle of flow
2 times
□
Reflow soldering profile
Temp.
(
℃)
260℃
230℃
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s
～60
s
60s max.
90s±30s
Time.
(
s)
Standard Profile
150
～
180°C
、
90s
±
30s
above 220°C
、
30s
～
60s above
230°C
、
60s max.
Limit Profile
Pre-heating
Heating
Peak temperature
Cycle of reflow
245
±
3°C
260°C,10s
2 times
2 times
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9114F-01
Reference Only
P.9/10
9-3. Reworking with soldering iron
•
Pre-heating: 150°C, 1 min
•
Soldering iron output: 80W max.
•
Tip diameter:
φ
3mm max.
•
Tip temperature: 350°C max.
•
Soldering time : 3(+1,-0) seconds.
•
Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
9-4. Solder Volume
Solder shall be used not to be exceed as shown below.
Upper Limit
Recommendable
1/3T
≦
t
≦
T
t
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
9-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
a
Products shall be located in the sideways
b
direction (Length:a
<
b) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as
possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
>
>
D *1
B
C
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting
Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9114F-01
Reference Only
P.10/10
9-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
9-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl
2
, H
2
S, NH
3
, SO
2
, NO
2
,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
9-8. Resin coating
The impedance value may change and/or it may affect on the product’s performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
9-9. Cleaning
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or
broken solder joints. Before starting your production process, test your cleaning equipment / process to insure
it does not degrade this product.
9-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
9-11.Storage Conditions
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
•
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
•
Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
•
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
•
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
•
Avoid storing the product by itself bare (i.e.exposed directly to air).
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
10.
!
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve
our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
