Murata-Electronics-BLM21BD222SN1L
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Total page 2/16
P.1/11
Spec. No. JENF243A-0005Z-01
Reference Only
Chip Ferrite Bead BLM21
□□□□□□
N1
□
Reference Specification
1. Scope
This reference specification applies to Chip Ferrite Bead BLM21_
□
N Series.
2. Part Numbering
(ex.)
BL
M
(2)
21
(3)
AG
(4)
121
(5)
S
(6)
N
(7)
1
(8)
D
(9)
(1)
(1)Product ID
(7)Category
(2)Type
(3)Dimension (L×
Ｗ
)
(4)Characteristics
(5)Typical Impedance at 100MHz
(6)Performance
(8)Numbers of Circuit
(9)Packaging
D:Taping(
φ
180mm Reel, Paper Tape)
L:Taping(
φ
180mm Reel, Plastic Tape)
B:Bulk
3. Rating
Impedance (
Ω
)
(at 100MHz,Under Standard
DC Resistance
(
Ω
) max.
Initial Values
Values After
Testing
Rated Current
(mA)(
＊
1)
Customer
Part Number
MURATA
Part Number
Testing Condition)
Remark
at
at
Typical
85°C 125°C
*1 *1
6000 3300
*1 *1
4000 2300
*1 *1
3500 1900
*1 *1
3000 1550
*1 *1
2000 1250
*1 *1
1500 1000
*1 *1
8500 6000
*1 *1
6000 4000
*1 *1
5000 3300
*1 *1
4000 2600
*1 *1
2800 1900
*1 *1
2500 1700
*1 *1
2300 1500
*1 *1
BLM21PG220SN1D
BLM21PG220SN1B
BLM21PG300SN1D
BLM21PG300SN1B
BLM21PG600SN1D
BLM21PG600SN1B
BLM21PG121SN1D
BLM21PG121SN1B
BLM21PG221SN1D
BLM21PG221SN1B
BLM21PG331SN1D
BLM21PG331SN1B
BLM21SN300SN1D
BLM21SN300SN1B
BLM21SP700SN1D
BLM21SP700SN1B
BLM21SP111SN1D
BLM21SP111SN1B
BLM21SP181SN1D
BLM21SP181SN1B
BLM21SP331SN1D
BLM21SP331SN1B
BLM21SP471SN1D
BLM21SP471SN1B
BLM21SP601SN1D
BLM21SP601SN1B
BLM21SP102SN1D
BLM21SP102SN1B
BLM21RK121SN1D
22±25
％
22
30
0.009
0.014
0.02
0.018
0.028
0.04
20 min.
60±25
％
120±25
％
220±25
％
330±25
％
30±10
Ω
60
120
220
330
30
0.03
0.06
0.045
0.07
0.09
0.14
0.004
0.009
0.013
0.020
0.040
0.050
0.060
0.120
0.005
0.012
0.016
0.025
0.051
0.063
0.074
0.144
For DC
power line
70±25%
70
110±25%
180±25%
330±25%
470±25%
600±25%
1000±25%
110
180
330
470
600
1000
1600 1100
120±25%
220±25%
470±25%
600±25%
1000±25%
120
220
200
0.15
0.20
0.25
0.30
0.50
0.25
0.30
BLM21RK121SN1B
BLM21RK221SN1D
200
200
200
200
BLM21RK221SN1B
BLM21RK471SN1D
For
470
0.35 Digital
Interface
BLM21RK471SN1B
BLM21RK601SN1D
600
0.40
BLM21RK601SN1B
BLM21RK102SN1D
1000
0.60
BLM21RK102SN1B
MURATA MFG.CO., LTD.
Total page 3/16
P.2/11
Spec. No. JENF243A-0005Z-01
Reference Only
Impedance (
Ω
)
(at 100MHz,Under Standard
Testing Condition)
DC Resistance
(
Ω
) max.
