Murata-Electronics-BLM21PG121BH1D
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Spec. No.
JENF243A-9131B-01
Reference Only
P.1/9
Chip Ferrite Bead BLM21
□□□□□
BH1
□
Murata Standard
Reference Specification[AEC-Q200]
1. Scope
This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM21_BH Series
based on AEC-Q200.
2. Part Numbering
(ex.)
BL
M
(2)
21
(3)
AG
(4)
121
(5)
B
(6)
H
(7)
1
(8)
D
(9)
(1)
(1)Product ID
(2)Type
(7)Category (for Automotive Electronics)
(8)Numbers of Circuit
(3)Dimension (L×W)
(4)Characteristics
(9)Packaging
(5)Typical Impedance at 100MHz
(6)Performance
3. Rating
DC Resistance
(
Ω
) max.
(refer to below
comment)
Impedance (
Ω
)
(at 100MHz)
(refer to below comment)
ESD
Rank
Rated Current
(mA)
*
1
Customer
Part Number
MURATA
Part Number
Initial
Values
Values
After
Testing
2:2kV
6:25kV
at
at
at
Typical
85
℃
125
℃
150
℃
BLM21PG220BH1D
BLM21PG300BH1D
BLM21PG600BH1D
BLM21PG121BH1D
BLM21PG221BH1D
BLM21PG331BH1D
BLM21SP700BH1D
BLM21SP111BH1D
BLM21SP181BH1D
BLM21SP331BH1D
BLM21SP471BH1D
BLM21SP601BH1D
22±25%
20 min.
60±25%
22
30
60
120
220
330
70
110
180
330
470
600
1000
120
150
220
330
470
600
1000
–
–
–
–
–
–
3300
2300
1900
1550
1250
1000
4000
3300
2600
1900
1700
1500
1100
1000
1000
900
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
0.009
0.014
0.02
0.03
0.045
0.07
0.009
0.013
0.020
0.040
0.050
0.060
0.120
0.09
0.09
0.12
0.15
0.18
0.2
0.27
0.018
0.028
0.04
0.06
0.09
120
±
25
％
220±25%
330±25%
70±25%
110±25%
180±25%
330±25%
470±25%
600±25%
0.14
6
6000
5000
4000
2800
2500
2300
1600
–
–
–
–
–
–
–
0.012
0.016
0.025
0.051
0.063
0.074
0.144
0.19
0.19
0.22
0.25
0.28
BLM21SP102BH1D 1000±25%
BLM21AG121BH1D
BLM21AG151BH1D
BLM21AG221BH1D
BLM21AG331BH1D
BLM21AG471BH1D
BLM21AG601BH1D
120±25%
150±25%
220±25%
330±25%
470±25%
600±25%
800
700
700
600
2
0.3
0.37
BLM21AG102BH1D 1000±25%
•
Operating Temperature : -55°C to +150°C
•
Storage Temperature
: -55°C to +150°C
(Note)
As for Rated currentmarked with *1,
Rated Current is derated as below figure
depending on the operating temperature.
*BLM21AG/PG
*
BLM21SP
Rated Current
at 85
℃
Rated current
at
125
℃
Rated Current
at 125
℃
Rated current
150
℃
at
Rated Current
at 150
℃
0
125
150
0
150
85
125
Operating Temperature (°C)
Operating Temperature(
℃
)
Keep the temperature (ambient temperature
plus self-generation of heat) under 155
℃
.
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9131B-01
Reference Only
P.2/9
4. Style and Dimensions
L
W
■
Equivalent Circuit
T
E
Resistance element becomes
dominant at high frequencies.
(
)
:Electrode
■
Unit Mass (Typical value)
0.010g
L
W
T
E
2.0±0.2 1.25±0.2
0.85±0.2
0.5±0.2
(in mm)
5. Marking
No marking.
6.Standard Testing Conditions
<
Unless otherwise specified
>
Temperature : Ordinary Temp. (15
°
C to 35
°
C )
<
In case of doubt
>
Temperature : 20
°
C
±
2
°
C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7. Specifications
7-1. Electrical Performance
No.
Item
Specification
Test Method
Measuring Frequency : 100MHz±1MHz
Impedance
Meet item 3.