Initial Values
Values After
Testing
Customer
Part Number
MURATA
Part Number
Rated Current
(mA)
Remark
Typical
BLM21BB050SN1D
BLM21BB050SN1B
BLM21BB600SN1D
BLM21BB600SN1B
BLM21BB750SN1D
BLM21BB750SN1B
BLM21BB121SN1D
BLM21BB121SN1B
BLM21BD121SN1D
BLM21BD121SN1B
5±25
％
60±25
％
75±25
％
120±25
％
120±25
％
5
1000
800
700
600
350
0.02
0.13
0.16
0.19
0.25
0.04
60
0.23
0.26
0.29
0.35
75
120
120
BLM21BB151SZ1D
BLM21BB151SZ1B
BLM21BD151SN1D
BLM21BD151SN1B
150±25
％
150±25
％
150
150
600
350
0.21
0.25
0.31
0.35
BLM21BB201SN1D
BLM21BB201SN1B
BLM21BB221SN1D
BLM21BB221SN1B
BLM21BD221SN1D
BLM21BD221SN1B
BLM21BB331SN1D
BLM21BB331SN1B
BLM21BD331SN1D
BLM21BD331SN1B
BLM21BD421SN1D
BLM21BD421SN1B
BLM21BB471SN1D
BLM21BB471SN1B
BLM21BD471SN1D
BLM21BD471SN1B
BLM21BD601SN1D
BLM21BD601SN1B
BLM21BD751SN1D
BLM21BD751SN1B
BLM21BD102SN1D
BLM21BD102SN1B
BLM21BD152SN1D
BLM21BD152SN1B
BLM21BD182SN1D
BLM21BD182SN1B
BLM21BD222SN1L
BLM21BD222SN1B
BLM21BD222TN1D
BLM21BD222TN1B
BLM21BD272SN1L
BLM21BD272SN1B
200±25
％
220±25
％
220±25%
330±25
％
330±25%
420±25%
470±25
％
470±25%
600±25%
750±25%
1000±25%
1500±25%
1800±25%
1600 min.
2200±25%
2700±25%
200
220
500
500
350
400
300
300
400
300
300
250
250
250
250
250
200
200
0.26
0.26
0.25
0.33
0.3
0.36
0.36
0.35
0.43
0.4
220
330
For
high speed
signal line
330
420
0.3
0.4
470
0.40
0.35
0.35
0.4
0.50
0.45
0.45
0.5
470
600
750
1000
1500
1800
2250
2200
2700
0.4
0.5
0.45
0.5
0.55
0.6
0.6
0.7
0.6
0.7
0.8
0.9
MURATA MFG.CO., LTD.
Total page 3/16
P.3/11
Spec. No. JENF243A-0005Z-01
Reference Only
Impedance (
Ω
)
(at 100MHz,Under Standard
Testing Condition)
DC Resistance
(
Ω
) max.
Initial Values
Values After
Testing
Customer
Part Number
MURATA
Part Number
Rated Current
(mA)
Remark
Typical
BLM21AG121SN1D
BLM21AG121SN1B
BLM21AG151SN1D
BLM21AG151SN1B
BLM21AG221SN1D
BLM21AG221SN1B
BLM21AG331SN1D
BLM21AG331SN1B
BLM21AG471SN1D
BLM21AG471SN1B
BLM21AG601SN1D
BLM21AG601SN1B
BLM21AG102SN1D
BLM21AG102SN1B
120±25
％
150±25
％
220±25
％
330±25
％
470±25
％
600±25
％
1000±25
％
120
150
220
330
470
600
1000
1000
1000
900
800
700
700
600
0.09
0.09
0.12
0.15
0.18
0.2
0.19
0.19
0.22
0.25
0.28
0.3
For
general
use
0.27
0.37
•
Operating Temperature : -55°C to +125°C
•
Storage Temperature
: -55°C to +125°C
85℃
(Note)As for Rated current marked with *1,
Rated Current is derated as right figure
depending on the operating temperature.
12
5
℃
0
85
125
Operating Temperature (°C)
4. Style and Dimensions
L
W
■
Equivalent Circuit
T
E
Resistance element becomes
dominant at high frequencies.
(
)
:Electrode
■
Unit Mass (Typical value)
0.010g
0.014g ( for 21BD222SN1
□
/21BD272SN1
□
)
L
W
T
E
0.85±0.2
for 21BD222SN1
0.5±0.2
□
2.0±0.2 1.25±0.2
21BD272SN1
□
for 21BD272SN1
□
1.25±0.2
0.3±0.2
(in mm)
5. Marking
No marking.
6.Standard Testing Conditions
<
Unless otherwise specified
>
Temperature : Ordinary Temp. (15 °C to 35 °C )
<
In case of doubt
>
Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0005Z-01
P.4/11
Reference Only
7. Specifications
7-1.Electrical Performance
No.
Item
Specification
Test Method
Measuring Frequency : 100MHz±1MHz
Measuring Equipment :
Impedance
Meet item 3.
7-1-1
KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
Measuring Equipment : Digital multi meter
7-1-2 DC
Resistance
Meet item 3.
* Except
resistance of the Substrate and Wire
7-2. Mechanical Performance
No.
Item
Specification
Test Method
7-2-1 Appearance
and
Dimensions
Meet item 4.
Visual Inspection and measured with Slide Calipers.
It shall be soldered on the substrate.
Applying Force(F) : 9.8N
Applying Time : 5s±1s
7-2-2 Bonding
Strength
Meet Table 1.
Table 1
Applied
direction:Parallel to substrate
Appearance No
damage
Impedance
Side view
Ｆ
Change
Within ±30%
Ｆ
(at 100MHz)
DC
Resistance
R0.5
Meet item 3.
Substrate
7-2-3 Bending
Strength
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm
×
40mm
×
1.6mm
Deflection: 1.0mm
Speed of Applying Force : 0.5mm/s
Pressure jig
Keeping Time : 30s
R340
F
Deflection
Product
45mm
45mm
7-2-4 Vibration
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
Pre-Heating : 150°C
±
10°C, 60s
～
90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition
for 48h±4h.
7-2-5 Resistance
to Soldering
Heat
Meet Table 2.
Table 2
Appearance
Impedance
Change
No damage
Within ±30%
(for BLM21SN
(at 100MHz)
Within ±50%)
DC
Meet item 3.
Resistance
7-2-6 Drop
Products shall be no failure
after tested.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction(Total 9 times)
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C
±
10°C, 60s
～
90s
Solder : Sn-3.0Ag-0.5Cu
7-2-7 Solderability
The electrodes shall be at
least 95% covered with new
solder coating.
Solder Temperature : 240°C±5°C
Immersion Time : 4s±1s
Immersion and emersion rates : 25mm/s
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0005Z-01
P.5/11
Reference Only
7-3. Environmental Performance
It shall be soldered on the substrate.
No. Item
Specification
Meet Table 2.
Test Method
7-3-1 Temperature
Cycle
1 cycle :1 step : -55
°
C(+0
°
C,-3
°
C) / 30min±3min
2 step : Ordinary temp. / 10min to 15min
3 step : +125
°
C(+3
°
C,-0
°
C) / 30min±3min
4 step : Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition for 48h±4h.
Temperature : 40°C±2°C
Humidity : 90%(RH) to 95%(RH)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : 125°C±3°C
7-3-2 Humidity
7-3-3 Heat
Life
(in case of Rated current is more than 1A,
do the test at : +85
°
C±3°C)
Applying Current : Rated Current
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
7-3-4 Cold
Resistance
Temperature : -55°C±2°C
Time : 1000h(+48h,-0h)
Total page 6/16
Then measured after exposure in the room condition for 48h±4h.
8. Specification of Packaging
8-1. Appearance and Dimensions
Appearance and Dimensions
Part Number
Type
a
Plastic Tape
a
2.0±0.05
4.0±0.1
BLM21
except
8mm-
wide
1.
5
+0.1
4.0±0.1
φ
-0
0.2±0.1
Paper Tape
1.1
21BD222SN1L
21BD272SN1L
Paper max.
tape
8mm-
1.45±0.1
a
BLM21BD222SN1L wide
1.3
Direction of feed
BLM21BD272SN1L Plastic
±0.1
tape
There are holes in the cavity
of the Plastic tape
1.
0
+0.3
φ
-0
*
Dimension of the Cavity is measured at the bottom side.
(in mm)
Paper tape
Plastic tape
Taping
Products shall be packaged in the cavity of the base
Products shall be packaged in the each embossed
tape of 8mm-wide, 4mm-pitch continuously and
sealed by top tape and bottom tape.
cavity of 8mm-wide, 4mm-pitch plastic tape
continuously and sealed by cover tape.
Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
Spliced point
The base tape and top tape have no spliced point.
The cover tape has no spliced point.
－
Cavity
There shall not be burr in the cavity.
Missing
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
components and
are not continuous. The specified quantity per reel is kept.
number
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0005Z-01
P.6/11
Reference Only
8-2. Tape Strength
(1)
Pull Strength
Top tape
Bottom tape
Paper tape
Plastic tape
5N min.
Plastic tape
Cover tape
5N min.
10N min.
(2
)
Peeling off force of Top tape
･
Cover tape
Speed of Peeling off
300mm/min
0.1N to 0.6N
0.2N to 0.7N
Paper tape
Peeling off force
*
Plastic tape
*
Minimum value is typical.
•
Case of Paper tape
•
Case of Plastic tape
Top tape
165 to 180 degree
F
165 to 180 degree
F
Cover tape
Plastic tape
Bottom tape
Base tape
8-3. Taping Condition
(1) Standard quantity per reel
Type
Quantity per 180mm reel
4000 pcs. / reel
BLM21(except 21BD222SN1L/21BD272SN1L)
BLM21BD222SN1L/BLM21BD272SN1L
3000 pcs. / reel
(2) There shall be leader-tape (cover tape/top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more
than 5 pitch.