7-1-1
Measuring Equipment : KEYSIGHT 4991A or the equivalent
Test Fixture :KEYSIGHT 16197A or the equivalent
Measuring Equipment : Digital multi meter
7-1-2 DC
Resistance
Meet item 3.
*Except resistance
of the Substrate and Wire
7-2. Mechanical Performance (based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Murata Specification / Deviation
No
3
Stress
Test Method
1000hours at 150 deg C
Set for 24hours at room
temperature, then
measured.
High
Meet Table A after testing.
Table A
Temperature
Exposure
Appearance
Impedance
Change
No damage
Within ±30%
(at 100MHz)
DC
Resistance
Meet item 3.
4 Temperature
Cycling
1000cycles
Meet Table B after testing.
Table B
-55 deg C to +150 deg C
Set for 24hours at room
temperature, then
measured.
Appearance
Impedance
Change
No damage
Within ±50%
(at 100MHz)
DC
Resistance
Meet item 3.
5 Destructive
Per EIA469
No defects
Physical Analysis
No electrical tests
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9131B-01
AEC-Q200
Reference Only
P.3/9
Murata Specification / Deviation
Meet Table B after testing.
No
Stress
Test Method
1000hours at 85 deg C,
85%RH
7 Biased
Humidity
Apply max rated current.
8 Operational
Life
Apply 150 deg C 1000hours Meet Table B after testing.
Set for 24hours at room
If the rated current of parts exceed 10mA,
temperature, then measuredthe operating temperature should be
85 deg C
or 125 deg C.
9 External
Visual
Visual inspection
No abnormalities
No defects
10 Physical Dimension
Meet ITEM 4
（
Style and Dimensions
）
12 Resistance to Solvents
Per MIL-STD-202 Method
Not Applicable
215
13 Mechanical Shock
Per MIL-STD-202 Method
Meet Table A after testing.
213
Condition F:
1500g’s(14.7N)/0.5ms/
Half sine
14 Vibration
5g’s(0.049N) for 20 minutes
,
M
eet Table A after testing.
12cycles each of 3
orientations
Test from 10-2000Hz.
15 Resistance
Solder temperature
260C+/-5 deg C
Pre-heating:150C +/-10 deg,60s to 90s
Meet Table B after testing.
to Soldering Heat
Immersion time 10s
17 ESD
Per AEC-Q200-002
Meet Table B after testing.
ESD Rank: Refer to Item 3. Rating
Method b : Not Applicable
95% of the terminations is to be soldered.
No defects
18 Solderability
Per J-STD-002
19 Electrical
Measured : Impedance
Characterization
20 Flammability
21 Board Flex
Per UL-94
Not Applicable
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding time
Per AEC-Q200-006
Meet Table A after testing.
22 Terminal Strength
No defects
30 Electrical
Transient
Per ISO-7637-2
Not Applicable
Conduction
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9131B-01
Reference Only
P.4/9
8. Specification of Packaging
8-1. Appearance and Dimensions
2.0±0.05
1.5
+0.1
4.0±0.1
4.0±0.1
φ
-0
1.05±0.1
1.45
±
0.1
1.1 max.
(in mm)
Direction of feed
(1) Taping
Products shall be packaged in the cavity of the basetape of 8mm-wide, 4mm-pitch continuously and
sealed by top tape and bottom tape.
(2) The sprocket holes are to the right as the tape is pulled towardthe user.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
8-2. Tape Strength
Top tape
165 to 180 degree
F
(1)
Pull Strength
Top tape
5N min.
Bottom tape
Bottom tape
Base tape
(2
)
Peeling off force of Top tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
8-3. Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel: 4000 pcs. / reel
(2) There shall be leader-tape (cover tape/top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more
than 5 pitch.
(4) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(
∗
1) , RoHS marking(
∗
2) , Quantity, etc)
∗
1) « Expression of Inspection No. »
□□
OOOO
×××
(1) (2) (3)
(1)
Factory Code
(2)
Date
First digit
: Year
/ Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
Third, Fourth digit : Day
(3)
Serial No.
∗
2) « Expression of RoHS marking »
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (
∗
2) ,Quantity, etc)
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9131B-01
Reference Only
P.5/9
(6) Dimensions of reel and taping(leader-tape, trailer-tape)
Trailer
160 min.
2.0±0.5
Leader
Label
190 min.
210 min.
Top tape
Empty tape
φ
13.0±0.2
φ
6
0
+1
–
0
Direction of feed
φ
21.0±0.8
+1
-0
9.0
13.0±1.4
+0
φ
180
-3
(in mm)
8-4. Specification of Outer Case
Outer Case Dimensions
(mm)
Label
Standard Reel Quantity in Outer Case
(Reel)
H
W
D
H
186
186
93
5
D
∗
Above Outer Case size is typical. It depends on a quantity of an
order.
W
9.
！
Caution
9-1. Rating
Do not exceed maximum rated current of the product.Thermal stress may be transmitted to the product
and short/open circuit of the product or falling off the product may be occurred.
9-2. Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the
product may cause a critical failure, such as an open circuit, burnout caused by excessive
temperature rise.
Please contact us in advance in case of applying the surge current.
9-3. Fail Safe
Be sure to provide anappropriate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
9-4. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(7)Traffic signal equipment
(8)Transportation equipment (trains,ships,etc.)
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
(2)Aerospace equipment
(3)Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9131B-01
Reference Only
P.6/9
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1. Land pattern designing
•
Standard land dimensions
< BLM21AG series>
Chip Ferrite Bead
Type
BLM21AG
Soldering
Flow
Reflow
a
1.1
1.2
b
3.5
2.4
c
0.95
1.25
c
a
b
Solder Resist
Pattern
(in mm)
< BLM21PG/
SP
series >
Chip Ferrite Bead
Land pad thickness
and dimension d
Operating
Current
(A)
Type
18µm
35µm
1.25
1.25
6.8
70µm
～
2.0
1.25
2.4
–
1.25
1.25
3.4
BLM21PG
BLM21SP
c
d
～
4.0
–
(in mm)
a
b
Type
BLM21PG
/SP
Soldering
Flow
Reflow
a
1.1
1.2
b
3.5
2.4
c
0.95
1.25
Solder Resist
Pattern
(in mm)
*The excessive heat by land pads may cause
deterioration at joint of products with substrate.
10-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100
µ
m to 200
μ
m
(2) Soldering conditions
•
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150
℃
max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100
℃
max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
•
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9131B-01
Reference Only
P.7/9
(3) soldering profile
□
Flow
Temp.
(
℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.
(
s)
Standard Profile
150
℃、
60s min.
250
℃、
4
～
6s
2 times
Limit Profile
Pre-heating
Heating
265
℃±
3
℃
、
5s max.
Cycle of flow
2 times
□
Reflow soldering profile
Temp.
(
℃)
260℃
230℃
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s
～60
s
60s max.
90s±30s
Time.
(
s)
Standard Profile
Limit Profile
Pre-heating
150
～
180°C
、
90s
±
30s
Heating
above 220°C
、
30s
～
60s above
230°C
、
60s max.
Peak temperature
Cycle of reflow
245
±
3°C
260°C,10s
2 times
2 times
10-3. Reworking with soldering iron
•
Pre-heating: 150°C, 1 min
•
Soldering iron output: 80W max.
•
Tip diameter:
φ
3mm max.
•
Tip temperature: 350°C max.
•
Soldering time : 3(+1,-0) seconds.
•
Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
10-4. Solder Volume
Solder shall be used not to be exceed as shown below.
Upper Limit
Recommendable
1/3T
≦
t
≦
T
t
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9131B-01
Reference Only
P.8/9
10-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
a
Products shall be located in the sideways
b
direction (Length:a
<
b) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
D *1
B
C
>
>
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting
Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
10-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
10-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) In
the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and
etc.(the sea breeze, Cl
2
, H
2
S, NH
3
, SO
2
, NO
2
,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
MURATA MFG.CO., LTD.
Spec. No.
JENF243A-9131B-01
Reference Only
P.9/9
10-8. Resin coating
The impedance value may change and/or it may affect on the product’s performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
10-9. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/
max. Frequency:28kHz
to 40kHz
Time:5 min max.
(3) Cleaner
1.Alternative cleaner
•
Isopropyl alcohol (IPA)
2.Aqueous agent
•
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Other cleaning
Please contact us.
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10-11.Storage Conditions
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
•
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
•
Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
•
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
•
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
•
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11 .
!
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve
our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