(4) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(
∗
1) , RoHS marking(
∗
2), Quantity, etc)
∗
1) « Expression of Inspection No. »
□□
OOOO
×××
(1) (2) (3)
(1)
Factory Code
(2)
Date
First digit
: Year
/ Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
Third, Fourth digit : Day
(3)
Serial No.
∗
2) « Expression of RoHS marking »
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (
∗
2) ,Quantity, etc)
(6) Dimensions of reel and taping(leader-tape, trailer-tape)
Trailer
Leader
160 min.
2.0±0.5
Label
190 min.
210 min.
Top tape
Cover tape
Plastic tape
Paper tape
･･･
･･･
Empty tape
φ
13.0±0.2
φ
6
0
+1
–
0
Direction of feed
φ
21.0±0.8
+1
-0
9.0
13.0±1.4
+0
φ
180
-3
(in mm)
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0005Z-01
P.7/11
Reference Only
8-4. Specification of Outer Case
Outer Case Dimensions
Label
Standard Reel Quantity in Outer Case
(Reel)
(mm)
H
W
D
H
186
186
93
5
D
∗
Above Outer Case size is typical. It depends on a quantity of an
order.
W
9.
！
Caution
9-1. Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may
cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or
property.
(1) Aircraft equipment
(6) Disaster prevention / crime prevention equipment
(7) Traffic signal equipment
(8) Transportation equipment (trains,ships,etc.)
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1. Land pattern designing
•
Standard land dimensions
< BLM21 series(except BLM21PG/BLM21S type) >
Chip Ferrite Bead
c
Soldering
Flow
Reflow
a
1.1
1.2
b
3.5
2.4
c
0.95
1.25
a
b
Solder Resist
Pattern
(in mm)
< For BLM21PG/BLM21S type >
Chip Ferrite Bead
Land pad thickness
and dimension
d
Rated
Current
(A)
1.5
2
3~4
6
1~8.5
Type
18µm
35µm
1.25
1.25
1.25
3.3
70µm
1.25
1.25
2.4
6.4
–
1.25
1.25
1.25
1.65
3.4
c
d
BLM21PG
BLM21S
a
b
6.8
(in mm)
Solder Resist
Pattern
Soldering
a
b
c
Flow
Reflow
1.1
1.2
3.5
2.4
0.95
1.25
(in mm)
*The excessive heat by land pads may cause deterioration
at joint of products with substrate.
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0005Z-01
P.8/11
Reference Only
10-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux, Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100
µ
m to 200
μ
m
(2) Soldering conditions
•
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150
℃
max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100
℃
max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
•
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
(3)
soldering profile
□
Flow soldering profile
Temp.
(
℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.
(
s)
Standard Profile
Limit Profile
Pre-heating
Heating
150
℃、
60s min.
250
℃、
4
～
6s
2 times
265
℃±
3
℃
、
5s max.
Cycle of flow
2 times
□
Reflow soldering profile
Temp.
260℃
230℃
(
℃)
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s
～60
s
60s max.
90s±30s
Time.
(
s)
Standard Profile
Limit Profile
Pre-heating
150
～
180°C
、
90s
±
30s
Heating
above 220°C
、
30s
～
60s above
230°C
、
60s max.
Peak temperature
Cycle of reflow
245
±
3°C
260°C,10s
2 times
2 times
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0005Z-01
P.9/11
Reference Only
10-3. Reworking with soldering iron
•
Pre-heating: 150°C, 1 min
•
Soldering iron output: 80W max.
•
Tip diameter:
φ
3mm max.
•
Tip temperature: 350°C max.
•
Soldering time : 3(+1,-0) seconds.
•
Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
10-4. Solder Volume
Solder shall be used not to be exceed as shown below.
Upper Limit
Recommendable
t
1/3T
≦
t
≦
T
(T:Chip thickness)
Total page
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
10-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subjected to the mechanical stress for board warpage.
<Products direction>
a
Products shall be located in the sideways
b
direction (Length:a
<
b) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
>
>
D *1
B
C
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0005Z-01
P.10/11
Reference Only
(3) Mounting
Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
10-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
10-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc
(the sea breeze, Cl
2
, H
2
S, NH
3
, SO
2
, NO
2
,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-8. Resin coating
The impedance value may change and/or it may affect on the product’s performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
10-9. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/
max. Frequency:28kHz
to 40kHz
Time:5 min max.
(3) Cleaner
1.Alternative cleaner
•
Isopropyl alcohol (IPA)
2.Aqueous agent
•
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Other cleaning
Please contact us.
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0005Z-01
P.11/11
Reference Only
10-11 Storage Conditions
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
•
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
•
Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
•
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
•
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
•
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11.
!
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve
our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
